Nanotechnology for electronic and opto-electronic devices

• US 6,576,355 B2
• Filed: 05/17/2002
• Issued: 06/10/2003
• Est. Priority Date: 11/06/1998
• Status: Expired due to Term

• Current Assignee: PPG Industries Ohio Incorporated (Nouryon BV)
• Original Assignee: NanoProducts Corporation (Nouryon BV)
• Inventors: Freim, John, Avniel, Yuval, Yadav, Tapesh
• Primary Examiner(s): Le, H. Thi
• Application Number:
  US10/147,954
• Publication Number:
  US 20020168522A1
• Time in Patent Office: 389 Days
• Field of Search: 148/514, 148/516, 429/12, 427/58
• US Class Current: 148/516
• CPC Class Codes: A61L 27/06 Titanium or titanium alloys
• CPC Class Codes: B01J 12/005 carried out at high temperatures, e.g. by pyrolysis
• CPC Class Codes: B01J 12/02 for obtaining at least one reaction product which, at normal temperature, is in the solid state
• CPC Class Codes: B01J 19/0046 Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays synthesis methods per se C40B50/00
• CPC Class Codes: B01J 19/24 Stationary reactors without moving elements inside B01J19/08, B01J19/26 take precedence; with stationary particles B01J8/02
• CPC Class Codes: B01J 2219/00094 Jackets
• CPC Class Codes: B01J 2219/00135 Electric resistance heaters
• CPC Class Codes: B01J 2219/00155 using insulating materials or refractories
• CPC Class Codes: B01J 2219/00177 controlling the pH
• CPC Class Codes: B01J 2219/0018 controlling the conductivity
• CPC Class Codes: B01J 2219/00317 Microwell devices, i.e. having large numbers of wells
• CPC Class Codes: B01J 2219/00385 Printing
• CPC Class Codes: B01J 2219/0043 for direct application of reagents, e.g. through openings in a shutter
• CPC Class Codes: B01J 2219/00653 the compounds being bound to electrodes embedded in or on the solid supports
• CPC Class Codes: B01J 2219/00707 separated from the reactor apparatus
• CPC Class Codes: B01J 2219/00745 Inorganic compounds
• CPC Class Codes: B01J 2219/00747 Catalysts
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• CPC Class Codes: B22F 2999/00 : Aspects linked to processes or compositions used in powder metallurgy
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• CPC Class Codes: C04B 2111/00844 : for electronic applications
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• CPC Class Codes: C04B 2235/80 : Phases present in the sintered or melt-cast ceramic products other than the main phase
• CPC Class Codes: C04B 35/00 : Shaped ceramic products characterised by their composition porous ceramic products C04B38/00; ceramic articles characterised by particular shape, see the relevant classes, e.g. linings for casting ladles, tundishes, cups or the like B22D41/02; ceramic substrates for microelectronic semi-conductors H01L23/15; Ceramics compositions containing free metal bonded to carbides, diamond, oxides, borides, nitrides, silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides or sulfides other than as macroscopic reinforcing agents C22C; shaping of ceramics B28B; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products chemical preparation of powders of inorganic compounds C01; infiltration of sintered ceramic preforms with molten metal C04B41/51
• CPC Class Codes: C04B 35/01 : based on oxide ceramics
• CPC Class Codes: C04B 35/10 : based on aluminium oxide
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• CPC Class Codes: C04B 35/2666 : Other ferrites containing nickel, copper or cobalt
• CPC Class Codes: C04B 35/453 : based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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• CPC Class Codes: C04B 41/009 : characterised by the material treated
• CPC Class Codes: C04B 41/4539 : as a emulsion, dispersion or suspension
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• CPC Class Codes: C04B 41/89 : for obtaining at least two superposed coatings having different compositions
• CPC Class Codes: C04B 41/90 : at least one coating being a metal
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• CPC Class Codes: H01G 4/33 : Thin- or thick-film capacitors thin- or thick-film circuits H01L27/00; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L28/40
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• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract

Nanostructured non-stoichiometric materials are provided and electronic materials and their applications are discussed. More specifically, the uses of nanotechnology and nanostructured materials for electronic products.

Claims

1. A method of preparing an electronic device comprising:

providing a metal-containing substance;

converting the metal-containing substance into a non-stoichiometric non- equilibrium crystalline nanomaterial; and

processing the nanomaterial into an electronic component, wherein the domain size of the nanomaterial is confined to a dimension less than the mean free path of electrons in the material composition.

2. The method of claim 1 wherein the nanomaterial comprises a metal.

3. The method of claim 1 wherein the nanomaterial comprises a semiconductor.

4. The method of claim 1 wherein the electronic component comprises a light emitting diode (LED).

5. The method of claim 1 wherein the electronic component comprises a current converter.

6. The method of claim 1 wherein the electronic component comprises a thermistor.