Process for sputtering copper in a self ionized plasma

• US 6,582,569 B1
• Filed: 10/10/2000
• Issued: 06/24/2003
• Est. Priority Date: 10/08/1999
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Chiang, Tony P., Cong, Yu D., Tang, Howard H., Tolia, Anish, Ding, Peijun, Fu, Jianming
• Primary Examiner(s): MCDONALD, RODNEY GLENN
• Application Number:
  US09/685,978
• Time in Patent Office: 987 Days
• Field of Search: 438/680, 438/687, 204/192.12, 204/192.15, 204/192.17, 204/298.19, 204/298.2
• US Class Current: 204/192.17
• CPC Class Codes: C23C 14/046 Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
• CPC Class Codes: C23C 14/345 using substrate bias
• CPC Class Codes: C23C 14/3457 using other particles than noble gas ions C23C14/0036, C23C14/46 take precedence
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: C23C 14/358 Inductive energy
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: H01J 2237/3327 Coating high aspect ratio workpieces
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma
• CPC Class Codes: H01J 37/3402 using supplementary magnetic fields
• CPC Class Codes: H01J 37/3408 Planar magnetron sputtering
• CPC Class Codes: H01J 37/3441 Dark space shields
• CPC Class Codes: H01L 21/2855 by physical means, e.g. sputtering, evaporation H01L21/28518 - H01L21/28537 and H01L21/28568 take precedence
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric
• CPC Class Codes: H01L 21/76862 Bombardment with particles, e.g. treatment in noble gas plasmas; UV irradiation
• CPC Class Codes: H01L 21/76865 Selective removal of parts of the layer H01L21/76844 takes precedence
• CPC Class Codes: H01L 21/76868 Forming or treating discontinuous thin films, e.g. repair, enhancement or reinforcement of discontinuous thin films
• CPC Class Codes: H01L 21/76871 Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
• CPC Class Codes: H01L 21/76873 for electroplating
• CPC Class Codes: H01L 21/76876 for deposition from the gas phase, e.g. CVD
• CPC Class Codes: H01L 21/76877 Filling of holes, grooves or trenches, e.g. vias, with conductive material
• CPC Class Codes: H01L 2221/1089 : Stacks of seed layers

Abstract

A DC magnetron sputter reactor for sputtering copper, its method of use, and shields and other parts promoting self-ionized plasma (SIP) sputtering, preferably at pressures below 5 milliTorr, preferably below 1 milliTorr. Also, a method of coating copper into a narrow and deep via or trench using SIP for a first copper layer. SIP is promoted by a small magnetron having poles of unequal magnetic strength and a high power applied to the target during sputtering. The SIP copper layer can act as a seed and nucleation layer for hole filling with conventional sputtering (PVD) or with electrochemical plating (ECP). For very high aspect-ratio holes, a copper seed layer is deposited by chemical vapor deposition (CVD) over the SIP copper nucleation layer, and PVD or ECP completes the hole filling. The copper seed layer may be deposited by a combination of SIP and high-density plasma sputtering. For very narrow holes, the CVD copper layer may fill the hole.

Claims

1. A method of sputter depositing copper onto a substrate, comprising the steps of:

providing a chamber having a target principally comprising copper spaced from a pedestal for holding a substrate to be sputter coated by a throw distance that is greater than 50% of a diameter of the substrate;

rotating a magnetron about the back of the target, said magnetron including an inner magnetic pole of one magnetic polarity surrounded by an outer magnetic pole of an opposite magnetic polarity, a magnetic flux of said outer pole being at least 50% larger than the magnetic flux of said inner pole;

after a plasma has been ignited in the chamber, pumping said chamber to a pressure of no more than 5 milliTorr; and

applying at least 10 kW of DC power to said target normalized to a 200 mm wafer while said chamber is pumped to said pressure, to thereby sputter copper from said target onto said substrate.

2. The method of claim 1, wherein said applying step applies said DC power relative to a grounded shield surrounding a space between said target and said pedestal and further comprising providing an electrically floating shield extending from a side of said target between 3 and 5 cm from a front of said target toward said pedestal .

3. The method of claim 2, wherein said pressure is less than 2 milliTorr.

4. The method of claim 3, wherein said throw distance is greater than 80% of said diameter of the substrate.

5. The method of claim 4, wherein said throw distance is greater than 140% of said diameter of the substrate.

6. The method of claim 1, wherein said pressure is less than 2 milliTorr.

7. The method of claim 5, wherein said pressure is less than 1 milliTorr.

8. The method of claim 1, wherein said throw distance is greater than 80% of said diameter of the substrate.

9. The method of claim 1, wherein said applying step applies at least 18 kW of DC power to said target normalized to said 200 mm wafer.

10. The method of claim 9, wherein said applying step applies at least 24 kW of DC power to said target normalized to said 200 mm wafer.

11. The method of claim 1, wherein said pressure is less than 1 milliTorr, said throw distance is greater than 140% of said substrate diameter, and said applying step applies at least 24 kW of DC power to said target normalized to said 200 mm wafer.

12. The method of claim 1, wherein said copper is deposited into a hole formed in a dielectric layer of said substrate and having an aspect ratio of at least 4:

1.

13. The method of claim 12, wherein said copper is deposited to a thickness of between 50 to 300 nm on a top planar surface of said substrate and further comprising filling copper into a remainder of said hole.

14. The method of claim 13, wherein said thickness is between 80 to 200 nm.

15. The method of claim 13, wherein said filling step comprises electroplating.

16. The method of claim 13, wherein said filling step comprises chemical vapor deposition.

17. The method of claim 12, wherein:

said pressure is less than 2 milliTorr;

said throw distance is greater than 80% of said diameter of the substrate; and

said applying step applies said DC power relative to a grounded shield surrounding a space between said target and said support and further comprising providing an electrically floating shield extending from a side of said target between 3 and 5 cm from a front of said target toward said support.

18. The method of claim 1, wherein said magnetron has an area of no more than ¼

of the area of the target.

19. A method of depositing copper into a hole formed in a dielectric layer of a substrate, comprising the steps of:

a first step of sputter depositing into said hole a first copper layer in a first sputter reactor capable of ionized metal plating;

a subsequent second step of sputter depositing a second copper layer in a second sputter reactor capable of self-ionized plasma sputtering to form a copper layer on walls of said hole but not filling said hole; and

a third step of depositing a third copper layer onto said second copper layer.

20. The method of claim 19, wherein said second sputter reactor solely uses RF capacitive coupling to form a self-ionized plasma and said first sputter reactor at least partially uses RF inductive coupling.

21. The method of claim 19, wherein said first step deposits a first blanket thickness of copper and said second step deposits a second blanket thickness of copper, a ratio of said first to said second blanket thicknesses being in a range of 30:

70 to 70;

30.