Optoelectronic component with a conductor strip element

• US 6,583,401 B2
• Filed: 01/18/2002
• Issued: 06/24/2003
• Est. Priority Date: 01/18/2001
• Status: Expired due to Term

• Current Assignee: Vishay Semiconductor GmbH (Vishay Intertechnology Incorporated)
• Original Assignee: Vishay Semiconductor GmbH (Vishay Intertechnology Incorporated)
• Inventors: Herok, Georg, Giebler, Siegfried
• Primary Examiner(s): Gutierrez, Diego
• Assistant Examiner(s): REIS, TRAVIS M
• Application Number:
  US10/054,426
• Publication Number:
  US 20020092971A1
• Time in Patent Office: 522 Days
• Field of Search: 250/214.1, 250/239, 250/216, 257/81, 257/82, 257/98, 257/99, 257/100, 257/659, 257/660, 257/432, 257/433, 257/434, 257/691, 257/626, 438/64, 438/65
• US Class Current: 250/214.1
• CPC Class Codes: H01L 23/49555 the bent parts being the outer leads
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A further miniaturization of known optoelectronic components with internal screening is not possible. In addition, inhomogeneities occur in the embedding material. Separate screening plates cause additional costs to arise during component assembly. The task is to design an optoelectronic component with a conductor strip element such that screening can be effected without any additional external screening measures.

Optoelectronic component with a conductor strip element, with electronic and optoelectronic semiconductor components being arranged on a first conductor strip element area connected to ground and encapsulated by a housing made of thermo- or duroplastic synthetic material. A second conductor strip element area protrudes from the housing and is folded around the housing such that it screens the semiconductor components against electromagnetic interference radiation.

The invention is particularly suitable for opto-electronic components such as, for example, photo modules that are to be mounted in top-view position as well as in side-view position and which contain electronic or optoelectronic semiconductor components that need to be protected against electromagnetic interference radiation.

Claims

1. An optoelectronic component (23) comprising:

a conductor strip element (1) having

a first conductor strip element area (4), connected to ground, and

a second conductor strip element area (5), also connected to ground;

electronic and optoelectronic semiconductor components (6,7) arranged on said first conductor strip element area (4);

a housing (21) made thermoplastic or thermoset synthetic material and encapsulating said first conductor strip element area (4);

wherein,

said second conductor strip element area (5) protrudes from said housing (21) and is folded around said housing (21) such that

said second conductor strip element area (5) will screen said electronic and optoelectronic semiconductor components (6,7) against electromagnetic interference radiation.

2. Optoelectronic component (23) according to claim 1 wherein the two conductor strip element areas (4,5) are connected to one another by means of one or several lands (9).

3. The optoelectronic component (23) according to claim 2, wherein the second conductor strip element area (5) features a further land (13).

4. The optoelectronic component (23) according to claim 3, wherein the further land (13) is bent around the housing (21) when the second conductor strip element area (5) is folded over.

5. The optoelectronic component (23) according to claim 3, wherein the housing (21) features a recess for further land (13).

6. The optoelectronic component (23) according to claim 1, wherein a lens (17) is integrated into the housing (21).

7. The optoelectronic component (23) according to claim 1, wherein the second conductor strip element area (5) features an aperture (10) according.

8. The optoelectronic component (23) according to claim 7, wherein a lens (17) is integrated into the housing (21), and wherein the form and diameter of the lens (17) and the form and diameter of the aperture (10) are matched.

9. The optoelectronic component (23) according to claim 1, wherein the second conductor strip element area (5) features a part section (16) to be bent over.

10. The optoelectronic component (23) according to claim 9, wherein the part section (16) features two notches or cuts (12).

11. The optoelectronic component (23) according to claim 10, wherein each notch (12) is followed by a wing (19).

12. The optoelectronic component (23) according to claim 11, wherein each wing (19) is angled off by a small angle.

13. The optoelectronic component (23) according to claim 1, wherein the housing (21) features an incline (24) with a final step (25).

14. The optoelectronic component (23) according to claim 12, wherein the housing (21) features an incline (24) with a final step (25), and the angled wings (19) are engaged in the step (25) when the conductor strip element area (5) is folded over.

15. A method of manufacturing an optoelectronic component (23), comprising the steps of

providing a conductor trip element (1) connected to ground, said conductor strip element having a first conductor strip element area (4) and a second conductor strip area (5);

mounting and contacting electronic and optoelectronic semiconductor components (6, 7) on said firs conductor strip element area (4);

forming a thermoplastic or thermoset material molded housing (21) around said first conductor strip element area (4) and electronic and optoelectronic semiconductor components (6, 7) so that said second conductor strip element area (5) protrudes from said housing (21);

and folding said second conductor strip element area around said housing (21) as an electromagnetic screen.