Semiconductor device, semiconductor gate array, electro-optical device, and electronic equipment
First Claim
1. A semiconductor device, comprising:
- a supporting substrate having insulation at least at a surface thereof;
a semiconductor layer formed on the surface of the supporting substrate;
a transistor formed in the semiconductor layer, the transistor comprising a channel region of a first conductive type formed on the surface of the supporting substrate, a source region and a drain region of a second conductive type formed on the surface of the supporting substrate so as to sandwich the channel region, an insulating layer formed on the channel region, and an electrode formed on the insulating layer;
a first semiconductor region provided on the surface of the supporting substrate at least at one end in a channel width direction along both of the source region and the drain region;
a second semiconductor region of the first conductive type provided on the surface of the supporting substrate so as to sandwich the first semiconductor region by the source region and the drain region along the first semiconductor region, the second semiconductor region having an impurity concentration which is higher than that in the channel region, and the first semiconductor region having an impurity concentration which is lower than that in the source region and the drain region and is lower than that in the second semiconductor region; and
an LDD region of the second conductive type formed between the channel region and the source region and between the channel region and drain region, the first semiconductor region being a semiconductor of the second conductive type and having an impurity concentration which is the same as that in the LDD region.
2 Assignments
0 Petitions
Accused Products
Abstract
A structure is provided which suppresses a parasitic bipolar effect without decreasing the breakdown voltage at the junctions between the excessive carrier extracting region and source/drain regions of a MOS transistor for a voltage of approximately 15 volts in a semiconductor device formed on a semiconductor layer on an insulating layer. In the MOS transistor having a source tied body structure, a semiconductor regions having a low impurity concentration is formed between a regions for extracting excessive carriers and source/drain regions. Thus, the breakdown voltage at the junctions between the extracting regions and the source/drain regions is increased and a parasitic bipolar effect is suppressed without breakdown between the extracting regions and the source/drain regions.
49 Citations
20 Claims
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1. A semiconductor device, comprising:
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a supporting substrate having insulation at least at a surface thereof;
a semiconductor layer formed on the surface of the supporting substrate;
a transistor formed in the semiconductor layer, the transistor comprising a channel region of a first conductive type formed on the surface of the supporting substrate, a source region and a drain region of a second conductive type formed on the surface of the supporting substrate so as to sandwich the channel region, an insulating layer formed on the channel region, and an electrode formed on the insulating layer;
a first semiconductor region provided on the surface of the supporting substrate at least at one end in a channel width direction along both of the source region and the drain region;
a second semiconductor region of the first conductive type provided on the surface of the supporting substrate so as to sandwich the first semiconductor region by the source region and the drain region along the first semiconductor region, the second semiconductor region having an impurity concentration which is higher than that in the channel region, and the first semiconductor region having an impurity concentration which is lower than that in the source region and the drain region and is lower than that in the second semiconductor region; and
an LDD region of the second conductive type formed between the channel region and the source region and between the channel region and drain region, the first semiconductor region being a semiconductor of the second conductive type and having an impurity concentration which is the same as that in the LDD region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 19)
the supporting substrate constituting the semiconductor device according to claim 1 as a first support substrate;
a second supporting substrate facing the semiconductor layer formed on the insulating layer on the first supporting substrate; and
a liquid crystal disposed between the first supporting substrate and the second supporting substrate, and driven by transistor elements in the semiconductor layer.
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9. An electronic equipment, comprising:
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a light source;
the electro-optical device according to claim 8 that modulates light incident on the light source in response to image information; and
a projection device that projects the light modulated by the electro-optical device.
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19. A semiconductor device of claim 1, wherein the second semiconductor region is connected to a wiring via a first contact, and one of the source region and the drain region is connected to another wiring via a second contact.
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10. A semiconductor gate array, comprising:
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a supporting substrate having insulation at least at a surface thereof;
a semiconductor layer formed on the surface of the supporting substrate;
a plurality of transistors formed in the semiconductor layer, each of the transistors comprising a channel region of a first conductive type formed on the surface of the supporting substrate, a source region and a drain region of a second conductive type formed on the surface of the supporting substrate so as to sandwich the channel region, an insulating layer formed on the channel region, and an electrode formed on the insulating layer;
a first semiconductor region provided on the surface of the supporting substrate at least at one end in a channel width direction along both of the source region and the drain region;
a second semiconductor region of the first conductive type provided on the surface of the supporting substrate so as to sandwich the first semiconductor region by the source region and the drain region along the first semiconductor region, the second semiconductor region having an impurity concentration which is higher than that in the channel region, and the first semiconductor region having an impurity concentration which is lower than that in the source region and the drain region and is lower than that in the second semiconductor region; and
an LDD region of the second conductive type formed between the channel region and the source region and between the channel region and drain region, the first semiconductor region of each transistor being a semiconductor of the second conductive type and having an impurity concentration which is the same as that in the LDD region. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
the supporting substrate constituting the semiconductor gate array according to claim 15 as a first supporting substrate;
a second supporting substrate facing the semiconductor layer formed on the insulating layer on the first supporting substrate; and
a liquid crystal disposed between the first supporting substrate and the second supporting substrate, and driven by transistor elements in the semiconductor layer.
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18. An electronic equipment, comprising:
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a light source;
the electro-optical device according to claim 17 that modulates light incident on the light source in response to image information; and
a projection device that projects the light modulated by the electro-optical device.
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20. A semiconductor gate array, comprising:
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a supporting substrate having insulation at least at a surface thereof;
a semiconductor layer formed on the surface of the supporting substrate;
a plurality of MOS transistors formed in the semiconductor layer, each of the MOS transistors comprising a channel region of a first conductive type formed on the surface of the supporting substrate, a source region and a drain region of a second conductive type formed on the surface of the supporting substrate so as to sandwich the channel region, an insulating layer formed on the channel region, and an electrode formed on the insulating layer;
a first semiconductor region provided on the surface of the supporting substrate at least at one end in a channel width direction along both of the source region and the drain region;
a second semiconductor region of the first conductive type provided on the surface of the supporting substrate so as to sandwich the first semiconductor region by the source region and the drain region along the first semiconductor region, the second semiconductor region having an impurity concentration which is higher than that in the channel region, and the first semiconductor region having an impurity concentration which is lower than that in the source region and the drain region and is lower than that in the second semiconductor region; and
an LDD region of the second conductive type formed between the channel region and the source region and between the channel region and drain region, the first semiconductor region being a semiconductor of the second conductive type and having an impurity concentration which is the same as that in the LDD region.
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Specification