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Method and apparatus for electrochemically depositing a material onto a workpiece surface

  • US 6,572,755 B2
  • Filed: 04/11/2001
  • Issued: 06/03/2003
  • Est. Priority Date: 04/11/2001
  • Status: Expired due to Fees
First Claim
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1. An electrical deposition apparatus for depositing material onto a surface of a workpiece, said apparatus comprising:

  • a polishing surface;

    a platen comprising conductive material, said platen disposed proximate said polishing surface;

    at least one electrical conductor positioned within said polishing surface;

    an electrolyte solution adapted to contact said polishing surface and the workpiece;

    a workpiece carrier configured to carry the workpiece and press the workpiece against said polishing surface; and

    a power supply coupled to said platen and said workpiece carrier;

    wherein said power supply applies a bias across said platen and the surface of the workpiece, said bias sufficient to cause material from said electrolyte solution to deposit onto the surface of the workpiece.

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