Method and apparatus for cleaning electronic test contacts

• US 6,573,702 B2
• Filed: 09/12/1997
• Issued: 06/03/2003
• Est. Priority Date: 09/12/1997
• Status: Expired due to Fees

• Current Assignee: New Wave Research, Inc. (MKS Instruments Incorporated)
• Original Assignee: New Wave Research, Inc. (MKS Instruments Incorporated)
• Inventors: Most, Robert A., Marcuse, Arno G., North, Edward S.
• Primary Examiner(s): KARLSEN, ERNEST F
• Application Number:
  US08/928,806
• Publication Number:
  US 20010007421A1
• Time in Patent Office: 2,090 Days
• Field of Search: 324/158.1, 324/757, 324/754, 134/1, 134/5
• US Class Current: 324/756.03
• CPC Class Codes: B08B 7/0035 by radiant energy, e.g. UV, laser, light beam or the like
• CPC Class Codes: B08B 7/0042 by laser
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips

Abstract

A method and device for cleaning an electrical contact. Semiconductor testing device. Process of manufacturing integrated circuits. The electrical contact is used for contacting an integrated circuit and accumulates debris during use. The method comprises directing electromagnetic radiation at the contact. The electromagnetic energy reacts with at least one of the contact and the debris so as to cause at least a portion of the debris on the contact to be removed. The electromagnetic radiation may comprise coherent radiation, such as electromagnetic radiation generated using a laser. The portion of the debris may comprise organic debris, aluminum oxide, polyimide, or other debris. According to one aspect of the invention, the contact comprises a conductive material and the electromagnetic radiation causes removal of the portion of the debris substantially without removal of the conductive material. According to another aspect of the invention, the electromagnetic radiation at least partially melts the conductive material. In one preferred system, the contact comprises a probe tip. In such a system the probe tip may comprise the tip of a probe needle mounted to a probe card used for testing integrated circuits.

Claims

1. A device for cleaning electrical contacts on test cards, the device comprising:

a solid state laser configured to deliver a set of pulses;

microscope optics optically coupled to the laser; and

a test card holder positioned relative to the optics allowing the set of pulses from the laser passing through the optics to be directed onto a contact on a test card positioned in the test card holder, wherein the foregoing are configured to deliver radiation from the laser at a level sufficient to at least partially melt conductive material of the test contact.

2. A method for cleaning electrical contacts on test cards, the method comprising:

obtaining a solid state laser configured to deliver a set of pulses;

optically coupling microscope optics to the laser; and

positioning a test card holder relative to the optics allowing the set of pulses from the laser passing through the optics to be directed onto a contact on a test card positioned in the test card holder; and

delivering radiation from the laser at a level sufficient to cause melting of conductive material of the test contact.