Mechanical resistance of a single-crystal silicon wafer
First Claim
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1. A single-crystal silicon wafer having a diameter of greater than about 100 millimeters, a thickness of less than about 80 microns and a thickness variation of less than ±
- 10 microns, surfaces of the silicon wafer being free of contact with other materials.
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Abstract
The present invention relates to a method of thinning of a single-crystal silicon wafer so that the wafer has a final thickness lower than 80 μm.
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Citations
12 Claims
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1. A single-crystal silicon wafer having a diameter of greater than about 100 millimeters, a thickness of less than about 80 microns and a thickness variation of less than ±
- 10 microns, surfaces of the silicon wafer being free of contact with other materials.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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