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Apparatus for manufacturing semiconductor wafer

  • US 6,578,589 B1
  • Filed: 09/24/2001
  • Issued: 06/17/2003
  • Est. Priority Date: 03/31/1999
  • Status: Expired due to Fees
First Claim
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1. An apparatus for manufacturing a semiconductor wafer, comprising:

  • a cleaning equipment for performing a final cleaning processing preceding a heat processing on a semiconductor wafer substrate cut from a semiconductor single crystal;

    chamber means adapted to receive said wafer substrate after the completion of said final cleaning processing, for the purpose of waiting for or performing said heat processing on said wafer substrate;

    a transfer chamber communicating with said cleaning equipment and said chamber means, respectively;

    transfer means for transporting said wafer substrate after the completion of said final cleaning processing from said cleaning equipment to said chamber means within said transfer chamber;

    heating means for heating said wafer substrate in course of transfer within said transfer chamber to a predetermined temperature; and

    gas supply means for injecting an inert gas in the form of a laminar flow onto said wafer substrate in course of transportation within said transfer chamber in a direction tending toward said cleaning equipment side from said chamber means side of said transfer chamber.

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