LED mounting system

• US 6,582,100 B1
• Filed: 08/09/2000
• Issued: 06/24/2003
• Est. Priority Date: 08/09/2000
• Status: Expired due to Term

• Current Assignee: Relume Technologies, Inc. (Revolution Lighting Technologies, Inc.)
• Original Assignee: Relume Corporation
• Inventors: Reber, Gregg K., Hochstein, Peter A.
• Primary Examiner(s): LEE, Y MY QUACH
• Application Number:
  US09/634,909
• Time in Patent Office: 1,049 Days
• Field of Search: 362/226, 362/234, 362/249, 362/294, 362/382, 362/396, 362/800
• US Class Current: 362/294
• CPC Class Codes: F21V 19/004 by deformation of parts or snap action mountings, e.g. using clips
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10393 Clamping a component by an element or a set of elements
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2201/10628 Leaded surface mounted device
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

An electrically driven light emitting diode (LED) assembly and the method of assembling same. The assembly includes an electrically and thermally conductive heat dissipater (10) sandwiched under an electrically insulating layer (12) with circuit traces (14) disposed over the insulating layer (12) to prevent electrical conduction between the traces (14) and the heat dissipater (10). A plurality of light emitting diodes (20) have electrical leads (22) extending laterally from opposite extremities of each LED (20) to overlie the traces (14) for electrical contact with the traces (14) for powering the LEDs (20). An independent and generally U-shaped holding device (24, 26, 28, 30 and 32), as viewed in cross section, defines a base overlying the LED (20) and a pair of legs (36, 136) depending therefrom and transversely to the electrical leads (22) between the LED (20) and the heat dissipater (10). The base defines a hole (38) and the LED (20) protrudes (39) through the hole (38) to emit light. The insulating layer (12) includes a void (40) surrounding each LED (20) and the legs (36, 136) of each associated holding device (24, 26, 28, 30 and 32) and each holding device (24, 26, 28, 30 and 32) includes a tensioning portion (44 or 48) for applying a force urging the LED (20) through the void (40) and into thermal engagement with the heat dissipater (10) and the electrical leads (22) thereof into engagement with the traces (14). The tensioning portion may comprise barbs (44) on the legs (36, 136) and/or undulations (48) in the legs (36, 136).

Claims

1. An electrically driven light emitting diode (LED) assembly comprising;

an electrically and thermally conductive heat dissipater (10),

an electrically insulating layer (12) over said heat dissipater (10),

circuit traces (14) disposed in predetermined spaced lengths over said layer (12) to prevent electrical conduction between said traces (14) and said heat dissipater (10),

a plurality of light emitting diodes (LEDs) (20) each having at least one electrical lead (22) for electrical contact with said traces (14) for powering said LEDs (20),

an independent holding device (24, 26, 28, 30 or 32) holding each of said LEDs (20) in a predetermined position on said insulating layer (12) with at least one of said electrical leads (22) thereof in electrical engagement with one of said traces (14), said device (24, 26, 28, 30 and 32) including a holding portion (34, 134) for engaging each of said LEDs (20) and a connecting portion (36, 136) connected to said heat dissipater (10) for reacting between each of said LEDs (20) and said heat dissipater (10) to urge said holding portion into engagement with each of said LEDs (20) to urge at least a portion of each of said LEDs (20) into thermal engagement with said heat dissipater (10).

2. An assembly as set forth in claim 1 including a thermal coupling (52) sandwiched between said LED (20) and said heat dissipater (10) for conducting thermal energy between said LED (20) and said heat dissipater (10).

3. An assembly as set forth in claim 2 wherein said LED (20) includes a heat sink (54) and said thermal coupling (52) is sandwiched between said heat sink (54) and said heat dissipater (10) for conducting thermal energy between said LED (20) and said heat dissipater (10).

4. An assembly as set forth in claim 1 wherein said insulating layer (12) includes a void (40) surrounding each LED (20) and associated holding device (24, 26, 28, 30 or 32).

5. An assembly as set forth in claim 1 wherein each of said holding devices (24, 26, 28, 30 and 32) includes a tensioning portion for applying a force urging said LED (20) into thermal engagement with said heat dissipater (10).

6. An assembly as set forth in claim 1 wherein each of said holding devices (24, 26, 28, 30 and 32) includes a retaining portion for retaining said LED (20) in said device (24, 26, 28, 30 or 32).

7. An assembly as set forth in claim 6 wherein said retaining portion includes at least one tang (56) in mechanical gripping engagement with said LED (20).

8. An assembly as set forth in claim 1 wherein said heat dissipater (10) presents at least one opening (42) and said connecting portion (36) extends into said opening (42) for mechanical interlocking engagement with said heat dissipater (10).

9. An assembly as set forth in claim 8 wherein said connecting portion (36) includes a barb (44) in gripping engagement with said heat dissipater (10).

10. An assembly as set forth in claim 9 wherein said heat dissipater (10) includes upper (16) and lower (18) surfaces.

11. An assembly as set forth in claim 10 wherein said opening (42) extends completely through said heat dissipater (10) and said barb (44) engages said lower surface (18) thereof.

12. An assembly as set forth in claim 10 wherein said opening (42) extends at least partially into said dissipater (10) and said barb (44) engages said opening (42) between said upper (16) and lower (18) surfaces.

13. An assembly as set forth in claim 1 wherein said heat dissipater (10) presents at least one projection (46) for retaining said connecting portion (136) to mechanically interlock with said heat dissipater (10).

14. An assembly as set forth in claim 1 wherein said electrical leads (22) extend laterally from opposite extremities of said LED (20) and overlie said traces (14).

15. An assembly as set forth in claim 14 wherein each of said holding devices (24, 26, 28, 30 and 32) includes a tensioning portion for applying a force urging said LED (20) into thermal engagement with said heat dissipater (10) and said electrical leads (22) thereof into engagement with said traces (14).

16. An assembly as set forth in claim 1 wherein said holding device (24, 26, 28, 30 and 32) includes a pair of said connecting portions (36, 136) extending in spaced relationship to one another.

17. An assembly as set forth in claim 16 wherein said holding device (26, 28, 30 or 32) includes a pair of spring arms (50) extending in opposite directions and transversely to said connecting portions (36, 136).

18. An assembly as set forth in claim 17 wherein said electrical leads (22) extend laterally from opposite extremities of said LED (20) and overlie said traces (14) and said spring arms (50) apply a force urging said electrical leads (22) thereof into engagement with said traces (14).

19. An assembly as set forth in claim 16 wherein each of said holding devices (24, 26, 28, 30 and 32) is generally U-shaped as viewed in cross section to define a base overlying said LED (20) and a pair of legs depending therefrom to define a pair of said connecting portions (36, 136).

20. An assembly as set forth in claim 19 wherein said base defines a hole (38) and said LED (20) protrudes (39) through said hole (38) to emit light.

21. An assembly as set forth in claim 20 wherein each of said legs (36, 136) includes a retaining portion for retaining said LED (20) in said holding device (24, 26, 28, 30 or 32).

22. An assembly as set forth in claim 21 wherein said retaining portion comprises at least one tang (56) in gripping engagement with said LED (20).

23. An assembly as set forth in claim 21 wherein said retaining portion comprises an undulation (48) in gripping engagement with said LED (20) to frictionally retain said LED (20) between said legs (36, 136) of said holding device (24, 26, 28, 30 and 32).

24. An assembly as set forth in claim 21 wherein said insulating layer (12) includes a void (40) surrounding each LED (20) and said legs (36) of each associated holding device (24, 26, 28 and 32).

25. An assembly as set forth in claim 24 wherein said heat dissipater (10) includes a pair of spaced openings (42) for each of said holding devices (24, 26, 28 and 32) and said legs (36) of each of said holding devices (24, 26, 28 and 30) extend into a pair of said openings (42).

26. An assembly as set forth in claim 24 wherein said electrical leads (22) extend laterally from opposite extremities of said LED (20) and transversely to said legs (36, 136) to overlie said traces (14).

27. An assembly as set forth in claim 26 wherein each of said holding devices (24, 26, 28, 30 and 32) includes a tensioning portion for applying a force urging said LED (20) into thermal engagement with said heat dissipater (10) and said electrical leads (22) thereof into engagement with said traces (14).

28. An assembly as set forth in claim 19 wherein said heat dissipater (10) presents at least one projection (46) for retaining said connecting portion to mechanically interlock with said heat dissipater (10).

29. An electrically driven light emitting diode (LED) assembly comprising;

an electrically and thermally conductive heat dissipater (10),

an electrically insulating layer (12) over said heat dissipater (10),

circuit traces (14) disposed in predetermined spaced lengths over said layer (12) to prevent electrical conduction between said traces (14) and said heat dissipater (10),

a plurality of light emitting diodes (20) each having electrical leads (22) extending laterally from opposite extremities of said LED (20) to overlie said traces (14) for electrical contact with said traces (14) for powering said LED (20),

an independent and generally U-shaped holding device (24, 26, 28, 30 and 32) as viewed in cross section to define a base overlying said LED (20) and a pair of legs (36, 136) depending therefrom and transversely to said electrical leads (22),

said base defines a hole (38) and said LED (20) protrudes (39) through said hole (38) to emit light,

said insulating layer (12) including a void (40) surrounding each LED (20), and

each of said holding devices (24, 26, 28, 30 and 32) includes a tensioning portion (44 or 48) for applying a force urging said LED (20) through said void (40) and into thermal engagement with said heat dissipater (10) and said electrical leads (22) thereof into engagement with said traces (14).

30. A method of assembling an electrically driven light emitting diode (LED) having electrical leads (22) over an electrically insulating layer (12) having circuit traces (14) disposed in predetermined spaced lengths over said insulating layer (12), the method comprising the steps of:

overlaying an electrically and thermally conductive heat dissipater (10) with the insulating layer (12),

positioning the electrical leads (22) in electrical contact with the circuit traces (14), and urging at least a portion of the LED (20) into thermal engagement with the heat dissipater (10),

mechanically holding the LED (20) in a predetermined position on the insulating layer (12) with the electrical leads (22) thereof in electrical engagement with the traces (14).

31. A method as set forth in claim 30 including sandwiching a thermal coupling (52) between the LED (20) and the heat dissipater (10) for conducting thermal energy between the LED (20) and the heat dissipater (10).

32. A method as set forth in claim 31 including disposing a heat sink (54) and the thermal coupling (52) between the heat sink (54) and the heat dissipater (10) for conducting thermal energy between the LED (20) and the heat dissipater (10).

33. A method as set forth in claim 31 including forming an opening (42) in the heat dissipater (10) and extending a holding device (24, 26, 28 and 32) into the opening (42) for reacting engagement with the heat dissipater (10).

34. A method as set forth in claim 33 including employing said heat dissipater (10) having upper (16) and lower 18 surfaces.

35. A method as set forth in claim 34 including forming the opening (42) completely through the heat dissipater (10) and engaging the lower surface (18) of the heat dissipater (10) with the holding device (24, 26 and 28).

36. A method as set forth in claim 35 including forming the opening (42) at least partially into the heat dissipater (10) and engaging the opening (42) between the upper (16) and lower (18) surfaces of the heat dissipater (10) with the holding device (24, 26 and 32).

37. A method as set forth in claim 30 including applying a force urging the LED (20) into thermal engagement with the heat dissipater (10).

38. A method as set forth in claim 30 including forming a void (40) in the insulating layer (12) surrounding each LED (20) with a holding device (24, 26, 28, 30 and 32).

39. A method as set forth in claim 38 including retaining the LED (20) in the holding device (24, 26, 28, 30 or 32).

40. A method as set forth in claim 30 including forming the heat dissipater (10) with at least one projection (46) and mechanically interlocking the projection (46) with the heat dissipater (10).

41. A method as set forth in claim 30 including positioning the electrical leads (22) extending laterally from opposite extremities of the LED (20) to overlie the traces (14).

42. A method as set forth in claim 41 including applying a force urging the LED (20) into thermal engagement with the heat dissipater (10) and the electrical leads (22) thereof into engagement with the traces (14).

43. A method as set forth in claim 42 including surrounding each generally U-shaped cross section to define a base overlying the LED (20) and a pair of legs (36, 136) depending therefrom to engage the heat dissipater (10).

44. A method as set forth in claim 43 including forming a hole (38) in the base and protruding (39) the LED (20) through the hole (38) to emit light.

45. A method as set forth in claim 44 including forming a retaining portion (56 or 48) in each of the legs for retaining the LED (20) in the holding device (24, 26, 28, 30 and 32).

46. A method as set forth in claim 45 including forming a void (40) in the insulating layer (12) surrounding the LED (20) and the legs (36, 136) of each associated holding device (24, 26, 28, 30 and 32).

47. A method of assembling an electrically driven light emitting diode (LED) having laterally extending electrical leads (22) over an electrically insulating layer (12) having circuit traces (14) disposed in predetermined spaced lengths over said insulating layer (12) and an electrically and thermally conductive heat dissipater (10), the method comprising the steps of;

retaining the LED (20) in a U-shaped holding device (24, 26, 28, 30 or 32) having a base overlying the LED (20) and a pair of legs (36, 136) depending therefrom, and connecting the legs (36, 136) of the holding device (24, 26, 28, 30 or 32) to the heat dissipater (10) to position the LED (20) with the electrical leads (22) thereof forced into electrical engagement with the traces (14).