Locking of mold compound to conductive substrate panels
First Claim
1. A panel assembly of packaged integrated circuit devices comprising:
- a conductive substrate panel having at least one array of device areas, and defining a plurality of locking passageways positioned about an inactive buffer area which surrounds the periphery of the array of device areas, said locking passageways extending inwardly from a topside of the panel toward a bottom side thereof; and
a molded cap that is molded over the panel topside to encapsulate the device areas of the array and the inactive buffer area, said molded cap further having integrally formed, conforming locking stem portions that extend into each of the locking passageways such that each of the locking stems have substantially the same shape and size as the locking passageway into which each of the locking stems extend, the locking stems configured to lock the molded cap to the substrate panel such that during singulation of the device areas, said molded cap will not separate from the substrate panel at the inactive buffer area.
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Accused Products
Abstract
A panel assembly of packaged integrated circuit devices including conductive substrate panel having an array of device areas and a plurality of locking passageways. The locking passageways are positioned about an inactive buffer area which surrounds the periphery of the array of device areas. The locking passageways extend from a topside of the panel toward a bottom side of the panel. The panel assembly also includes a molded cap that is molded over the topside of the panel to encapsulate the array of device areas and the inactive buffer area. The molded cap includes conforming locking stem portions that extend into each of the locking passageways in a manner locking the molded cap to the substrate panel such that during singulation of the device areas, the molded cap will not separate from the substrate panel at the inactive buffer area. In another aspect of the invention, a method for producing the panel assembly having the locking passageways is described. The method involves providing a conductive substrate panel having the locking passageways and applying molding material to the topside of the substrate panel such that the solidified molding material forms stems that conform to the passageways.
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Citations
21 Claims
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1. A panel assembly of packaged integrated circuit devices comprising:
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a conductive substrate panel having at least one array of device areas, and defining a plurality of locking passageways positioned about an inactive buffer area which surrounds the periphery of the array of device areas, said locking passageways extending inwardly from a topside of the panel toward a bottom side thereof; and
a molded cap that is molded over the panel topside to encapsulate the device areas of the array and the inactive buffer area, said molded cap further having integrally formed, conforming locking stem portions that extend into each of the locking passageways such that each of the locking stems have substantially the same shape and size as the locking passageway into which each of the locking stems extend, the locking stems configured to lock the molded cap to the substrate panel such that during singulation of the device areas, said molded cap will not separate from the substrate panel at the inactive buffer area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 15, 16, 19)
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8. A panel assembly for packaged integrated circuit devices having a molded cap comprising:
a conductive substrate panel having at least one array of device areas, and defining a plurality of locking passageways positioned about an inactive buffer area that peripherally surrounds the array of device areas, said locking passageways extending inwardly from a topside of the panel toward a bottom side thereof, wherein when the molded cap is molded over the panel topside to encapsulate the device areas of the array and the inactive buffer area, a conforming locking stem portion is integrally formed with the molded cap and extends into each locking passageway such that each of the locking stems have substantially the same shape and size as the locking passageway into which each of the locking stems extend, the locking stems configured to lock the molded cap to the substrate panel such that during singulation of the device areas, said molded cap will not separate from the substrate panel at the inactive buffer area. - View Dependent Claims (9, 10, 11, 17, 18, 20)
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12. A panel assembly for packaged integrated circuit devices having a molded cap comprising:
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a conductive substrate panel having at least one array of device areas, wherein each of the device areas contains a semiconductor die, a plurality of electrical contacts positioned adjacent to each respective semiconductor die, and a plurality of interconnecting wires that connect each respective semiconductor die to each adjacent respective electrical contact, wherein the conductive substrate panel is constructed such that a plurality of locking passageways are positioned around the periphery of the array of device areas, said locking passageways extending inwardly from a top side of the panel towards a bottom side thereof; and
a molded cap that is formed over the panel topside to encapsulate the device areas of the array and the inactive device area, such that the molded cap is bonded to the device area via contact with the devices and such that the molded cap is bonded to the inactive buffer area via integrally formed, conforming locking stem portions of the molded cap that extend into each of the locking passageways such that each of the locking stems have substantially the same shape and size as the locking passageway into which each of the locking stems extend, the locking stems configured to lock the molded cap to the substrate panel such that during singulation of the device areas, the edge portions of the cap will not separate from the substrate panel and the inactive buffer area. - View Dependent Claims (13, 14, 21)
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Specification