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Multi-fluid polishing process

  • US 6,572,453 B1
  • Filed: 05/18/2000
  • Issued: 06/03/2003
  • Est. Priority Date: 09/29/1998
  • Status: Expired due to Fees
First Claim
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1. A method of polishing a substrate comprising:

  • placing a substrate, having a material to be polished, in contact with a polishing pad;

    generating relative movement between the substrate and the polishing pad, while the substrate and polishing pad are in contact, and supplying a polishing chemical and a conditioning fluid to the polishing pad while the polishing pad and substrate are in moving contact, wherein the conditioning fluid etches polishing by products comprising the material.

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