Information recording tag

• US 6,572,022 B2
• Filed: 01/10/2001
• Issued: 06/03/2003
• Est. Priority Date: 01/17/2000
• Status: Expired due to Term

• Current Assignee: Sony Chemicals Corp. (Dexerials Corporation)
• Original Assignee: Sony Chemicals Corp. (Dexerials Corporation)
• Inventors: Suzuki, Kazuaki
• Primary Examiner(s): Lee, Diane I.
• Assistant Examiner(s): HESS, DANIEL A
• Application Number:
  US09/756,847
• Publication Number:
  US 20010008684A1
• Time in Patent Office: 874 Days
• Field of Search: 235/487, 235/492, 283/98, 283/99, 283/100, 283/101, 283/81
• US Class Current: 235/492
• CPC Class Codes: G06K 19/04 characterised by the shape
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/24826 Spot bonds connect components

Abstract

An information recording tag contains:

an IC module in which a resonance circuit and an IC chip 3 are packaged on a substrate 1 where the resonance circuit has an antenna coil 2 and a film condenser 5; and

an adhesive 17 that is applied to the IC module in order to adhere said IC module onto an adherend, wherein an empty portion 18 that is adhesive-free has been formed in the adhesive 17 so as to distinguish an area on the IC module where the area contains the film condenser 5 from other areas on the IC module.

Claims

1. An information recording tag comprising:

an IC module in which a resonance circuit and an IC chip are packaged on a substrate where the resonance circuit has an antenna coil and a film condenser; and

an adhesive that is applied to the IC module in order to adhere said IC module onto an adherend, wherein an empty portion that is adhesive-free has been formed in the adhesive so as to distinguish an area on the IC module where the area contains the film condenser from other areas on the IC module.

2. The information recording tag of claim 1, wherein the film condenser is a mica condenser.

3. The information recording tag of claim 1, wherein the empty portion that is adhesive-free is formed from a pre-printed pattern of adhesive.

4. The information recording tag of claim 1 wherein the empty portion that is adhesive-free is formed by a half cut of an adhesive layer to be allowed to adhere to the IC module.

5. The information recording tag of claim 2, wherein the empty portion that is adhesive-free is formed from a pre-printed pattern of adhesive.

6. The information recording tag of claim 2, wherein the empty portion that is adhesive-free is formed by a half cut of an adhesive layer to be allowed to adhere to the IC module.