Composite overmolded heat pipe construction

• US 6,585,039 B2
• Filed: 01/31/2001
• Issued: 07/01/2003
• Est. Priority Date: 02/01/2000
• Status: Active Grant

• Current Assignee: Ticona Polymers, Inc. (Celanese Corporation)
• Original Assignee: Cool Options, Inc.
• Inventors: Sagal, E. Mikhail, McCullough, Kevin A., Miller, James D.
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): MCKINNON, TERRELL L
• Application Number:
  US09/774,519
• Publication Number:
  US 20030102118A1
• Time in Patent Office: 881 Days
• Field of Search: 165/104.33, 165/80.3, 165/185, 165/104.26, 298/900.32, 257/715, 361/700
• US Class Current: 165/185
• CPC Class Codes: B29C 45/14622 Lining the inner or outer surface of tubular articles
• CPC Class Codes: B29C 45/14819 the inserts being completely encapsulated
• CPC Class Codes: B29K 2105/16 Fillers
• CPC Class Codes: B29K 2995/0013 Conductive
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28F 2255/146 overmolded
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making
• CPC Class Codes: Y10T 29/49353 Heat pipe device making
• CPC Class Codes: Y10T 29/4998 Combined manufacture including applying or shaping of fluent material

Abstract

The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.

Claims

1. A composite, overmolded heat pipe construction having integrally formed interface pads, comprising:

a heat pipe charged with phase change media having an outer surface, a first end and a second end;

a thermally conductive moldable composition having, a polymer base matrix material loaded with a first thermally conductive filler having a relatively high aspect ratio of at least 10;

1 and a second thermally conductive filler having a relatively low aspect ratio of less than 5;

1, said composition being positioned about said outer surface of said heat pipe;

a first thermal interface pad, integrally formed from said moldable composition, connected to said first end of said heat pipe; and

a second thermal interface pad, integrally formed from said moldable composition, connected to said second end of said heat pipe, said first and second thermal interfaces in thermal communication with said moldable composition and said first and second ends of said heat pipe.

2. The composite, overmolded heat pipe construction of claim 1, wherein said polymer composite material is a liquid crystal polymer.

3. The composite, overmolded heat pipe construction of claim 1, wherein said first thermally conductive filler is carbon fiber.

4. The composite, overmolded heat pipe construction of claim 1, wherein said second thermally conductive filler is boron nitride grains.

5. The composite, overmolded heat pipe construction of claim 1, wherein said thermally conductive moldable composition is electro magnetic interference wave absorptive.

6. An electro magnetic interference absorptive composite, overmolded heat pipe construction having integrally formed interface pads, comprising:

a heat pipe charged with phase change media having an outer surface, a first end and a second end;

a thermally conductive moldable composition positioned about said outer surface of said heat pipe, where said thermally conductive moldable composition absorbs electro magnetic interference;

a first thermal interface pad, integrally formed from said moldable composition, connected to said first end of said heat pipe; and

a second thermal interface pad, integrally formed from said moldable composition, connected to said second end of said heat pipe, said first and second thermal interfaces in thermal communication with said moldable composition and said first and second ends of said heat pipe.

7. The composite, overmolded heat pipe construction of claim 6, wherein said thermally conductive moldable composition is a polymer composite material loaded with a thermally conductive filler.

8. The composite, overmolded heat pipe construction of claim 6, wherein said polymer composite material is a liquid crystal polymer.

9. The composite, overmolded heat pipe construction of claim 7, wherein said thermally conductive filler is carbon fiber.