Modular fiber-optic transceiver

• US 6,583,902 B1
• Filed: 12/09/1999
• Issued: 06/24/2003
• Est. Priority Date: 12/09/1999
• Status: Expired due to Term

• Current Assignee: Sumitomo Electric Device Innovations, U.S.A., Inc. (Sumitomo Corporation)
• Original Assignee: Alvesta, Inc.
• Inventors: Yuen, Albert T.
• Primary Examiner(s): Pascal, Leslie
• Assistant Examiner(s): Leung, Christina Y
• Application Number:
  US09/459,421
• Time in Patent Office: 1,293 Days
• Field of Search: 359/152, 359/153, 359/163, 385/14, 385/92, 385/88, 385/91, 361/728
• US Class Current: 398/135
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4257 having a supporting carrier or a mounting substrate or a mounting plate G02B6/3648 takes precedence
• CPC Class Codes: G02B 6/426 mounting, engaging or coupling of the package to a board, a frame or a panel
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: G02B 6/4278 related to pluggable or demountable opto-electronic or electronic elements
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H04B 10/40 Transceivers

Abstract

A modular fiber-optic transceiver has an optoelectronic subassembly stack assembled in the beam direction and parallel to the plane of the mounting site. The subassembly is formed in various combinations of individually designed building modules for aligning, focusing, optoelectronic processing and eventual cooling. The subassembly is electrically conductive connected to a transceiver board and kept in perpendicular orientation to it by a snap fitting housing. The housing holds the cable plug of the fiber cable in position and transmits thereby the peripheral imposed mechanical load directly onto the mounting site. The modular building concept supports various techniques for fiber optic data transmission.

Claims

1. A fiber optic transceiver for transforming communication signals between an optical cable end and a connector array, said optical cable carrying an optical beam having a beam direction, the fiber optic transceiver comprising:

first and second functional modules forming a stack assembly having an assembly direction parallel to said beam direction; and

a processing board coupled to the stack assembly in a coupling direction that is perpendicular to the optical beam direction, wherein said first functional module includes a plurality of optoelectronic devices, and wherein said second functional module is a faraday shield module with at least one cavity enclosing the plurality of the optoelectronic devices of the first functional module.

2. The fiber optic transceiver of claim 1 wherein the stack assembly further comprises a heat sink.

3. The fiber optic transceiver of claim 2 further comprising a housing for housing the processing board and the stack assembly.

4. The fiber optic transceiver of claim 3 wherein said housing further comprises an opening for transferring heat away from the heat sink.

5. The fiber optic transceiver of claim 1 wherein the stack assembly is coupled to the processing board via a flexible cable.

6. The fiber optic transceiver of claim 1 wherein the stack assembly is coupled to the processing board via a solder bond.

7. The fiber optic transceiver of claim 1 wherein the stack assembly comprises an alignment feature.

8. The fiber optic transceiver of claim 7 wherein the alignment feature comprises a cylindrical cavity formed in the stack assembly in parallel direction to the optical beam direction.

9. The fiber optic transceiver of claim 1, wherein said processing board comprises at least an array of electrical contacts extending laterally therefrom.

10. A method of transforming communication signals between an optical cable carrying an optical beam having a beam direction and a connector array, the method comprising:

forming a stack assembly comprising first and second functional modules wherein said stack assembly has an assembly direction that is parallel to the optical beam direction; and

coupling a processing board to the stack assembly in a coupling direction that is perpendicular to the optical beam direction, wherein said first functional module includes a plurality of optoelectronic devices, and wherein said second functional module is a faraday shield module with at least one cavity enclosing the plurality of the optoelectronic devices of the first functional module.

11. The method of claim 10 further comprising:

coupling a heat sink to the stack assembly.

12. The method of claim 11 further comprising:

disposing the stack assembly and the processing board in a housing.

13. The method of claim 12 further comprising:

forming an opening in the housing to transfer heat away from said heat sink.

14. The method of claim 10 further comprising:

coupling the processing board to the stack assembly via a flexible cable.

15. The method of claim 10 further comprising:

coupling the processing board to the stack assembly via a solder bond.

16. The method of claim 10 further comprising:

forming an alignment feature on said stack assembly.

17. The method of claim 16 wherein the alignment feature comprises a cylindrical cavity formed in the stack assembly in parallel direction to the optical beam direction.

18. The method of claim 17 further comprising:

forming at least an array of electrical contacts extending laterally from said processing board.