Mounting structure for an electronic component having an external terminal electrode

• US 6,576,999 B2
• Filed: 05/23/2001
• Issued: 06/10/2003
• Est. Priority Date: 07/06/2000
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Iida, Kazuhiro, Sakai, Norio
• Primary Examiner(s): Lebentritt, Michael S.
• Assistant Examiner(s): SMITH, BRADLEY
• Application Number:
  US09/863,130
• Publication Number:
  US 20020005567A1
• Time in Patent Office: 748 Days
• Field of Search: 257/730, 257/678, 331/68, 310/348
• US Class Current: 257/730
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/142 HF devices
• CPC Class Codes: H01L 2924/15159 Side view
• CPC Class Codes: H01L 2924/15162 Top view
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16251 Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/1632 Disposition
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/09181 : Notches in edge pads
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/3442 : having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/403 : Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: H05K 3/4061 : for via connections in inorganic insulating substrates

Abstract

A method for manufacturing an electronic component includes forming an aggregate electronic component including a plurality of electronic components and dividing the aggregate electronic component to separate the plurality of electronic components to form individual electronic components. Through-holes are formed in a laminated body providing an aggregate electronic component wherein via-hole conductors are arranged so as not pass through the aggregate electronic component in a thickness direction thereof, the via-hole conductors are divided by the through-holes, and each divided portion provides an external terminal electrode. Then, by dividing the laminated body along the dividing lines passing through the through-holes, a plurality of individual electronic components are produced.

Claims

1. An electronic component, comprising:

an electronic component body having first and second main surfaces opposed to each other, and side surfaces connecting said first and second main surfaces;

wherein

in said side surfaces, a plurality of grooves are arranged to have a first length and to extend from said first main surface to said second surface, in each of said grooves, a recess which has a second length that is smaller than said first length and which has an opening formed on the bottom surface of said grooves, is provided along the longitudinal direction of said grooves, and an external terminal electrode having said second length is disposed in said recess.

2. An electronic component in accordance with claim 1, wherein said second length is about 0.9 times or below as large as said first length.

3. An electronic component in accordance with claim 1, wherein, with regard to the peripheral direction of said side surfaces of said electronic component body, the length of the portion at which said groove has not been formed, is not less than about 50% of the length of the overall periphery of said side surfaces.

4. An electronic component in accordance with claim 1, wherein said external terminal electrode is arranged so as to reach said second main surface.

5. An electronic component in accordance with claim 1, wherein said external terminal electrodes are arranged so as not to reach either of said first and second main surface.

6. An electronic component in accordance with claim 1, wherein said electronic component body has a laminated structure and includes an inner circuit element.

7. An electronic component in accordance with claim 1, further comprising a surface mounted device which is mounted on at least one of said first and second main surfaces.

8. An electronic component in accordance with claim 7, further comprising a metallic cover arranged so as to cover said surface mounted device, said metallic cover having claws arranged to be disposed in at least one of said grooves and said claws are connected to at least one of said external terminal electrodes.

9. An electronic component in accordance with claim 1, wherein the electronic component comprises a high-frequency device.

10. A mounting structure of an electronic component, said mounting structure comprising an electronic component in accordance with claim 1, said electric component being mounted on a mother circuit board having connection terminals, wherein said external terminal electrodes of said electronic component and said connection terminals of said mother circuit board are connected via solder fillets and the height of said solder fillets is defined by said second length of said external terminal electrode.

11. An electronic device including an electronic component in accordance with claim 1.

12. An electronic component, comprising:

an electronic component body having first and second main surfaces opposed to each other, and side surfaces connecting said first and second main surfaces;

wherein

at least one of said first and second main surfaces is a mounting surface on which a surface mounted device is mounted;

in said side surfaces, a plurality of grooves are arranged to have a first length and to extend from said first main surface to said second surface; and

in each of said grooves, an external terminal electrode which has a second length smaller than said first length is arranged to extend in the longitudinal direction thereof.

13. An aggregate electronic component which has first and second main surfaces opposed to each other, and which is arranged so that a plurality of electronic components can be removed therefrom by dividing said aggregate electronic component in a direction that is substantially perpendicular to said main surfaces along predetermined dividing lines, said aggregate electronic component comprising:

via-hole conductors each of which has an axial direction dimension that is less than the thickness between said first and second main surfaces, and each of which is arranged to straddle said dividing line;

through-holes which pass through said first and second main surfaces, and each of which is arranged to divide said via-hole conductors; and

external terminal electrodes each defined by a divided portion of said via-hole conductor that is divided by said through-hole.

14. An aggregate electronic component in accordance with claim 13, wherein the axial direction size of said via-hole conductor is about 0.9 times or below as large as the thickness size between said first and second main surfaces.

15. An aggregate electronic component in accordance with claim 13, wherein the length of the portion where said through-hole is not provided in the said dividing lines for taking out said electronic components, is not less than about 50% of the overall length of said dividing lines for taking out said electronic components.

16. An aggregate electronic component in accordance with claim 13, further comprising a surface mounted device which is mounted on at least one of said first and second main surfaces.

17. A mounting structure of an electronic component, said mounting structure comprising an electronic component in accordance with claim 13, said electric component being mounted on a mother circuit board having connection terminals, wherein said external terminal electrodes of said electronic component and said connection terminals of said mother circuit board are connected via solder fillets and the height of said solder fillets is defined by said second length of said external terminal electrode.

18. An electronic device including an electronic component in accordance with claim 13.