Reduced thickness packaged electronic device

• US 6,586,824 B1
• Filed: 07/26/2001
• Issued: 07/01/2003
• Est. Priority Date: 07/26/2001
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Webster, Steven, Hollaway, Roy Dale
• Primary Examiner(s): Thomas, Tom
• Assistant Examiner(s): Parekh, Nitin
• Application Number:
  US09/916,716
• Time in Patent Office: 705 Days
• Field of Search: 257/680, 257/780, 257/787, 257/737, 257/738, 257/431-434, 438/116
• US Class Current: 257/680
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/92 Specific sequence of method steps
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15183 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/18165 : of a wire bonded chip
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02327 : the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/18 : Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, thereby creating a tape surface at the bottom of the hole. The electronic device is then positioned within the hole such that the electronic device is in contact with, and adhered to, the tape surface at the bottom of the hole. Electronic connections are made between the electronic device and the substrate and a layer of encapsulant is applied.

In one embodiment, the electronic device is a sensor die and an optical element is positioned over an active region of the sensor die before the encapsulant is applied. The encapsulant then surrounds and holds the optical element in position over the active region of the sensor die.

Claims

1. A packaged sensor die comprising:

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate further comprising a hole formed through said substrate, said hole extending from said substrate first surface to said substrate second surface, said hole comprising hole sides;

a sensor die, said sensor die comprising a sensor die first surface and a sensor die second surface, opposite said sensor die first surface, said sensor die further comprising an active region on said first surface of said sensor die, said sensor die being positioned in said hole such that a distance between said first surface of said sensor die and said second surface of said substrate is less than a distance between said first surface of said substrate and said second surface of said substrate, said sensor die being electrically coupled to said substrate with electrical connections;

an optical element, said optical element comprising an optical element first surface, an optical element second surface, opposite said optical element first surface, and optical element sides, said optical element positioned directly on said sensor die such that said second surface of said optical element is positioned over said active region of said first surface of said sensor die;

a layer of encapsulant, said layer of encapsulant being applied to;

a portion of said first surface of said sensor die not covered by said optical element;

said first surface of said substrate;

said electrical connections;

said optical element sides; and

filling gaps between said integrated circuit and said hole sides, wherein;

said optical element is held in position over said active region of said sensor die first surface, at least in part, by said encapsulant applied to said optical element sides.

2. The structure of claim 1, wherein;

said electrical connections comprise bond wires.

3. The structure of claim 1, wherein;

a distance from said first surface of said optical element to said second surface of said substrate is in the range of 0.3 to 0.5 millimeters.

4. A packaged sensor die comprising:

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate further comprising a hole formed through said substrate, said hole extending from said substrate first surface to said substrate second surface, said hole comprising hole sides;

a sensor die, said sensor die comprising a sensor die first surface and a sensor die second surface, opposite said sensor die first surface, said sensor die further comprising an active region on said first surface of said sensor die, said sensor die being positioned in said hole such that a distance between said first surface of said sensor die and said second surface of said substrate is less than a distance between said first surface of said substrate and said second surface of said substrate, said sensor die being electrically coupled to said substrate with bond wires;

an optical element, said optical element comprising an optical element first surface, an optical element second surface, opposite said optical element first surface, and optical element sides, said optical element positioned directly on said sensor die such that said second surface of said optical element is positioned over said active region of said first surface of said sensor die;

a layer of encapsulant, said layer of encapsulant being applied to;

a portion of said first surface of said sensor die not covered by said optical element;

said first surface of said substrate;

said bond wires;

said optical element sides; and

filling gaps between said integrated circuit and said hole sides, wherein;

said optical element is held in position over said active region of said sensor die first surface, at least in part, by said encapsulant applied to said optical element sides, further wherein;

a distance from said first surface of said optical element to said second surface of said substrate is in the range of 0.3 to 0.5 millimeters.

5. A packaged sensor die comprising:

a support means, said support means comprising a support means first surface and a support means second surface, opposite said support means first surface, said support means further comprising a hole formed through said support means, said hole extending from said support means first surface to said support means second surface, said hole comprising hole sides;

a sensor die, said sensor die comprising a sensor die first surface and a sensor die second surface, opposite said sensor die first surface, said sensor die further comprising an active region on said first surface of said sensor die, said sensor die being positioned in said hole such that a distance between said first surface of said sensor die and said second surface of said support means is less than a distance between said first surface of said support means and said second surface of said support means, said sensor die being electrically coupled to said support means with electrical connection means;

optical means, said optical means comprising an optical means first surface, an optical means second surface, opposite said optical means first surface, and optical means sides, said optical means positioned directly on said sensor die such that said second surface of said optical means is positioned over said active region of said first surface of said sensor die;

encapsulant means, said encapsulant means covering;

a portion of said first surface of said sensor die not covered by said optical means;

said first surface of said support means;

said electrical connection means;

said optical means sides; and

filling gaps between said sensor die and said hole sides, wherein;

said optical means is held in position over said active region of said sensor die first surface, at least in part, by said encapsulant means applied to said optical means sides.

6. A packaged sensor die comprising:

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate further comprising a hole formed through said substrate, said hole extending from said substrate first surface to said substrate second surface, said hole comprising hole sides;

a sensor die, said sensor die comprising a sensor die first surface and a sensor die second surface, opposite said sensor die first surface, said sensor die further comprising an active region on said first surface of said sensor die, said sensor die being positioned in said hole such that said second surface of said sensor die is positioned below said first surface of said substrate and said first surface of said sensor die is positioned above said first surface of said substrate such that a distance between said first surface of said sensor die and said second surface of said substrate is greater than a distance between said first surface of said substrate and said second surface of said substrate, said sensor die being electrically coupled to said substrate with electrical connections;

an optical element, said optical element comprising an optical element first surface, an optical element second surface, opposite said optical element first surface, and optical element sides, said optical element positioned directly on said sensor die such that said second surface of said optical element is positioned over said active region of said first surface of said sensor die;

a layer of encapsulant, said layer of encapsulant being applied to;

a portion of said first surface of said sensor die not covered by said optical element;

said first surface of said substrate;

said electrical connections;

said optical element sides; and

filling gaps between said integrated circuit and said hole sides, wherein;

said optical element is held in position over said active region of said sensor die first surface, at least in part, by said encapsulant applied to said optical element sides.

7. The structure claim 6, wherein;

said electrical connections comprise bond wires.

8. The structure of claim 6, wherein;

a distance from said first surface of said optical element to said second surface of said substrate is in the range of 0.3 to 0.5 millimeters.

9. A packaged sensor die comprising:

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate further comprising a hole formed through said substrate, said hole extending from said substrate first surface to said substrate second surface, said hole comprising hole sides;

a sensor die, said sensor die comprising a sensor die first surface and a sensor die second surface, opposite said sensor die first surface, said sensor die further comprising an active region on said first surface of said sensor die, said sensor die being positioned in said hole such that said second surface of said sensor die is positioned below said first surface of said substrate and said first surface of said sensor die is positioned above said first surface of said substrate such that a distance between said first surface of said sensor die and said second surface of said substrate is greater than a distance between said first surface of said substrate and said second surface of said substrate, said sensor die being electrically coupled to said substrate with bond wire electrical connections;

an optical element, said optical element comprising an optical element first surface, an optical element second surface, opposite said optical element first surface, and optical element sides, said optical element positioned directly on said sensor die such that said second surface of said optical element is positioned over said active region of said first surface of said sensor die;

a layer of encapsulant, said layer of encapsulant being applied to;

a portion of said first surface of said sensor die not covered by said optical element;

said first surface of said substrate;

said bond wire electrical connections;

said optical element sides; and

filling gaps between said integrated circuit and said hole sides, wherein;

said optical element is held in position over said active region of said sensor die first surface, at least in part, by said encapsulant applied to said optical element sides.

10. A packaged sensor die comprising:

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate further comprising a hole formed through said substrate, said hole extending from said substrate first surface to said substrate second surface, said hole comprising hole sides;

a sensor die, said sensor die comprising a sensor die first surface and a sensor die second surface, opposite said sensor die first surface, said sensor die further comprising an active region on said first surface of said sensor die, said sensor die being positioned in said hole such that said second surface of said sensor die is positioned below said first surface of said substrate and said first surface of said sensor die is positioned above said first surface of said substrate such that a distance between said first surface of said sensor die and said second surface of said substrate is greater than a distance between said first surface of said substrate and said second surface of said substrate, said sensor die being electrically coupled to said substrate with electrical connections;

an optical element, said optical element comprising an optical element first surface, an optical element second surface, opposite said optical element first surface, and optical element sides, said optical element positioned directly on said sensor die such that said second surface of said optical element is positioned over said active region of said first surface of said sensor die;

a layer of encapsulant, said layer of encapsulant being applied to;

a portion of said first surface of said sensor die not covered by said optical element;

said first surface of said substrate;

said electrical connections;

said optical element sides; and

filling gaps between said integrated circuit and said hole sides, wherein;

said optical element is held in position over said active region of said sensor die first surface, at least in part, by said encapsulant applied to said optical element sides, further wherein;

a distance from said first surface of said optical element to said second surface of said substrate is in the range of 0.3 to 0.5 millimeters.

11. A packaged sensor die comprising:

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate further comprising a hole formed through said substrate, said hole extending from said substrate first surface to said substrate second surface, said hole comprising hole sides;

a sensor die, said sensor die comprising a sensor die first surface and a sensor die second surface, opposite said sensor die first surface, said sensor die further comprising an active region on said first surface of said sensor die, said sensor die being positioned in said hole such that said second surface of said sensor die is positioned below said first surface of said substrate and said first surface of said sensor die is positioned above said first surface of said substrate such that a distance between said first surface of said sensor die and said second surface of said substrate is greater than a distance between said first surface of said substrate and said second surface of said substrate, said sensor die being electrically coupled to said substrate with bond wire electrical connections;

an optical element, said optical element comprising an optical element first surface, an optical element second surface, opposite said optical element first surface, and optical element sides, said optical element positioned directly on said sensor die such that said second surface of said optical element is positioned over said active region of said first surface of said sensor die;

a layer of encapsulant, said layer of encapsulant being applied to;

a portion of said first surface of said sensor die not covered by said optical element;

said first surface of said substrate;

said bond wire electrical connections;

said optical element sides; and

filling gaps between said integrated circuit and said hole sides, wherein;

said optical element is held in position over said active region of said sensor die first surface, at least in part, by said encapsulant applied to said optical element sides, further wherein;

a distance from said first surface of said optical element to said second surface of said substrate is in the range of 0.3 to 0.5 millimeters.

12. A packaged sensor die comprising:

a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate further comprising a hole formed through said substrate, said hole extending from said substrate first surface to said substrate second surface, said hole comprising hole sides;

a sensor die, said sensor die comprising a sensor die first surface and a sensor die second surface, opposite said sensor die first surface, said sensor die further comprising an active region on said first surface of said sensor die, said sensor die being positioned in said hole such that said second surface of said sensor die is positioned below said first surface of said substrate and said first surface of said sensor die is positioned above said first surface of said substrate such that a distance between said first surface of said sensor die and said second surface of said substrate is greater than a distance between said first surface of said substrate and said second surface of said substrate, said sensor die being electrically coupled to said substrate with electrical connections;

an optical element, said optical element comprising an optical element first surface, an optical element second surface, opposite said optical element first surface, and optical element sides, said optical element positioned directly on said sensor die such that said second surface of said optical element is positioned over said active region of said first surface of said sensor die;

a layer of encapsulant, said layer of encapsulant being applied to;

a portion of said first surface of said sensor die not covered by said optical element;

said first surface of said substrate;

said electrical connections;

said optical element sides; and

filling gaps between said integrated circuit and said hole sides, wherein;

said optical element is held in position over said active region of said sensor die first surface, at least in part, by said encapsulant applied to said optical element sides, further wherein;

a distance from said first surface of said sensor die to said second surface of said substrate is in the range of 0.3 to 0.5 millimeters.