Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

• US 6,572,440 B2
• Filed: 02/13/2001
• Issued: 06/03/2003
• Est. Priority Date: 08/31/1999
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Moore, Scott E.
• Primary Examiner(s): RACHUBA, MAURINA T
• Application Number:
  US09/782,902
• Publication Number:
  US 20010006872A1
• Time in Patent Office: 840 Days
• Field of Search: 451/59, 451/10, 451/41, 451/56, 451/285-290, 451/443, 451/444
• US Class Current: 451/5
• CPC Class Codes: B24B 49/006 taking regard of the speed
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24B 53/12 Dressing tools; Holders therefor

Abstract

A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Claims

1. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:

a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface;

a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;

a sensor coupled to the conditioning body to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium and;

a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the frictional force.

2. The apparatus of claim 1 wherein the planarizing medium includes a polishing pad.

3. The apparatus of claim 1 wherein the conditioning body has a conditioning surface generally parallel to the planarizing surface.

4. The apparatus of claim 1 wherein the conditioning body includes abrasive elements for abrading the planarizing surface of the planarizing medium.

5. The apparatus of claim 1 wherein the sensor includes a force sensor.

6. The apparatus of claim 1, further comprising an electric actuator coupled to the conditioning body to rotate the conditioning body relative to the polishing pad, wherein the sensor includes a current sensor coupled to the actuator to detect an electric current drawn by the actuator.

7. The apparatus of claim 1, further comprising an actuator coupled to the conditioning body for controlling at least one of a position of the conditioning body and an approximately normal force between the conditioning body and the planarizing medium, the actuator being coupled to the sensor to receive signals from the sensor and adjust the one of the position and the approximately normal force in response to the signal.

8. An apparatus for measuring forces during conditioning of a chemical-mechanical planarizing surface, comprising:

a planarizing medium having a planarizing surface for removing material from a microelectronic substrate, the planarizing surface defining a planarizing surface plane;

a conditioning body adjacent to the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium for conditioning the planarizing surface, the conditioning body and the planarizing medium generating a force in the planarizing surface plane when the one of the conditioning body and the planarizing medium moves relative to the other of the conditioning body and the planarizing medium;

a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;

a sensor operatively coupled to the conditioning body to detect the force and;

a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the drag force.

9. The apparatus of claim 8 wherein the planarizing medium includes a polishing pad.

10. The apparatus of claim 8 wherein the conditioning body has a conditioning surface generally parallel to the planarizing surface.

11. The apparatus of claim 8 wherein the conditioning body is rotatable relative to the planarizing medium.

12. The apparatus of claim 8 wherein the conditioning body is translatable relative to the planarizing medium.

13. The apparatus of claim 8 wherein the planarizing medium is rotatable relative to the conditioning body.

14. The apparatus of claim 8 wherein the sensor includes a force sensor.

15. The apparatus of claim 8, further comprising a feedback device coupled to the sensor and the conditioning body for changing at least one of the force between the conditioning body and the polishing pad and a position of the conditioning body relative to the polishing pad in response to a signal from the sensor.

16. An apparatus for monitoring conditioning of a planarizing medium used for chemical-mechanical planarization of a microelectronic substrate, comprising:

a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, at least one of the conditioning body and the planarizing medium being movable relative to the other of the conditioning body and the planarizing medium to condition the planarizing surface, the conditioning body generating a drag force generally parallel to the planarizing surface;

a first support member having first and second ends and being rotatably coupled toward the first end to the conditioning body, the second end of the first support member extending away from the conditioning body;

a sensor coupled to the support assembly to detect the drag force;

a second support member coupled at a pivotable coupling to the first support member toward the second end of the first support member, the sensor being positioned between the first and second support members, the first support member being pivotable relative to the second support member to transmit a force to the sensor corresponding to the drag force;

an actuator coupled to the conditioning body with a support assembly to control at least one of a generally normal force between the conditioning body and the planarizing medium and a position of the conditioning body relative to the planarizing medium; and

a feedback device coupled to the actuator to control activation of the actuator in response to a signal received from the force sensor.

17. The apparatus of claim 16 wherein the feedback device includes a microprocessor.

18. The apparatus of claim 16 wherein the actuator is positioned to move the conditioning body laterally over the planarizing surface.

19. The apparatus of claim 16 wherein the actuator is positioned to rotate the conditioning body in a generally circular motion over the planarizing surface.

20. The apparatus of claim 16 wherein the planarizing medium includes a polishing pad.

21. The apparatus of claim 16 wherein the sensor includes a force sensor.

22. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:

moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein moving at least one of the conditioning body and the planarizing medium includes rotating the conditioning body relative to the planarizing medium with an electric motor; and

monitoring the conditioning body to detect a force of the planarizing medium on the conditioning body;

wherein detecting the force includes detecting an electrical current drawn by the motor.

23. The method of claim 22 wherein monitoring the conditioning body includes detecting a frictional force on the conditioning body in a plane generally parallel to a plane of the planarizing surface.

24. The method of claim 22, further comprising removing material from the planarizing medium while at least one of the conditioning body and the planarizing medium moves relative to the other of the conditioning body and the planarizing medium.

25. The method of claim 22, further comprising adjusting a force applied to the conditioning body approximately normal to the planarizing surface in response to detecting a force of the planarizing medium on the conditioning body.

26. The method of claim 22 wherein moving at least one of the planarizing medium and the conditioning body includes rotating the planarizing medium at a variable rate as the conditioning body moves across the planarizing medium to maintain a relative velocity between the planarizing medium and the conditioning body at an approximately constant value.

27. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, the method comprising:

coupling a sensor to a conditioning body;

engaging the conditioning body with the planarizing medium and moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium while the conditioning body engages the planarizing medium, wherein moving at least one of the conditioning body and the planarizing medium includes rotating the conditioning body relative to the planarizing medium with an electric motor; and

monitoring the conditioning body to detect a frictional force between the conditioning body and the planarizing medium, wherein detecting the frictional force includes detecting an electric current drawn by the motor.

28. The method of claim 27 wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, further wherein monitoring the conditioning body includes measuring a force transmitted to the support member by the conditioning body.

29. A method for conditioning a planarizing medium used for planarizing a semiconductor substrate, the method comprising:

engaging a conditioning body with the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium;

moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium to remove material from the planarizing medium; and

maintaining an approximately constant frictional force between the conditioning body and the planarizing medium by adjusting a relative velocity between the conditioning body and the planarizing medium, wherein maintaining an approximately constant frictional force includes selecting a target frictional force, detecting a force between the conditioning body and the planarizing medium and adjusting the relative velocity until the force is approximately equal to the target frictional force, and further wherein detecting the force includes measuring a force transmitted to the support member by the conditioning body.

30. An apparatus for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:

a conditioning body having a conditioning surface configured to engage a planarizing surface of the planarizing medium, the conditioning surface being coupled to an electric actuator to rotate the conditioning body relative to the polishing pad to condition the planarizing surface; and

a current sensor coupled to the actuator to detect a frictional force in a plane of the planarizing surface, the frictional force being imparted to the conditioning body by the planarizing medium when the one of the conditioning body and the planarizing medium is moved relative to the other of the conditioning body and the planarizing medium.

31. The apparatus of claim 30 wherein the planarizing medium includes a polishing pad.

32. The apparatus of claim 30 wherein the conditioning body has a conditioning surface generally parallel to the planarizing surface.

33. The apparatus of claim 30 wherein the conditioning body includes abrasive elements for abrading the planarizing surface of the planarizing medium.

34. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:

moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium, and further wherein the support member includes a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion; and

monitoring the conditioning body to detect a force of the planarizing medium on the conditioning body, wherein monitoring the conditioning body includes measuring a force between the upwardly extending portion and the laterally extending portion with a force sensor.

35. The method of claim 34 wherein monitoring the conditioning body includes detecting a frictional force on the conditioning body in a plane generally parallel to a plane of the planarizing surface.

36. The method of claim 34 wherein moving at least one of the conditioning body and the planarizing medium includes rotating the conditioning body relative to the planarizing medium with an electric motor, further wherein detecting the force includes detecting an electrical current drawn by the motor.

37. The method of claim 34, further comprising removing material from the planarizing medium while at least one of the conditioning body and the planarizing medium moves relative to the other of the conditioning body and the planarizing medium.

38. The method of claim 34, further comprising adjusting a force applied to the conditioning body approximately normal to the planarizing surface in response to detecting a force of the planarizing medium on the conditioning body.

39. The method of claim 34 wherein moving at least one of the planarizing medium and the conditioning body includes rotating the planarizing medium at a variable rate as the conditioning body moves across the planarizing medium to maintain a relative velocity between the planarizing medium and the conditioning body at an approximately constant value.