IC card having a mica capacitor

• US 6,585,165 B1
• Filed: 02/23/2001
• Issued: 07/01/2003
• Est. Priority Date: 06/29/1999
• Status: Expired due to Term

• Current Assignee: Sony Chemicals Corp. (Dexerials Corporation)
• Original Assignee: Sony Chemicals Corp. (Dexerials Corporation)
• Inventors: Suzuki, Kazuaki, Kuroda, Nobukazu
• Primary Examiner(s): St. Cyr, Daniel
• Application Number:
  US09/763,453
• Time in Patent Office: 858 Days
• Field of Search: 235/492, 235/380, 235/487, 235/488, 361/737, 361/148
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna

Abstract

An IC card 10A has a mica capacitor 5, an antenna coil 2 and an IC chip 3 formed on an insulating substrate 1, where the mica capacitor is composed of a mica film 6 and electrodes 7a and 7b formed on both sides of the mica film 6. terminal of the electrode 7b on one side of the mica capacitor 5 is formed on the other side of the mica capacitor 5, and this terminal and a terminal of the electrode 7a on the other side are connected on the insulating substrate 1 with the use of an anisotropic conductive adhesive 4. Thus, an IC card can be manufactured at low cost, in which the resonance frequency is stabilized and the antenna characteristics are improved.

Claims

1. An IC card comprising a mica capacitor having a single-sided electrode region formed on a portion of the mica capacitor, an antenna coil and an IC chip formed on a substrate, the mica capacitor comprising a mica film and electrodes formed on both sides of the mica film, wherein a terminal of an electrode on one side of the mica capacitor is formed on the other side of the mica capacitor, and the terminal of the electrode on the one side and a terminal of the electrode on the other side are wirelessly connected on the substrate by an anisotropic conductive adhesive, and wherein the single-sided electrode region comprises one of the electrodes and the mica film.

2. The IC card according to claim 1, wherein the terminal of the electrode on one side of the mica capacitor is formed on the other side of the mica capacitor by means of a through-hole.

3. The IC card according to claim 2, wherein, in case where one terminal of one electrode of the mica capacitor is connected to an outer terminal of the antenna coil, said electrode also has another terminal on an inner side of the antenna coil. substrate by an anisotropic conductive adhesive, and wherein the single-sided electrode region comprises one of the electrodes and the mica film.

4. The IC card according to claim 2, wherein the single-sided electrode region intersects with the antenna coil with the mica film arranged on a side of the antenna coil.

5. The IC card according to claim 2, wherein the mica capacitor, the antenna coil and the IC chip on the substrate are covered by a jacket material with an pressure-sensitive adhesive material interposed therebetween, and wherein at least on the mica capacitor, the pressure-sensitive adhesive material is provided without an interposed sealing resin.

6. The IC card according to claim 1, wherein, in case where one terminal of one electrode of the mica capacitor is connected to an outer terminal of the antenna coil, said electrode also has another terminal on an inner side of the antenna coil.

7. The IC card according to claim 6, wherein the single-sided electrode region intersects with the antenna coil with the mica film arranged on a side of the antenna coil.

8. The IC card according to claim 6, wherein the mica capacitor, the antenna coil and the IC chip on the substrate are covered by a jacket material with an pressure-sensitive adhesive material interposed therebetween, and wherein at least on the mica capacitor, the pressure-sensitive adhesive material is provided without an interposed sealing resin.

9. The IC card according to claim 1, wherein the mica capacitor, the antenna coil and the IC chip on the substrate are covered by a jacket material with an pressure-sensitive adhesive material interposed therebetween, and wherein at least on the mica capacitor, the pressure-sensitive adhesive material is provided without an interposed sealing resin.

10. The IC card according to claim 1, wherein the single-sided electrode region intersects with the antenna coil with the mica film arranged on a side of the antenna coil.

11. The IC card according to claim 10, wherein the mica capacitor, the antenna coil and the IC chip on the substrate are covered by a jacket material with an pressure-sensitive adhesive material interposed therebetween, and wherein at least on the mica capacitor, the pressure-sensitive adhesive material is provided without an interposed sealing resin.

12. A mica capacitor for an IC card having a substrate, the mica capacitor having a single-sided electrode region formed on a portion of the mica capacitor, the mica capacitor comprising a mica film and electrodes formed on both sides of the mica film, wherein a terminal of an electrode on one side of the mica capacitor is formed on the other side of the mica capacitor, and the terminal of the electrode on the one side and a terminal of the electrode on the other side are wirelessly connected on the substrate by an anisotropic conductive adhesive, and wherein the single-sided electrode region comprises one of the electrodes and the mica film.