Sheet-framed IC carrier and method for producing the same

• US 6,581,840 B2
• Filed: 10/02/2001
• Issued: 06/24/2003
• Est. Priority Date: 06/23/1997
• Status: Expired due to Term

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Yoshida, Hideyo, Takeda, Mitsunori, Igarashi, Eiichi
• Primary Examiner(s): Lee, Michael G.
• Assistant Examiner(s): FUREMAN, JARED
• Application Number:
  US09/967,973
• Publication Number:
  US 20020007554A1
• Time in Patent Office: 630 Days
• Field of Search: 235/487, 235/488, 235/492, 361/736, 361/737, 361/750, 361/751, 361/764, 298/32, 298/37, 174/259, 174/260, 257/679, 257/680
• US Class Current: 235/488
• CPC Class Codes: G06K 19/07739 comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49139 by inserting component lead or terminal into base aperture

Abstract

A frame sheet comprises a core sheet, and oversheets. A recess is formed in the sheet frame. The oversheet is left in the recess in the sheet frame, and an IC carrier is mounted in the recess. The IC carrier is held, adhered to the oversheet left in the recess.

Claims

1. A method for producing a sheet-framed IC carrier comprising (1) a sheet frame having a core sheet, a fusion-preventing layer provided on a portion of the core sheet, and an oversheet provided on a surface of the core sheet, having the fusion-preventing layer, the sheet frame having a recess therein, the recess not including a portion of the oversheet, and (2) an IC carrier mounted in the sheet frame recess and held by the portion of the oversheet not included in the recess, the IC carrier having an IC module, the method comprising the steps of:

providing the core sheet;

forming the fusion-preventing layer on a portion of the core sheet corresponding to the IC carrier;

laying the oversheet on the fusion-preventing layer and the core sheet;

press-fusing the core sheet, fusion-preventing layer, and oversheet to form a sheet frame;

spot-facing the core sheet to form the recess in the sheet frame;

forming a peripheral slit in the core sheet to constitute a peripheral edge of the IC carrier; and

mounting the IC module in the sheet frame recess.

2. The method of claim 1, further comprising

providing a required print layer on the core sheet before laying the oversheet on the core sheet.

3. The method of claim 1, wherein the fusion-preventing layer is formed on a surface of the core sheet on a side of the IC module.

4. The method of claim 1, wherein the fusion-preventing layer is formed on a surface of the core sheet on an opposite side of the IC module.

5. The method of claim 1, wherein the fusion-preventing layer is formed of a solvent-free photo-setting or thermo-setting ink.