Computer implemented method and program for automating flip-chip bump layout in integrated circuit package design

• US 6,581,189 B1
• Filed: 01/14/1998
• Issued: 06/17/2003
• Est. Priority Date: 01/14/1998
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Tain, Alexander C.
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): THOMPSON, ANNETTE M
• Application Number:
  US09/007,138
• Time in Patent Office: 1,980 Days
• Field of Search: 395/500.04, 716/3, 703/1
• US Class Current: 716/103
• CPC Class Codes: G06F 2113/18 Chip packaging
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347

Abstract

A digital computer automatically converts an input representation of a pattern of flip-chip integrated circuit interconnect bumps in a format suitable for a circuit design program into an output representation in a format suitable for a package design program. A converter program is adapted by script files to convert the input representation into an intermediate representation in a format suitable for a mechanical design program in which only a layer which includes the bumps is extracted from the input representation which can include a substantial number of layers. A mechanical design program is adapted by scripts to automatically input the intermediate representation, identify and label the interconnects, and create the output representation in which the interconnects are labeled. The mechanical design program can be further adapted by scripts to rotate, mirror and/or shrink the pattern. A package design program inputs the output representation and draws the labeled interconnects. A comparator program compares the output representation with a previously created output representation to identify differences therebetween.

Claims

1. A computer implemented method for converting an input representation of a pattern of integrated circuit interconnects in a format suitable for a circuit design program into an output representation in a format suitable for a package design program, comprising the steps of:

(a) controlling the computer to run a converter program which converts the input representation into an intermediate representation in a format suitable for a mechanical design program; and

(b) controlling the computer to run a mechanical design program which is adapted to automatically input the intermediate representation, identify and label the interconnects, and create the output representation in which the interconnects are labeled.

2. A method as in claim 1, in which the interconnects comprise flip-chip die bumps.

3. A method as in claim 1, in which:

the output representation comprises data; and

the method further comprises the step of;

(c) controlling the computer to run a package design program which draws the labeled interconnects in accordance with the data.

4. A method as in claim 1, in which:

the format of the input representation is GDSII; and

the format of the intermediate representation is DXF.

5. A method as in claim 1, further comprising the step, performed before step (b), of:

(c) providing script which adapts the mechanical design program to automatically input the intermediate representation, identify and label the interconnects, and create the output representation in which the interconnects are labeled.

6. A method as in claim 1, in which:

the input representation includes a plurality of integrated circuit layers, only one of which includes the interconnects; and

step (a) further includes extracting the layer which includes the interconnects.

7. A method as in claim 6, further comprising the steps, performed before. step (a), of:

(c) providing the converter program; and

(d) providing script which adapts the converter program to extract the layer which includes the interconnects;

in which step (a) comprises running the converter program as adapted by the script.

8. A method as in claim 1, in which the mechanical design program in step (b) is further adapted to create the output representation such that the pattern is rotated by a predetermined angle relative to the input representation.

9. A method as in claim 1, in which the mechanical design program in step (b) is further adapted to create the output representation such that the pattern is mirrored relative to the input representation.

10. A method as in claim 1, in which the mechanical design program in step (b) is further adapted to create the output representation such that a size of the output representation is smaller than a size of the input representation.

11. A method as in claim 1, further comprising the step of:

(c) controlling the computer to compare the output representation with a previously created output representation and identify a difference therebetween.

12. A digital data storage medium for storing computer software for converting an input representation of a pattern of integrated circuit interconnects in a format suitable for a circuit design program into an output representation in a format suitable for a package design program, comprising:

a converter program for controlling a computer to convert the input representation into an intermediate representation in a format suitable for a mechanical design program; and

a mechanical design program which is adapted to control the computer to automatically input the intermediate representation, identify and label the interconnects, and create the output representation in which the interconnects are labeled.

13. A medium as in claim 12, in which the interconnects comprise flip-chip die bumps.

14. A medium as in claim 12, in which:

the output representation comprises data for a package design program; and

the system further comprises a package design program which draws the labeled interconnects in accordance with the data.

15. A medium as in claim 12, in which:

the format of the input representation is GDSII; and

the format of the intermediate representation is DXF.

16. A medium as in claim 12, in which the software further comprises script which adapts the mechanical design program to automatically input the intermediate representation, identify and label the interconnects, and create the output representation in which the interconnects are labeled.

17. A medium as in claim 12, in which:

the input representation includes a plurality of integrated circuit layers, only one of which includes the interconnects; and

the converter program is adapted to extract the layer which includes the interconnects.

18. A medium as in claim 17, in which the software further comprises script which adapts the converter program to extract the layer which includes the interconnects.

19. A medium as in claim 12, in which the mechanical design program is further adapted to create the output representation such that the pattern is rotated by a predetermined angle relative to the input-representation.

20. A medium as in claim 12, in which the mechanical design program is further adapted to create the output representation such that the pattern is mirrored relative to the input representation.

21. A medium as in claim 12, in which the mechanical design program is further adapted to create the output representation such that a size thereof is smaller that a size of the input representation.

22. A medium as in claim 12, in which the software further comprises a comparator program for comparing the output representation with a previously created output representation and identifying a difference therebetween.

23. A digital data storage medium for storing software script for a computer system which converts an input representation of a pattern of integrated circuit interconnects in a format suitable for a circuit design program into an output representation in a format suitable for a package design program, the system including a converter program for controlling a computer to convert the input representation into an intermediate representation in a format suitable for a mechanical design program, and a mechanical design program, the script adapting the mechanical design program to automatically perform the steps of:

(a) inputting the intermediate representation;

(b) identifying and labeling the interconnects; and

(c) creating the output representation in which the interconnects are labeled.

24. A medium as in claim 23, in which the interconnects comprise flip-chip die bumps.

25. A medium as in claim 23, in which:

the output representation comprises data;

the system further comprises a package design program; and

the package design program draws the labeled interconnects in accordance with the data.

26. A medium as in claim 23, in which:

the format of the input representation is GDSII; and

the format of the intermediate representation is DXF.

27. A medium as in claim 23, in which:

the input representation includes a plurality of integrated circuit layers, only one of which includes the interconnects; and

the script further adapts the converter program to extract the layer which includes the interconnects.

28. A medium as in claim 27, in which the script further adapts the converter program to extract the layer which includes the interconnects.

29. A medium as in claim 23, in which the script further adapts the mechanical design program to create the output representation such that the pattern is rotated by a predetermined angle relative to the input representation.

30. A medium as in claim 23, in which the script further adapts the mechanical design program to create the output representation such that the pattern is mirrored relative to the input representation.

31. A medium as in claim 23, in which the script further adapts the mechanical design program to create the output representation such that a size of the output representation is smaller that a size of the input representation.