Apparatus and methods for handling semiconductor wafers

• US 6,578,893 B2
• Filed: 10/01/2001
• Issued: 06/17/2003
• Est. Priority Date: 10/02/2000
• Status: Expired due to Fees

• Current Assignee: AJS Automation Incorporated
• Original Assignee: AJS Automation Incorporated
• Inventors: Castantini, James S., Soucy, Alan J.
• Primary Examiner(s): Kramer, Dean J.
• Application Number:
  US09/968,364
• Publication Number:
  US 20020079714A1
• Time in Patent Office: 624 Days
• Field of Search: 294/99.1, 294/99.2, 294/103.1, 294/33, 294/907, 414/935-941, 901/32-34, 901/36, 901/39, 901/46
• US Class Current: 294/99.1
• CPC Class Codes: H01L 21/68707 the wafers being placed on a robot blade, or gripped by a gripper for conveyance
• CPC Class Codes: Y10S 414/141 includes means for gripping wafer

Abstract

Disclosed are apparatus and methods used for handling semiconductor wafers or similar articles. In particular, the apparatus disclosed is capable of flexibly gripping items of various shapes and sizes in a manner that substantially reduces or eliminates the likelihood of damage thereto. The apparatus is particularly suited to being used as a robotic end effector for handling wafers using edge-gripping techniques.

Claims

1. An apparatus for handling wafers, comprising:

an end effector including at least one arm;

a unitary flexure joint; and

a force element, wherein said end effector is forced open by contact with a wafer.

2. The apparatus of claim 1, wherein the force element is an electric solenoid device.

3. The apparatus of claim 1, wherein the force element is a pneumatic actuator.

4. The apparatus of claim 1, wherein the force element is a piezoelectric actuator.

5. The apparatus of claim 1, wherein the at least one arm includes at least two fingers.

6. The apparatus of claim 1, wherein the at least one arm is arcuate.

7. The apparatus of claim 1, wherein the end effector includes a second arm.

8. The apparatus of claim 7, wherein the second arm is arcuate.

9. The apparatus of claim 8, wherein the second arm includes at least one finger.

10. The apparatus of claim 8, wherein the arms are of approximately the same length.

11. A method of handling wafers comprising the steps of:

moving an end effector into contact with a wafer; and

applying a force to the end effector, thereby causing a unitary flexure joint to flex and at least one arm of the end effector to rotate outwardly, and wherein the applied force moves the end effector around the wafer.

12. The method of claim 11, further comprising the step of actuating a force element to open the flexure joint and release the wafer.