Pillar connections for semiconductor chips and method of manufacture

• US 6,578,754 B1
• Filed: 04/27/2000
• Issued: 06/17/2003
• Est. Priority Date: 04/27/2000
• Status: Expired due to Term

• Current Assignee: Advanpack Solutions Pte. Ltd. (APS Investment Pte Ltd.)
• Original Assignee: Advanpack Solutions Pte. Ltd. (APS Investment Pte Ltd.)
• Inventors: Tung, Francisca
• Primary Examiner(s): Dunn, Tom
• Assistant Examiner(s): JOHNSON, JONATHAN J
• Application Number:
  US09/564,382
• Time in Patent Office: 1,146 Days
• Field of Search: 228/180.22, 228/254, 228/123.1, 228/193-195, 228/56.3, 428/403, 428/209, 428/643, 428/644, 428/570, 148/24, 106/286.2, 106/287.19, 438/613-617, 257/737-738
• US Class Current: 228/180.22
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05666 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05671 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/11901 with repetition of the same manufacturing step
• CPC Class Codes: H01L 2224/13023 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/1308 being stacked
• CPC Class Codes: H01L 2224/13082 Two-layer arrangements
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13116 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

A flip chip interconnect system comprises and elongated pillar comprising two elongated portions, one portion including copper and another portion including solder. The portion including copper is in contact with the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of α particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.

Claims

1. A semiconductor device comprising:

a semiconductor chip, and

a plurality of pillars connected to the chip, each of said pillars comprising at least two elongated portions, one portion including copper and another portion including solder, said portion including copper in contact with the semiconductor chip and having a length not less than about 50 microns.

2. The pillar of claim 1, wherein the length of the pillar is not less than about 55 microns.

3. The pillar of claim 1, wherein the length of the pillar is not less than about 100 microns.

4. The semiconductor device of claim 1, further comprising an underbump metallization layer between said semiconductor chip and said portion including copper.

5. The semiconductor device of claim 1, wherein said underbump metallization layer comprises titanium, titanium tungsten or chromium.

6. A semiconductor package, comprising:

a semiconductor chip;

one or more pillars connected to the semiconductor chip, each of said pillars comprising at least two elongated portions, one portion including copper and another portion including solder, said portion including copper in contact with the semiconductor chip and having a length not less than 50 microns; and

a substrate, to which said portion including solder is attached.

7. The package of claim 6, further comprising a copper contact layer between said portion including solder and said substrate.

8. The package of claim 6, further comprising an underfill material formed between said semiconductor chip and said substrate.

9. The package of claim 6, further comprising an underbump metallization layer between said semiconductor chip and said portion including copper.