Polishing apparatus

• US 6,579,148 B2
• Filed: 06/11/2002
• Issued: 06/17/2003
• Est. Priority Date: 07/07/1999
• Status: Expired due to Fees

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Togawa, Tetsuji, Hirokawa, Kazuto, Wada, Yutaka, Matsuo, Hisanori, Hiyama, Hirokuni
• Primary Examiner(s): Hail, III, Joseph J.
• Assistant Examiner(s): McDonald, Shantese
• Application Number:
  US10/166,093
• Publication Number:
  US 20020151259A1
• Time in Patent Office: 371 Days
• Field of Search: 451/5, 451/10, 451/41, 451/56, 451/60, 451/286, 451/282, 451/288, 451/289, 451/443, 451/444
• US Class Current: 451/5
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 37/16 characterised by the shape of the lapping plate surface, e.g. grooved
• CPC Class Codes: B24B 49/14 taking regard of the temperature during grinding
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B24B 57/02 for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

A polishing apparatus is used for polishing a surface of a workpiece such as a semiconductor wafer or a glass substrate. The polishing apparatus comprises a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a controller for controlling the workpiece holders individually so that polishing operations of the workpiece holders are controlled independently of each other.

Claims

1. A polishing apparatus for polishing a surface of a workpiece, comprising:

a polishing table having a polishing surface thereon;

a workpiece holder for holding a workpiece and bringing a surface of the workpiece into sliding contact with said polishing surface to form a film of liquid between the surface of the workpiece and said polishing surface; and

a controller for controlling a pressure at which said workpiece holder brings the surface of the workpiece into sliding contact with said polishing surface, such that during a first polishing operation said workpiece holder presses the surface of the workpiece against said polishing surface at a first pressure and during a second polishing operation said workpiece holder presses the surface of the workpiece against said polishing surface at a second pressure to form the film of liquid between the surface of the workpiece and said polishing surface, wherein the first pressure is larger than the second pressure.

2. The polishing apparatus according to claim 1, wherein said workpiece holder is for holding the workpiece and bringing the surface of the workpiece into sliding contact with said polishing surface to form the film of the liquid between the surface of the workpiece and said polishing surface during finish polishing of the workpiece.

3. The polishing apparatus according to claim 1, further comprising:

a motor for rotating said workpiece holder; and

a detector for detecting a torque of said motor, said detector being connected to said controller.

4. The polishing apparatus according to claim 3, wherein said controller is to lower the pressure at which said workpiece holder brings the surface of the workpiece into sliding contact with said polishing surface according to the torque of said motor as detected by said detector.

6. The polishing apparatus according to claim 3, wherein said abrading plate comprises a plurality of separate abrading plate segments.

5. A polishing apparatus for polishing a surface of a workpiece, comprising:

a polishing table having a polishing surface thereon; and

a workpiece holder for holding a workpiece and bringing a surface of the workpiece into sliding contact with said polishing surface to form a film of liquid between the surface of the workpiece and said polishing surface,

wherein said workpiece holder is for holding the workpiece and bringing the surface of the workpiece into sliding contact with said polishing surface to form the film of the liquid between the surface of the workpiece and said polishing surface during finish polishing of the workpiece, and

wherein said polishing surface comprises an abrading plate mounted on said polishing table, and said abrading plate has a plurality of radial surface sectors each having a slanted surface such that said radial surface sectors provide a sawtooth-shaped cross-sectional shape in a circumferential direction.

8. The polishing apparatus according to claim 5, wherein said abrading plate comprise a plurality of separate abrading plate segments.

7. A polishing apparatus for polishing a surface of a workpiece, comprising:

a polishing table having a polishing surface thereon; and

a workpiece holder for holding a workpiece and bringing a surface of the workpiece into sliding contact with said polishing surface to form a film of liquid between the surface of the workpiece and said polishing surface,

wherein said polishing surface comprises an abrading plate mounted on said polishing table, and said abrading plate has a plurality of radial surface sectors each having a slanted surface such that said radial surface sectors provide a sawtooth-shaped cross-sectional shape in a circumferential direction.