Electronic tag assembly and method therefor

• US 6,580,369 B1
• Filed: 02/29/2000
• Issued: 06/17/2003
• Est. Priority Date: 10/11/1995
• Status: Expired due to Term

• Current Assignee: Motorola Solutions, Inc.
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Loving, Sean, Eberhardt, Noel H.
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US09/515,174
• Time in Patent Office: 1,204 Days
• Field of Search: 340/572.1, 340/572.7, 340/572.8
• US Class Current: 340/572.1
• CPC Class Codes: G06K 19/0701 at least one of the integrated circuit chips comprising an arrangement for power management
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: G06K 19/07788 the antenna being of the capacitive type
• CPC Class Codes: G06K 7/0008 General problems related to the reading of electronic memory record carriers, independent of its reading method, e.g. power transfer
• CPC Class Codes: G06K 7/10069 the collision being resolved in the frequency domain, e.g. by hopping from one frequency to the other frequency hopping or spread spectrum techniques H04B7/00
• CPC Class Codes: G06K 7/10326 the antenna being of the very-near field type, e.g. capacitive
• CPC Class Codes: G08B 13/2414 using inductive tags
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2431 Tag circuit details
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83102 using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/28 : Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12033 : Gunn diode
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/325 : by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

An electronic tag assembly (100) includes a substrate (102) having an antenna pattern (104, 106) disposed thereon, an integrated circuit die (108) having electrical interface terminals (204, 206) that directly contact or interface with the antenna pattern (104, 106), and electrically non-conductive adhesive (202) interposed between the substrate and the integrated circuit die (108) that secures both together, and that maintains the integrity of the electrical interface. Preferably, a clamping force is exerted on the integrated circuit die (108) to maintain contact between the electrical terminals (204, 206) and the antenna pattern (104, 106) while the non-conductive adhesive (202) is being introduced.

Claims

1. An electronic tag assembly, comprising:

a substrate having a conductive pattern disposed thereon;

an integrated circuit die having electrical conductors disposed thereon, that directly interface with the conductive pattern on the substrate; and

electrically non-conductive adhesive interposed between the substrate and the integrated circuit die that secures the integrated circuit die to the substrate and that maintains electrical contact between the electrical conductors and the conductive pattern, wherein the conductive pattern and the electrical conductors are devoid of transitional elements.

2. The electronic tag assembly of claim 1, wherein the electrical conductors comprise projections extending from the integrated circuit die.

3. The electronic tag assembly of claim 1, wherein the conductive pattern comprises conductive ink.

4. The electronic tag assembly of claim 1, wherein the electrically non-conductive adhesive directly contacts the integrated circuit die, the conductive pattern, and the electrical conductors.

5. An electronic tag, comprising:

a substrate;

an antenna comprising first and second spaced apart conductive patterns formed on the substrate;

an integrated circuit die having first and second electrical conductors projecting therefrom, that directly interface with the first and second spaced apart conductive patterns, respectively; and

electrically non-conductive adhesive interposed around the first and second electrical conductors, and on the first and second spaced apart conductive patterns, which electrically non-conductive adhesive secures the integrated circuit die to the substrate and maintains electrical contact between the first and second spaced apart conductive pattern and the first and second electrical conductors, wherein the first and second spaced apart conductive pattern and the first and second electrical conductors are devoid of transitional elements.

6. The electronic tag of claim 5, wherein the substrate is formed from fibrous material, and conductive pattern comprises conductive ink disposed thereon.