Fine-pitch flexible connector, and method for making same

• US 6,581,276 B2
• Filed: 03/01/2001
• Issued: 06/24/2003
• Est. Priority Date: 04/04/2000
• Status: Expired due to Fees

• Current Assignee: Amerasia International Technology, Inc.
• Original Assignee: Amerasia International Technology, Inc.
• Inventors: Chung, Kevin Kwong-Tai
• Primary Examiner(s): Look, Edward K.
• Assistant Examiner(s): White, Dwayne J.
• Application Number:
  US09/797,034
• Publication Number:
  US 20010029119A1
• Time in Patent Office: 845 Days
• Field of Search: 298/30, 298/46, 298/25, 298/74, 298/78
• US Class Current: 29/825
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 7/005 with variable reactance for tuning the antenna
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 43/007 for elastomeric connecting elements
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49204 : Contact or terminal manufacturing

Abstract

A fine-pitch flexible electrical connector includes a plurality of generally parallel metal conductors in a matrix of a molecularly flexible dielectric adhesive, and may be made in various sizes and thicknesses so as to be utilized as a connector, jumper, test membrane, interposer or other electrical connection structure providing connection between two or more electronic devices and/or substrates. The connector is made by providing a number of metal conductors disposed in relation to the dielectric adhesive, such as by lamination or aggregation, and then separating individual connectors therefrom by cutting, slicing and/or otherwise separating transversely to the longitudinal direction of the conductors.

Claims

1. A method for making an electrical connection structure comprising:

providing a plurality of elongated metal conductors of an electrically-conductive metal;

placing the plurality of elongated metal conductors in generally parallel spaced-apart spatial relationship;

filling the spaces between the spaced apart elongated metal conductors with a molecularly flexible dielectric adhesive;

drying or B-staging the molecularly flexible dielectric adhesive;

whereby the plurality of elongated metal conductors are embedded in the dried or B-staged molecularly flexible dielectric adhesive; and

cutting the dried or B-staged molecularly flexible dielectric adhesive and the elongated metal conductors embedded therein in a direction transverse to the elongated direction of the elongated metal conductors.

2. The method of claim 1 wherein said cutting further comprises, subsequent to said cutting in a direction transverse to the elongated direction of the elongated metal conductors, cutting the cut dried or B-staged molecularly flexible dielectric adhesive and the elongated metal conductors embedded therein in a direction generally parallel to the elongated direction of the elongated metal conductors.

3. The method of claim 1 wherein the electrically conductive metal includes at least one of copper, aluminum, brass, bronze, nickel, tin, indium, lead, zinc, silver, gold, and combinations and alloys thereof.

4. The method of claim 1 wherein said cutting includes one of cutting, die cutting, slicing and sawing.

5. The method of claim 1 wherein said cutting includes cooling the cut dried or B-staged molecularly flexible dielectric adhesive having the elongated metal conductors therein to a temperature less than a glass transition temperature of the molecularly flexible dielectric adhesive.

6. The method of claim 1 further comprising applying a layer of oxidation-resistant electrically-conductive metal on ends of the elongated metal conductors exposed by said cutting.

7. The method of claim 6 wherein said applying includes depositing at least one layer of a noble or precious metal including silver, gold, palladium, nickel, tin, solder, and combinations and alloys thereof.

8. The method of claim 1 wherein said placing and said filling comprise:

interleaving alternating layers of the elongated metal conductor and of the molecularly flexible dielectric adhesive, and laminating the interleaved alternating layers of the elongated metal conductor and of the molecularly flexible dielectric adhesive together.

9. The method of claim 8 wherein said interleaving comprises depositing a layer of molecularly flexible dielectric adhesive on the elongated metal conductors and thereafter performing said drying or B-staging the molecularly flexible dielectric adhesive.

10. The method of claim 8 wherein said interleaving includes providing a sheet of the molecularly flexible dielectric adhesive after said drying or B-staging the molecularly flexible dielectric adhesive.

11. The method of claim 8 wherein said interleaving includes providing a sheet of dielectric polymer disposed between two layers of the molecularly flexible dielectric adhesive.

12. The method of claim 8 further comprising cutting the laminated interleaved alternating layers of the elongated metal conductor and of the molecularly flexible dielectric adhesive into at least two thin slices in a direction transverse to the elongated metal conductors, and stacking the at least two thin slices with the elongated metal conductors disposed in generally parallel relationship and with the elongated direction of the elongated metal conductors generally aligned.

13. The method of claim 12 further comprising bonding the stack of thin slices of claim 8 in side by side relationship with at least a second like stack of thin slices, said bonding including placing a layer of molecularly flexible dielectric adhesive therebetween.

14. The method of claim 13 wherein said placing a layer of molecularly flexible dielectric adhesive therebetween includes providing a sheet of dielectric polymer disposed between two layers of the molecularly flexible dielectric adhesive.

15. The method of claim 14 wherein the dielectric polymer includes polyimide, polyester, polysulfone, polyethersulfone, polypropylene, and polymer film.

16. The method of claim 8 wherein the layers of the elongated metal conductor are of greater dimension in at least one of their length and width than are the layers of the molecularly flexible dielectric adhesive, whereby at least one edge of the elongated metal layers extend beyond the edges of the molecularly flexible dielectric layers.

17. The method of claim 16 further comprising making electrical contact to the at least one edge of the elongated metal layers for electrolytically plating a precious metal or a noble metal on the elongated metal layers.

18. The method of claim 1 wherein said providing a plurality of elongated metal conductors includes providing a plurality of sheets of electrically conductive metal, and

wherein said placing the plurality of elongated metal conductors is generally parallel spaced apart relationship comprises providing a layer of molecularly flexible dielectric adhesive on the sheets of electrically conductive metal, and patterning the sheet of electrically conductive metal to form the elongated metal conductors.

19. The method of claim 18 wherein said filling the spaces includes laminating the plurality of layers of molecularly flexible dielectric adhesive having patterned elongated metal conductors thereon.

20. The method of claim 18 wherein said filling the spaces includes depositing molecularly flexible dielectric adhesive between the patterned elongated metal conductors on the layer of molecularly flexible dielectric adhesive.

21. The method of claim 18 further comprising providing at least two guide holes in at least one of the layer of molecularly flexible dielectric adhesive and the sheets of electrically conductive metal, and placing a pin in the guide holes for aligning the at least one of the layer of molecularly flexible dielectric adhesive and the sheets of electrically conductive metal with at least one of the layers of molecularly flexible dielectric adhesive having patterned elongated metal conductors thereon and a stencil or mask.

22. The method of claim 18 wherein the elongated metal conductors formed on different ones of the plurality of layers of molecularly flexible dielectric adhesive having patterned elongated metal conductors thereon have elongated metal conductors differing in at least one of width and thickness.

23. The method of claim 1 wherein said providing a plurality of elongated metal conductors of an electrically-conductive metal includes providing a plurality of elongated metal wires having a length substantially greater than a diameter thereof, and wherein said filling the spaces between the spaced apart elongated metal conductors includes coating the elongated thin metal wires with a molecularly flexible dielectric adhesive.

24. The method of claim 23 wherein the elongated metal wires include wires of at least one of copper, aluminum, brass, bronze, nickel, tin, indium, lead, zinc, silver, gold, and combinations and alloys thereof.

25. The method of claim 23 wherein said placing the plurality of elongated metal conductors in generally parallel spaced-apart spatial relationship includes bundling the coated elongated metal wires.

26. The method of claim 1 wherein said providing the plurality of elongated metal conductors comprises providing a sheet of electrically-conductive metal, and wire-bonding a plurality of electrically-conductive wires on one surface thereof in generally parallel spaced apart spatial relationship.

27. The method of claim 26 wherein said providing a plurality of elongated metal conductors includes, after said filling the spaces, removing at least that part of the sheet of electrically-conductive metal to which the electrically-conductive wires are not wire-bonded.

28. The method of claim 27 wherein said removing includes one of mechanical removal and chemical etching.

29. The method of claim 27 further comprising applying a layer of oxidation-resistant electrically-conductive metal on ends of the electrically-conductive wires exposed by at least one of said cutting and said removing.

30. The method of claim 1 further comprising placing the cut dried or B-staged molecularly flexible dielectric adhesive having the elongated metal conductors therein against an electronic device having plural contacts thereon with ones of the elongated metal conductors in electrical contact with ones of the plural contacts.

31. The method of claim 30 further comprising providing bumps of one of solder and an electrically-conductive adhesive on at least one of the elongated metal conductors and the plural contacts for making electrical connection therebetween.

32. The method of claim 30 wherein said electronic device includes one of a semiconductor wafer, a semiconductor die, a flip-chip, an electronic component, an integrated circuit, an electronic substrate, a ceramic substrate, a circuit board, and a printed wiring circuit board.

33. The method of claim 30 wherein the cut dried or B-staged molecularly flexible dielectric adhesive having the elongated metal conductors therein is utilized as one of an electrical jumper, an electrical interposer, an electrical test membrane an electrical connector, an anisotropically electrically-conductive structure and a Z-axis electrically conductive structure.

34. The electrical connection structure made in accordance with claim 1 wherein the elongated metal conductors have a thickness and a width of less than 250 μ

m.

35. The electrical connection structure made in accordance with claim 34 wherein the elongated metal conductors have a length that is at least two times the thickness or width thereof.

36. The electrical connection structure made in accordance with claim 1 wherein the elongated metal conductors have one of a thickness and a width of less than 25 μ

m.

37. The electrical connection structure made in accordance with claim 36 wherein the elongated metal conductors have a length that is at least two times the thickness or width thereof.

38. A method for making an electrical connection structure comprising:

providing a plurality of sheets of an electrically-conductive metal;

providing a plurality of layers of molecularly flexible dielectric adhesive;

drying or B-staging the molecularly flexible dielectric adhesive;

interleaving alternating layers of the sheets of electrically-conductive metal and of the layers of molecularly flexible dielectric adhesive,

laminating the interleaved alternating layers of the sheets of electrically-conductive metal and the layers of molecularly flexible dielectric adhesive together,

whereby the plurality of sheets of electrically-conductive metal are embedded in the dried or B-staged molecularly flexible dielectric adhesive;

cutting from the laminated interleaved alternating layers of the sheets of electrically-conductive metal and of the molecularly flexible dielectric adhesive at least two thin slices in a direction transverse to the sheets of electrically-conductive metal;

stacking the at least two thin slices with the cut sheets of electrically-conductive metal disposed in generally parallel relationship and with an elongated direction of the cut sheets of electrically-conductive metal generally aligned; and

cutting the dried or B-staged molecularly flexible dielectric adhesive and the cut sheets of electrically-conductive metal embedded therein in a direction transverse to the elongated direction of the cut sheets of an electrically-conductive metal.

39. The method of claim 38 wherein said providing a plurality of layers of molecularly flexible dielectric adhesive comprises depositing the layer of molecularly flexible dielectric adhesive on the sheets of electrically conductive metal conductors and thereafter performing said drying or B-staging the molecularly flexible dielectric adhesive.

40. The method of claim 38 wherein said interleaving includes stacking the sheets of electrically conductive metal having the layer of molecularly flexible dielectric adhesive thereon.

41. The method of claim 38 wherein said providing a plurality of layers of molecularly flexible dielectric adhesive includes providing a plurality of sheets of the molecularly flexible dielectric adhesive after said drying or B-staging the molecularly flexible dielectric adhesive.

42. The method of claim 38 wherein said interleaving further includes providing a sheet of dielectric polymer disposed between two layers of the molecularly flexible dielectric adhesive.

43. The method of claim 38 further comprising bonding the stack of thin slices in side by side relationship with at least a second like stack of thin slices, said bonding including providing a layer of molecularly flexible dielectric adhesive therebetween.

44. The method of claim 38 wherein the sheets of electrically conductive metal are of greater dimension in at least one of their length and width than are the layers of the molecularly flexible dielectric adhesive, whereby at least one edge of the sheets of electrically-conductive metal extend beyond the edges of the molecularly flexible dielectric layers.

45. The method of claim 38 further comprising applying a layer of oxidation-resistant electrically-conductive metal on ends of the sheets of electrically conductive metal exposed by said cutting.

46. The method of claim 38 wherein said cutting includes cooling the dried or B-staged molecularly flexible dielectric adhesive to a temperature less than a glass transition temperature of the molecularly flexible dielectric adhesive.

47. The method of claim 38 further comprising providing at least two guide holes in at least the layer of molecularly flexible dielectric adhesive, and placing a pin in the guide holes for aligning at least the layer of molecularly flexible dielectric adhesive with at least one of the layers of molecularly flexible dielectric adhesive having patterned elongated metal conductors thereon and a stencil or mask.

48. The method of claim 43 wherein said placing a layer of molecularly flexible dielectric adhesive therebetween includes providing a sheet of dielectric polymer disposed between two layers of the molecularly flexible dielectric adhesive.

49. The method of claim 48 wherein the dielectric polymer includes polyimide, polyester, polysulfone, polyethersulfone, polypropylene, and polymer film.

50. A method for making an electrical connection structure comprising:

providing a plurality of sheets of electrically conductive metal;

providing a layer of molecularly flexible dielectric adhesive on the sheets of electrically conductive metal;

drying or B-staging the molecularly flexible dielectric adhesive;

patterning the sheet of electrically conductive metal to form a plurality of generally parallel elongated metal conductors;

stacking and laminating the plurality of layers of molecularly flexible dielectric adhesive having patterned elongated metal conductors thereon together;

whereby the plurality of elongated metal conductors are embedded in the dried or B-staged molecularly flexible dielectric adhesive; and

cutting the dried or B-staged molecularly flexible dielectric adhesive and the elongated metal conductors embedded therein in a direction transverse to the elongated direction of the elongated metal conductors.

51. The method of claim 50 further comprising applying a layer of oxidation-resistant electrically-conductive metal on ends of the elongated metal conductors exposed by said cutting.

52. The method of claim 50 wherein said cutting includes cooling the dried or B-staged molecularly flexible dielectric adhesive to a temperature less than a glass transition temperature of the molecularly flexible dielectric adhesive.

53. The method of claim 50 wherein said stacking and laminating includes providing a sheet of dielectric polymer disposed between layers of the molecularly flexible dielectric adhesive.

54. The method of claim 50 further comprising depositing molecularly flexible dielectric adhesive between the patterned elongated metal conductors on the layer of molecularly flexible dielectric adhesive.

55. The method of claim 50 further comprising providing at least two guide holes in at least the layer of molecularly flexible dielectric adhesive, and placing a pin in the guide holes for aligning at least the layer of molecularly flexible dielectric adhesive with at least one of the layers of molecularly flexible dielectric adhesive having patterned elongated metal conductors thereon and a stencil or mask.

56. A method for making an electrical connection structure comprising:

providing a plurality of electrically conductive elongated metal wires having a length substantially greater than a diameter thereof;

coating the elongated thin metal wires with a molecularly flexible dielectric adhesive;

drying or B-staging the molecularly flexible dielectric adhesive;

bundling the coated elongated metal wires in generally parallel spatial relationship under suitable heat and pressure;

whereby the plurality of elongated metal wires are embedded in the dried or B-staged molecularly flexible dielectric adhesive; and

cutting the dried or B-staged molecularly flexible dielectric adhesive and the elongated metal wires embedded therein in a direction transverse to the elongated direction of the elongated metal wires.

57. The method of claim 56 wherein the elongated metal wires include wires of at least one of copper, aluminum, brass, bronze, nickel, tin, indium, lead, zinc, silver, gold, and combinations and alloys thereof.

58. The method of claim 56 wherein said cutting includes cooling the dried or B-staged molecularly flexible dielectric adhesive to a temperature less than a glass transition temperature of the molecularly flexible dielectric adhesive.

59. The method of claim 56 further comprising applying a layer of oxidation-resistant electrically-conductive metal on ends of the elongated metal conductors exposed by said cutting.

60. A method for making an electrical connection structure comprising:

providing a sheet of electrically-conductive metal;

wire-bonding a plurality of electrically-conductive wires on one surface of the sheet of electrically-conductive metal in generally parallel spaced apart spatial relationship;

filling the spaces between the spaced apart electrically-conductive wires with a molecularly flexible dielectric adhesive;

drying or B-staging the molecularly flexible dielectric adhesive;

removing at least that part of the sheet of electrically-conductive metal to which the electrically-conductive wires are not wire-bonded;

whereby the plurality of electrically-conductive wires are embedded in the dried or B-staged molecularly flexible dielectric adhesive; and

cutting the dried or B-staged molecularly flexible dielectric adhesive and the electrically-conductive wires embedded therein in a direction transverse to the elongated direction of the electrically-conductive wires.

61. The method of claim 60 wherein said removing includes one of mechanical removal and chemical etching.

62. The method of claim 60 further comprising applying a layer of oxidation-resistant electrically-conductive metal on ends of the electrically-conductive wires exposed by at least one of said cutting and said removing.