Apparatus and methods for modeling process effects and imaging effects in scanning electron microscopy

• US 6,581,193 B1
• Filed: 06/13/2001
• Issued: 06/17/2003
• Est. Priority Date: 06/13/2001
• Status: Expired due to Term

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: KLA-Tencor Corporation
• Inventors: McGhee, Ridge C., Ananthanarayanan, Mohan, Watts, Robert A.
• Primary Examiner(s): PHAN, TRONG Q
• Application Number:
  US09/881,451
• Time in Patent Office: 734 Days
• Field of Search: 716/1, 716/4, 716/17, 716/18, 716/21
• US Class Current: 716/52
• CPC Class Codes: G03F 1/84 Inspecting
• CPC Class Codes: G03F 7/70433 Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70616 Monitoring the printed patterns

Abstract

Disclosed are methods and apparatus for generating a test recipe for a metrology tool is disclosed. A plurality of first reference images that are designed to be used to fabricate a plurality of structures on a sample are provided. Each structure is imageable to form a plurality of target image patterns. A test recipe for use by a metrology tool in locating the structures on the sample is generated or modified. Generating or modifying the test recipe includes forming a plurality of second references images from the first reference images and associating the second reference images with the test recipe. The second reference images are formed to at least partially simulate one or more process effect(s) associated with fabricating the structures of the sample. Additionally, the second reference images may also be formed to simulate one or more imaging effects.

Claims

1. A method of generating a test recipe for a metrology tool, the method comprising:

providing a plurality of first reference images that are designed to be used to fabricate a plurality of structures on a sample, each of the plurality of structures being imageable to form a plurality of target image patterns; and

generating or modifying a test recipe for use by a metrology tool in locating the structures on the sample, wherein generating or modifying the test recipe includes forming a plurality of second references images from at least some of the first reference images and associating the second reference images with the test recipe, the second reference images being formed to at least partially simulate one or more process effect(s) associated with fabricating the structures of the sample.

2. A method as recited in claim 1, wherein the process effects include feature tapering, corner rounding, and feature shrinkage.

3. A method as recited in claim 2, wherein the process effects further include feature warping and edge roughening.

4. A method as recited in claim 1, the second reference images being formed to at least partially simulate one or more imaging effect(s) associated with obtaining the target images from the metrology tool.

5. A method as recited in claim 4, wherein the imaging effects include substrate and material contrast, edge enhancement, and scan persistence.

6. A method as recited in claim 5, wherein the imaging effects further include edge thickening and charge shadowing.

7. A method as recited in claim 2, wherein the second reference images are formed to also simulate imaging effects associated with obtaining the target images from the metrology tool.

8. A method as recited in claim 7, wherein the imaging effects include substrate and material contrast, edge enhancement, and scan persistence.

9. A method as recited in claim 8, wherein each simulated process effect and simulated imaging effect are associated with a degree parameter having a plurality of selectable values and each degree parameter value corresponds to a specific amount of the associated simulated process effect or imaging effect, the method further comprising:

for a particular process type and a particular type of metrology tool, analyzing a plurality of combinations of different degree parameter values for each processing and imaging effect to determine which combination most accurately simulates the process and imaging effects of the particular process type and the particular type of metrology tool, respectively.

10. A method as recited in claim 9, wherein the analysis is accomplished by:

analyzing a plurality of combinations of different degree parameter values for each processing effect to determine which combination most accurately simulates the process effect of the particular process type; and

analyzing a plurality of combinations of different degree parameter values for each imaging effect to determine which combination most accurately simulates the imaging effect of the particular metrology tool,

wherein the processing effect combinations are analyzed separately from the imaging effects.

11. A method as recited in claim 1, wherein the metrology tool is a scanning electron microscope designed to measure and/or inspect samples selected from a group consisting of a reticle and an integrated circuit and the structures are selected from a group consisting of integrated circuit structures, resist pattern structures utilizable for fabricating integrated circuit structures, reticle structures, and resist pattern structures utilizable for fabricating reticle structures.

12. A method as recited in claim 1, wherein locating the structures on the sample is accomplished by a pixel based search.

13. A method as recited in claim 1, wherein locating the structures on the sample is accomplished by a geometric feature based search.

14. A method as recited in claim 1, wherein locating the structures on the sample is accomplished by finding a first structure on the sample that is significantly correlated with a first one of the second reference images.

15. A method as recited in claim 1, wherein each reference image is associated with an offset value from the corresponding target image to a test structure which is to be tested and information regarding how to test the test structure.

16. A method as recited in claim 15, wherein the information includes a test structure type and a measurement type.

17. A method as recited in claim 16, wherein the test structure type specifies whether the test structure is a hole, a post, a line, or a trench and the measurement type specifies whether to measure from the inside edges or the outside edges of such test structure.

18. A computer system operable to generate a test recipe for a metrology tool, the computer system comprising:

one or more processors;

one or more memory, wherein at least one of the processors and memory are together operable to;

provide a plurality of first reference image patterns that are designed to be used to fabricate a plurality of structures on a sample, each of the plurality of structures being imageable to form a plurality of target image patterns; and

generate or modify a test recipe for use by a metrology tool in locating the structures on the sample, wherein generating or modifying the test recipe includes forming a plurality of second references images from the first reference images and associating the second reference images with the test recipe, the second reference images being formed to at least partially simulate one or more process effect(s) associated with fabricating the structures of the sample.

19. A computer system as recited in claim 18, wherein the process effects include feature tapering, corner rounding, and feature shrinkage.

20. A computer system as recited in claim 18, the second reference images being formed to at least partially simulate one or more imaging effect(s) associated with obtaining the target images from the metrology tool.

21. A computer system as recited in claim 20, wherein the imaging effects include substrate and material contrast shifting, edge enhancement, and scan persistence.

22. A computer system as recited in claim 19, wherein the second reference images are formed to also simulate imaging effects associated with obtaining the target images from the metrology tool.

23. A computer system as recited in claim 22, wherein the imaging effects include substrate and material contrast shifting, edge enhancement, and scan persistence.

24. A computer system as recited in claim 23, wherein each simulated process effect and simulated imaging effect are associated with a degree parameter having a plurality of selectable values and each degree parameter value corresponds to a specific amount of the associated simulated process effect or imaging effect, wherein at least one of the processors and memory are further adapted to:

for a particular process type and a particular type of metrology tool, analyze a plurality of combinations of different degree parameter values for each processing and imaging effect to determine which combination most accurately simulates the process and imaging effects of the particular process type and the particular type of metrology tool, respectively.

25. A computer system as recited in claim 24, wherein the analysis is accomplished by:

analyzing a plurality of combinations of different degree parameter values for each processing effect to determine which combination most accurately simulates the process effect of the particular process type; and

analyzing a plurality of combinations of different degree parameter values for each imaging effect to determine which combination most accurately simulates the imaging effect of the particular metrology tool,

wherein the processing effect combinations are analyzed separately from the imaging effects.

26. A computer system as recited in claim 18, wherein the metrology tool is a scanning electron microscope designed to measure and/or inspect samples selected from a group consisting of a reticle and an integrated circuit and the structures are selected from a group consisting of integrated circuit structures, resist pattern structures utilizable for fabricating integrated circuit structures, reticle structures, and resist pattern structures utilizable for fabricating reticle structures.

27. A computer system as recited in claim 18, wherein locating the structures on the sample is accomplished by a pixel based search.

28. A computer system as recited in claim 18, wherein locating the structures on the sample is accomplished by finding a first structure on the sample that is significantly correlated with a first one of the second reference images.

29. A computer program product for generating a test recipe for a metrology tool, the computer program product comprising:

at least one computer readable medium;

computer program instructions stored within the at least one computer readable product configured to cause a combining device to;

provide a plurality of first reference image patterns that are designed to be used to fabricate a plurality of structures on a sample, each of the plurality of structures being imageable to form a plurality of target image patterns; and

generate or modify a test recipe for use by a metrology tool in locating the structures on the sample, wherein generating or modifying the test recipe includes forming a plurality of second references images from the first reference images and associating the second reference images with the test recipe, the second reference images being formed to at least partially simulate one or more process effect(s) associated with fabricating the structures of the sample.

30. A computer program product as recited in claim 29, wherein the process effects include feature tapering, corner rounding, and feature shrinkage.

31. A computer program product as recited in claim 30, wherein the second reference images are formed to also simulate imaging effects associated with obtaining the target images from the metrology tool.

32. A computer program product as recited in claim 31, wherein the imaging effects include substrate and material contrast shifting, edge enhancement, and scan persistence.