Flip chip image sensor package fabrication method

• US 6,571,466 B1
• Filed: 03/27/2000
• Issued: 06/03/2003
• Est. Priority Date: 03/27/2000
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Webster, Steven, Hollaway, Roy Dale
• Primary Examiner(s): Eley, Timothy V.
• Application Number:
  US09/536,830
• Time in Patent Office: 1,163 Days
• Field of Search: 298/34, 298/37, 298/41, 174/52.2, 250/208.1, 257/724, 257/680, 257/687, 257/793, 257/788, 257/795, 438/64, 438/66, 438/67
• US Class Current: 29/841
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01049 Indium [In]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01075 Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: Y10T 29/49133 : with component orienting
• CPC Class Codes: Y10T 29/49139 : by inserting component lead or terminal into base aperture
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image sensor. An aperture side of the aperture, the image sensor, and the bead define a pocket. The method further includes filling the pocket with a transparent liquid encapsulant and hardening the transparent liquid encapsulant. The hardened transparent liquid encapsulant serves as the window for the flip chip image sensor package.

Claims

1. A method comprising:

forming an aperture in a substrate;

mounting an image sensor to said substrate such that an active area of said image sensor is aligned with said aperture;

forming a bead around a periphery of said image sensor, where an aperture side of said aperture, said image sensor, and said bead define a pocket; and

filling said pocket with a liquid encapsulant.

2. The method of claim 1 wherein said substrate is one of a plurality of substrates integrally connected together in an array, said method further comprising singulating said array.

3. The method of claim 1 further comprising lining said aperture side with an edge coating.

4. The method of claim 1 wherein said mounting comprises electrically connecting a bond pad of said image sensor to a trace on a surface of said substrate.

5. The method of claim 4 further comprising forming an interconnection ball on said trace.

6. The method of claim 4 further comprising attaching a flexible conductor to said trace.

7. The method of claim 4 further comprising attaching a step up ring to said substrate.

8. The method of claim 7 wherein a first surface of said step up ring is attached to said substrate, said trace being electrically connected to a land on a second surface of said step up ring.

9. The method of claim 8 further comprising forming an interconnection ball on said land.

10. The method of claim 1 wherein said forming a bead comprises applying a material around said image sensor, wherein capillary force draws said material inwards between said image sensor and said substrate towards said active area, said material being drawn inwards up to said aperture side.

11. The method of claim 1 wherein said filling said pocket comprises dispensing said liquid encapsulant on a first surface of said image sensor.

12. The method of claim 11 wherein said liquid encapsulant is dispensed from a needle, said liquid encapsulant being dispensed in a cone-like shape having a base at said first surface of said image sensor and an apex at said needle.

13. The method of claim 12 further comprising moving said needle during said dispensing to maintain said cone-like shape of said liquid encapsulant.

14. The method of claim 1 further comprising curing said liquid encapsulant to form a window.

15. The method of claim 14 wherein said window has an exterior surface exposed to the ambient environment.

16. The method of claim 15 wherein said exterior surface comprises a central region and a peripheral region surrounding said central region, said central region being substantially planar.

17. The method of claim 16 wherein said active area is aligned with said central region.

18. The method of claim 14 wherein said active area is a receiver, transmitter or transceiver of radiation, said window being transparent to said radiation.

19. The method of claim 1 wherein said image sensor is selected from the group consisting of a CMOS image sensor device, a charge coupled device, a pyroelectric ceramic on CMOS device and an erasable programmable read-only memory device.

20. The method of claim 1 wherein said pocket is completely filled during said filling said pocket.