High performance RF inductors and transformers using bonding technique

• US 6,586,309 B1
• Filed: 04/24/2000
• Issued: 07/01/2003
• Est. Priority Date: 04/24/2000
• Status: Expired due to Term

• Current Assignee: Chartered Semiconductor Manufacturing Incorporated (GlobalFoundries, Inc.)
• Original Assignee: Chartered Semiconductor Manufacturing Incorporated (GlobalFoundries, Inc.)
• Inventors: Ma, Jianguo, Yeo, Kiat Seng, Do, Manh Anh, Chew, Kok Wai Johnny, Tan, Hai Peng
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Kebede, Brook
• Application Number:
  US09/556,423
• Time in Patent Office: 1,163 Days
• Field of Search: 438/381, 438/901, 438/329, 438/171, 438/FOR.220, 257/531, 257/528, 336/200, 336/232
• US Class Current: 438/381
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/4911 the connectors being bonded to at least one common bonding area, e.g. daisy chain
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/49176 Wire connectors having the same loop shape and height
• CPC Class Codes: H01L 2224/49431 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching

Abstract

A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.

Claims

1. A method of fabricating an inductor in the fabrication of integrated circuits comprising:

providing semiconductor device structures in and on a semiconductor substrate wherein said semiconductor device structures include topmost wedge bond wires;

forming bonding pads overlying and contacting said topmost wedge bond wires;

making input/output connections with two of said bonding pads; and

forming a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops form said inductor wherein said inductor is a solenoid inductor.

2. The method according to claim 1 wherein said bond wire loops comprise copper.

3. The method according to claim 1 wherein said bond wire loops comprise gold.

4. A method of fabricating an inductor in the fabrication of integrated circuits comprising:

providing semiconductor device structures in and on a semiconductor substrate wherein said semiconductor device structures include topmost wedge bond wires;

forming bonding pads overlying and contacting said topmost wedge bond wires;

making input/output connections with two of said bonding pads; and

forming a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops form said inductor wherein said inductor is a spiral inductor.

5. The method according to claim 4 wherein said bond wire loops comprise copper.

6. The method according to claim 4 wherein said bond wire loops comprise gold.

7. A method of fabricating an inductor in the fabrication of integrated circuits comprising:

providing semiconductor device structures in and on a semiconductor substrate wherein said semiconductor device structures include topmost wedge bond wires;

forming bonding pads overlying and contacting said topmost wedge bond wires;

making input/output connections with two of said bonding pads; and

forming a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops form said inductor and wherein said inductor is selected from the group consisting of a solenoid inductor and a spiral inductor.

8. The method according to claim 7 wherein said bond wire loops comprise copper.

9. The method according to claim 7 wherein said bond wire loops comprise gold.

10. A method of fabricating an inductor in the fabrication of integrated circuits comprising:

providing semiconductor device structures in and on a semiconductor substrate wherein said semiconductor device structures include topmost wedge wire bonds;

forming bonding pads overlying and contacting said topmost wedge wire bonds;

making input/output connections with two of said bonding pads; and

forming a plurality of bond wire loops, each loop connecting each two of said bonding pads wherein said bond wire loops are selected from the group consisting of copper and gold, wherein said bond wire loops form said inductor, and wherein said inductor is a spiral inductor.