Semiconductor manufacturing methods, plasma processing methods and plasma processing apparatuses
First Claim
1. A semiconductor manufacturing method comprising the steps of:
- providing a semiconductor substrate in a processing chamber;
generating a plasma in the processing chamber;
manufacturing a semiconductor substrate by carrying out processing on the semiconductor substrate by the generated plasma in the processing chamber;
detecting a foreign particle floating within one of the generated plasma and an area in proximity thereto in the processing chamber including the steps of radiating an intensity-modulated light, into the processing chamber through a radiation window provided on a wall of the processing chamber;
optically receiving a light obtained from the processing chamber through an observation window provided on the wall of the processing chamber, by a detector, and converting the received light into a first signal;
obtaining information of the floating foreign particle, by extracting from the first signal a signal component having a frequency which is the same as that of the intensity-modulated light; and
taking the manufactured semiconductor substrate outside from the processing chamber.
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Accused Products
Abstract
The present invention provides a semiconductor manufacturing method, a plasma processing method and a plasma processing apparatus for generating a plasma in a processing chamber and carrying out processing on material to be processed by using the plasma, comprising a floating-foreign-particle measuring apparatus including: a light radiating optical system for radiating a light having a desired wavelength and completing intensity modulation at a desired frequency to the processing chamber; a scattered-light detecting optical system for separating a component with the desired wavelength from scattered lights obtained from the processing chamber as a result of radiation of the light by the light radiating optical system, for optically receiving the component and for converting the component into a first signal; and a foreign-particle-signal extracting unit which separates a second signal representing foreign particle floating in the plasma or in an area in proximity to the plasma from a third signal obtained by emission of the plasma for detection of the second signal by extraction of a component with the desired frequency used for the intensity modulation from the first signal obtained from the scattered-light detecting optical system.
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Citations
22 Claims
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1. A semiconductor manufacturing method comprising the steps of:
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providing a semiconductor substrate in a processing chamber;
generating a plasma in the processing chamber;
manufacturing a semiconductor substrate by carrying out processing on the semiconductor substrate by the generated plasma in the processing chamber;
detecting a foreign particle floating within one of the generated plasma and an area in proximity thereto in the processing chamber including the steps of radiating an intensity-modulated light, into the processing chamber through a radiation window provided on a wall of the processing chamber;
optically receiving a light obtained from the processing chamber through an observation window provided on the wall of the processing chamber, by a detector, and converting the received light into a first signal;
obtaining information of the floating foreign particle, by extracting from the first signal a signal component having a frequency which is the same as that of the intensity-modulated light; and
taking the manufactured semiconductor substrate outside from the processing chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A plasma processing method comprising the steps of:
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providing a semiconductor substrate in a processing chamber;
generating a plasma in the processing chamber;
carrying out processing on the semiconductor substrate by the generated plasma in the processing chamber;
detecting a foreign particle floating within one of the generated plasma and an area in proximity thereto in the processing chamber including a step of radiating an intensity-modulated light into the processing chamber through a radiation window provided on a wall of the processing chamber;
optically receiving a light obtained from the processing chamber through an observation window provided on the wall of the processing chamber, by a detector and converting the received light into a first signal;
obtaining information of the floating foreign particle by extracting from the first signal a signal component having a frequency which is the same as that of the light intensity-modulated; and
taking the semiconductor substrate outside from the processing chamber. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A semiconductor manufacturing method comprising the steps of:
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providing a semiconductor substrate in a processing chamber;
generating a plasma in the processing chamber;
manufacturing a semiconductor substrate by carrying out processing on the semiconductor substrate by the generated plasma in the processing chamber;
detecting a foreign particle floating within one of the generated plasma and an area in proximity thereto in the processing chamber including a step of radiating an intensity-modulated light into the processing chamber through an observation window provided on a sidewall of the processing chamber;
optically receiving through the observation window a light from the processing chamber which includes scattered light generated from the floating foreign particle by a detector and converting the received light into a first signal;
obtaining information of the floating foreign particle by extracting from the first signal a signal component corresponding to the scattered light generated from the floating foreign particle; and
taking the manufactured semiconductor substrate outside from the processing chamber. - View Dependent Claims (18)
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19. A semiconductor manufacturing method comprising the steps of:
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providing a semiconductor substrate in a processing chamber;
generating a plasma in the processing chamber;
manufacturing a semiconductor substrate by carrying out processing on the semiconductor substrate by the generated plasma in the processing chamber;
detecting a foreign particle floating within one of the generated plasma and an area in proximity thereto in the processing chamber including a step of radiating an intensity-modulated light into the processing chamber through a radiation window provided on a wall of the processing chamber;
optically receiving a light from the processing chamber, which includes back scattered light generated in a backward direction to the radiation direction from the floating foreign particle, through an observation window provided on the wall of the processing chamber by a detector and converting the received light into a first signal;
obtaining information of the floating foreign particle by extracting from the first signal a signal component corresponding to the back scattered light generated in the backward direction from the floating foreign particle without being influenced by the plasma; and
taking the manufactured semiconductor outside from the processing chamber. - View Dependent Claims (20, 21, 22)
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Specification