Modular mounting arrangement and method for light emitting diodes

• US 6,578,986 B2
• Filed: 09/05/2001
• Issued: 06/17/2003
• Est. Priority Date: 06/29/2001
• Status: Expired due to Term

• Current Assignee: Permlight Products Inc
• Original Assignee: Permlight Products Inc
• Inventors: Swaris, Jagath, Van Ness, Scott
• Primary Examiner(s): O'Shea, Sandra
• Assistant Examiner(s): Tsidulko, Mark
• Application Number:
  US09/948,338
• Publication Number:
  US 20030002282A1
• Time in Patent Office: 650 Days
• Field of Search: 362/249, 362/257, 362/294, 362/373, 362/800, 362/806, 362/387, 313/113, 313/500, 313/511
• US Class Current: 362/249.06
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 17/007 with provision for shipment or storage
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 13/0404 the light source being enclosed in a box forming the character of the sign
• CPC Class Codes: G09F 13/22 electroluminescent electroluminescent light sources per se H05B33/00
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. A heat conductive adhesive tape connects the LED module to the mount surface. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.

Claims

1. A lighting system comprising:

a plurality of lighting modules adapted to be mounted on a surface of a heat conductive member, each module comprising;

a plurality of light emitting diodes (LEDs);

a plurality of electrically conductive contacts, each of the LEDs electrically communicating with at least one of the contacts in a manner so that the LEDs are configured in a series array between opposing first and second edges of the module; and

a dielectric layer having a first side and a second side, the contacts being connected to the first side;

wherein each of the modules further includes an adhesive layer adapted to fasten the module to a surface of a heat conductive member such that heat from the module is drawn into the heat conductive member through the adhesive, and wherein each of the modules includes a main body layer disposed between the dielectric layer and the adhesive layer.

2. A lighting system as in claim 1, wherein a module body comprises the contacts and dielectric layers, and a pair of flexible adhesive members extending from first and second edges of the module body for fastening the module body to a surface.

3. A lighting system as in claim 2, wherein the flexible adhesive members comprise a thermally conductive tape.

4. A lighting system as in claim 2, wherein the flexible adhesive members comprise a thermally conductive adhesive so that heat from the module is drawn into the heat conductive member through the flexible adhesive members.

5. A lighting system as in claim 1 additionally comprising a thermally conductive tape layer in thermal communication with the second side of the dielectric layer, the thermally conductive tape layer comprising the adhesive layer and being adapted to secure the module to the surface of the heat conductive member.

6. A lighting system as in claim 1, wherein the main body layer is thermally conductive.

7. A lighting system as in claim 5, wherein the tape layer comprises a thin metallic layer.

8. A lighting system as in claim 7, wherein the thin metallic layer comprises aluminum.

9. A lighting system as in claim 1, wherein the plurality of modules are electrically interconnected so that their series arrays of LEDs are arranged in an electrically parallel fashion.

10. A lighting system as in claim 9 additionally comprising a dispenser, wherein a plurality of interconnected modules are arranged within the dispenser.

11. A lighting system as in claim 10, wherein the dispenser comprises a roller, and the plurality of interconnected modules are wound about the roller in a manner so that the interconnected modules can be unwound from the roller.

12. A lighting system as in claim 10, wherein the plurality of interconnected modules are formed into a serpentine stack within the dispenser in a manner so that successive ones of the interconnected modules can be removed from the dispenser.

13. A lighting system as in claim 1, wherein a first electrically conductive power trace and a second electrically conductive power trace are disposed on the first side of the dielectric layer, a first one of the contacts is electrically connected to the first trace, and a second one of the contacts is electrically connected to the second trace, the first contact being electrically connected to a positive lead of the series array of LEDs, and the second contact being electrically connected to a negative lead of the series array of LEDs.

14. A lighting system as in claim 13, wherein the first and second power traces are elongate and arranged generally parallel to the series array of LEDs.

15. A lighting system as in claim 14, wherein flexible conductors are attached to generally opposing ends of each of the elongate first and second power traces of each module so that the first and second power traces of each module are electrically connected to the first and second power traces, respectively, of each other module.

16. A lighting system as in claim 13, wherein a plurality of modules are electrically interconnected in a manner so that the first and second power traces of a first module are connected to the first and second power traces of a second module.

17. A lighting system as in claim 16, wherein the first and second modules are connected by a first wire extending between the first traces of the modules and a second wire extending between the second traces of the modules.

18. A lighting system as in claim 16, wherein a connector is disposed on each of the first and second modules in electrical communication with the first and second traces of the respective module, and a pair of wires have a wire connector on each end of the pair of wires, the wire connectors being adapted to matingly engage the module connectors.

28. A lighting system as in claim 6, wherein the main body layer comprises metal.

29. A lighting system as in claim 28, wherein the main body layer comprises aluminum.

19. A lighting system comprising:

a plurality of lighting modules adapted to be mounted on a surface of a heat conductive member, each module comprising;

a plurality of light emitting diodes (LEDs);

a plurality of electrically conductive contacts, each of the LEDs electrically communicating with at least one of the contacts in a manner so that the LEDs are configured in a series array on the module; and

a dielectric layer supporting the contacts;

wherein the modules are electrically interconnected so that the series array of each module is electrically parallel to the series array of others of the modules; and

wherein the interconnected modules are arranged in a dispenser such that a selected portion of the interconnected modules may be successively dispensed from the dispenser and removed therefrom.

20. A lighting system as in claim 19, wherein each of the modules comprises an adhesive layer adapted to fasten the module to a surface of a heat conductive member such that heat from the module is drawn into the heat conductive member through the adhesive.

21. A lighting system as in claim 19, wherein the dispenser comprises a coil, and interconnected modules are wound about the coil.

22. A lighting system as in claim 19, wherein the dispenser comprises a container, and the interconnected modules are arranged to overlap each other within the container so as to form a serpentine stack of modules within the container.

23. A method of mounting a plurality of lighting modules on a heat conducting surface so that heat from to modules is drawn into the heat conductive surface, comprising:

providing a plurality of lighting modules that are successively electrically interconnected with one another, each module comprising;

a plurality of light emitting diodes (LEDs);

a plurality of electrically conductive contacts, each of the LEDs electrically communicating with at least one of the contacts in a manner so that the LEDs are configured in a series array; and

a dielectric layer having a first side and a second side, the contacts being connected to the first side;

wherein the series array of each module is connected in an electrically parallel fashion with the series arrays of the other modules;

providing a dispenser, the dispenser configured to contain the plurality of interconnected modules;

drawing successive modules from the dispenser; and

successively mounting the modules to the heat conductive surface using a thermally conductive tape.

24. The method of claim 23, wherein each of the modules includes an adhesive layer, and additionally comprising engaging the adhesive layer of each module with the heat conductive surface so that heat from the module is drawn into the heat conductive surface through the adhesive.

25. The method of claim 23, wherein each module comprises a thermally conductive tape layer, and the tape layer comprises a pair of flexible tape members that extend from opposing edges of the module, and additionally comprising engaging the flexible tape members with the heat conductive surface.

26. The method of claim 25, wherein the thermally conductive tape layer comprises a thin, flexible aluminum layer.

27. The method of claim 26, wherein the thermally conductive tape layer comprises a thermally conductive adhesive layer.