Thin film electronic device and circuit board mounting the same

• US 6,573,584 B1
• Filed: 10/27/2000
• Issued: 06/03/2003
• Est. Priority Date: 10/29/1999
• Status: Expired due to Fees

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Nagakari, Shoken, Kounushi, Shigeo, Kuwa, Shunichi
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): Sefer, Ahmed N.
• Application Number:
  US09/698,523
• Time in Patent Office: 949 Days
• Field of Search: 257/528, 257/532, 257/758, 257/773, 257/774, 257/784, 361/303, 361/306.1, 361/304, 361/305, 361/309
• US Class Current: 257/528
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

The present invention provides a thin film capacitor which comprises: a carrier substrate; a thin film element provided on the carrier substrate and having an insulating layer and a plurality of electrode layers, the thin film element including areas formed with no insulating layer; and a plurality of external terminals electrically connected to the corresponding electrode layers for receiving electrical signals of different potentials applied thereto, the plurality of external terminals being respectively provided in the areas formed with no insulating layer and bonded to the carrier substrate via the electrode layers connected thereto. The thin film capacitor according to the invention features a sufficient insulating property and a higher break down voltage.

Claims

1. A thin film electronic device comprising:

a carrier substrate;

a laminate provided on the carrier substrate, and comprising a laminate structure having an insulating layer and a plurality of electrode layers, and wherein the insulating layer defines two or more gaps;

a thin film element formed in the laminate with the insulating layer held between the electrode layers; and

a plurality of terminal electrodes electrically connected to the corresponding electrode layers and respectively provided in the gaps for receiving electrical signals of different potentials applied thereto

wherein the laminate is covered with a protective layer,

wherein the protective layer has through-holes formed therein in the gaps, and the terminal electrodes are exposed in the through-holes,

wherein the through-holes each have a diameter which gradually increases toward a surface of the protective layer apart from the electrode layers,

wherein the through-holes each have an interior surface which is linearly inclined at an angle of 15 to 60 degrees with respect to the electrode layers located below the protective layer.

2. A thin film electronic device as set forth in claim 1, wherein the terminal electrodes are each provided with an external terminal.

3. A thin film electronic device comprising:

as set forth in claim 1, wherein the through-holes in the protective layer are spaced by a predetermined distance from the insulating layer as viewed from top of the carrier substrate.

4. A thin film electronic device as set forth in claim 3, wherein the distance between the insulating layer and the through-holes in the protective layer is not smaller than 5 μ

m.

5. A thin film electronic device as set forth in claim 1, wherein the electrode layers include a lower electrode layer and an upper electrode layer, and the thin film element includes a passive element constituted by the lower electrode layer, the upper electrode layer, and the insulating layer held between the lower electrode layer and the upper electrode layer.

6. A circuit board comprising:

a base; and

a thin film electronic device as recited in claim 1, the thin film electronic device being mounted on a surface of the base and electrically connected to the base via the external terminals provided on the terminal electrodes.

7. A thin film electronic device as set forth in claims 1, wherein the terminal electrodes cover bottom faces and interior surfaces of the respective through-holes and surface portions of the protective layer around the respective through-holes.

8. A thin film electronic device as set forth in claim 1, wherein a terminal electrode metal is filled in the through-holes to serve as the terminal electrodes.

9. A thin film electronic device as set forth in claim 8, wherein the terminal electrodes cover surface portions of the protective layer around the respective through-holes.

10. A thin film electronic device as set forth in claim 1, wherein one of the electrode layers is provided on the carrier substrate and comprises:

a metal oxide layer provided on the substrate;

a metal layer provided on the metal oxide layer and composed of the same metal as contained in the metal oxide layer; and

an Au layer provided on the metal layer.

11. A thin film electronic device as set forth in claim 1, wherein the insulating layer includes a plurality of dielectric layers, and the thin film element is constituted by the plurality of dielectric layers and the plurality of electrode layers which are alternately stacked.

12. A thin film electronic device as set forth in claim 11, which includes a thin film laminate capacitor,

wherein the dielectric layers are mainly composed of a composite oxide represented by a general formula MTiO₃ (wherein M is at least one element selected from the group consisting of Ba, Sr, Ca and Pb), and the electrode layers each comprise a low-resistance layer mainly composed of Au and a Ti containing layer provided on at least one of upper and lower surfaces of the low-resistance layer.

13. A thin film electronic device which includes a thin film laminate capacitor comprising:

a carrier substrate;

a laminate provided on the carrier substrate, and comprising a laminate structure having an insulating layer and a plurality of electrode layers, and wherein the insulating layer defines two or more gaps;

a thin film element formed in the laminate with the insulating layer held between the electrode layers; and

a plurality of terminal electrodes electrically connected to the corresponding electrode layers and respectively provided in the gaps for receiving electrical signals of different potentials applied thereto

wherein the insulating layer includes a plurality of dielectric layers, and the thin film element is constituted by the plurality of dielectric layers and the plurality of electrode layers which are alternately stacked

wherein the dielectric layers each have a thickness of not greater than 200 nm,

wherein the electrode layers each have a thickness which is not greater than two-thirds of the thickness of the dielectric layer,

wherein the electrode layers are mainly composed of a metal element having a resistivity of not greater than 3×

10<sup>−

8</sup>Ω

m at 0°

C.