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Electronic tag assembly and method therefor

  • US 6,580,369 B1
  • Filed: 02/29/2000
  • Issued: 06/17/2003
  • Est. Priority Date: 10/11/1995
  • Status: Expired due to Term
First Claim
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1. An electronic tag assembly, comprising:

  • a substrate having a conductive pattern disposed thereon;

    an integrated circuit die having electrical conductors disposed thereon, that directly interface with the conductive pattern on the substrate; and

    electrically non-conductive adhesive interposed between the substrate and the integrated circuit die that secures the integrated circuit die to the substrate and that maintains electrical contact between the electrical conductors and the conductive pattern, wherein the conductive pattern and the electrical conductors are devoid of transitional elements.

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