Head slider supporting device, disk device and suspension having thermal protection for head IC chip

• US 6,583,962 B2
• Filed: 06/19/2002
• Issued: 06/24/2003
• Est. Priority Date: 10/20/1997
• Status: Expired due to Fees

• Current Assignee: Toshiba Storage Device Corp (Toshiba Corporation)
• Original Assignee: Fujitsu Limited
• Inventors: Watanabe, Toru, Ohwe, Takeshi, Koishi, Ryosuke
• Primary Examiner(s): KLIMOWICZ, WILLIAM JOSEPH
• Application Number:
  US10/174,607
• Publication Number:
  US 20020159194A1
• Time in Patent Office: 370 Days
• Field of Search: 360/244.1, 360/244.9, 360/244.2
• US Class Current: 360/244.1
• CPC Class Codes: G11B 21/00 Head arrangements not specific to the method of recording or reproducing
• CPC Class Codes: G11B 21/16 Supporting the heads; Supporting the sockets for plug-in heads
• CPC Class Codes: G11B 5/4833 Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head G11B5/484 takes precedence
• CPC Class Codes: G11B 5/486 with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
• CPC Class Codes: G11B 7/122 Flying-type heads, e.g. analogous to Winchester type in magnetic recording

Abstract

A suspension has an extending end and the other end. A head IC chip mounting portion is provided between the extending end and the other end of the suspension. A head slider is loaded on a first surface of the suspension at a position on the side of the extending end with respect to the head IC chip mounting portion, the head slider integrally including a head. A head IC chip is mounted at the head IC chip mounting portion of the suspension. First wiring patterns extend along the suspension between a portion of the suspension, at which portion the head slider is loaded, and the head IC chip mounting portion. Second wiring patterns extend along the suspension between the head IC chip mounting portion and the other end of the suspension. The head IC chip is mounted at the head IC chip mounting portion in a condition in which a certain portion of the head IC chip is positioned on the side of a second surface of the suspension, which second surface is opposite to the first surface.

Claims

1. A head slider supporting device comprising:

a suspension mounted on a guide arm via a spacer, said suspension being a substantially flat plate and having a head slider mounting portion and a head IC chip mounting portion; and

said spacer supported on said guide arm on one side, and supporting said suspension on an opposing side,

wherein said head slider mounting portion has a surface for mounting a head slider directly on a first side of said suspension,

wherein said head IC chip mounting portion is located at a position of said suspension supported by said spacer on a second side of said suspension, and

wherein said spacer has a head IC chip mounting space for accommodating at least a part of a head IC chip.

2. The head slider supporting device as claimed in claim 1,

wherein said head IC chip mounting portion has an opening, a bend portion bent along said opening and toward the second side of said suspension, and a flat portion connected to said bend portion and having a surface substantially parallel to said suspension for directly mounting said head IC chip, and

wherein said opening, said bend portion and said flat portion form a recess for accommodating a part of said head IC chip, said recess being held by said head IC chip mounting portion.

3. The head slider supporting device as claimed in claim 2, further comprising a head IC chip mounted on said surface of said flat portion of said head IC chip mounting portion.

4. The head slider supporting device as claimed in claim 3, further comprising a head slider mounted on said surface of said head slider mounting portion.

5. The head slider supporting device as claimed in claim 2,

wherein said opening comprises a pair of slits defining a bridge portion therebetween, said bridge portion having a first end and a second end,

wherein said bend portion comprises a pair of bend portions formed at said first and said second ends of said bridge portion respectively, and

wherein said flat portion is formed between said pair of bend portions.

6. The head slider supporting device as claimed in claim 2,

wherein said opening comprises an H-shaped opening defining a pair of tongue portions, each of said tongue portions having a free end facing one another,

wherein said bend portion comprises a pair of bend portions formed at an end of each of said pair of tongue portions opposite to said free ends, respectively, and

wherein said flat portion comprises a pair of flat portions formed at said free ends of said tongue portions, respectively.

7. The head slider supporting device as claimed in claim 2, wherein said bend portion is bent by a pressing process.

8. The head slider supporting device as claimed in claim 1, further comprising:

a first wiring pattern extending from said head slider mounting portion to said head IC chip mounting portion; and

a second wiring pattern extending from said head IC chip mounting portion.

9. The head slider supporting device as claimed in claim 1,

wherein said head slider mounting portion is located at a distal end of said suspension, and

wherein said IC chip mounting portion is located between said head slider mounting portion and a proximal end of said suspension.

10. The head slider supporting device as claimed in claim 1, further comprising a suspension mounting plate mounted on said second side of said suspension at a proximal end of said suspension.

11. The head slider supporting device as claimed in claim 10, wherein said head IC chip mounting portion is located between said head slider mounting portion and said suspension mounting plate.

12. The head slider supporting device as claimed in claim 10,

wherein said head IC chip mounting portion is located at a proximal end of said suspension, and

wherein a bend portion of said head IC chip mounting portion is inserted into an opening of said mounting plate.

13. The head slider supporting device as claimed in claim 1,

wherein said suspension has a rib portion formed therealong such as to form a rigid portion therein, and

wherein said head IC chip mounting portion is formed in said rigid portion.

14. The head slider supporting device as claimed in claim 1, wherein said head IC chip mounting portion comprises:

a pair of slits defining a bridge portion therebetween, said bridge portion having a first end and a second end;

a pair of bend portions formed at said first and second ends of said bridge portion respectively, and bent toward said second side of said suspension, and

a flat portion formed between said pair of bend portions and having a surface substantially parallel to said suspension for directly mounting said head IC chip, and

wherein said pair of slits, said pair of bend portions and said flat portion form a recess for accommodating at least a part of said head IC chip, said recess being held by said head IC chip mounting space of said spacer.

15. The head slider supporting device as claimed in claim 14,

wherein said suspension has a rib portion formed therealong such as to form a rigid portion therein, and

wherein said head IC chip mounting portion is formed in said rigid portion.

16. The head slider supporting device as darned in claim 1,

wherein said head IC chip mounting portion comprises an opening, a base layer covering said opening on said first side of said suspension, and pad terminals exposed on a surface of said base layer toward said second side of said suspension, and

wherein said head IC chip is mounted on said head IC chip mounting portion, accommodated by both said opening and said head IC chip mounting space of said spacer, and electrically connected with said pad terminals.