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Printed wiring board with controlled line impedance

  • US 6,586,682 B2
  • Filed: 02/23/2000
  • Issued: 07/01/2003
  • Est. Priority Date: 02/23/2000
  • Status: Expired due to Fees
First Claim
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1. A printed wiring substrate comprising:

  • a laminated printed wiring substrate having a patterned metal layer on a surface of the laminated printed wiring substrate, the patterned metal layer including a first pad;

    a planarized dielectric layer disposed on the surface of the laminated printed wiring substrate and covering at least a portion of the first pad of the patterned metal layer, the planarized dielectric layer comprising a first dielectric layer portion proximate to the laminated printed wiring substrate, and a second dielectric layer portion disposed on the first dielectric layer portion;

    a first via extending from an upper surface of the second dielectic layer portion of the planarized dielectric layer to the first pad;

    a patterned thin-film metal layer formed on the planarized layer, a second pad of the patterned thin-film metal layer being electrically coupled to the first pad through the first via;

    a third pad of the patterned thin-film metal layer, the third pad and the second pad being arranged with a pitch; and

    a reference plane portion of the patterned thin-film metal layer, the reference plane portion disposed between the second pad and the third pad.

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