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Vacuum package fabrication of integrated circuit components

  • US 6,586,831 B2
  • Filed: 08/10/2001
  • Issued: 07/01/2003
  • Est. Priority Date: 02/02/2000
  • Status: Expired due to Term
First Claim
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1. A vacuum package containing one or more integrated circuit devices, comprising:

  • one or more integrated circuit devices formed on a device wafer, said devices having one or more associated bonding pads;

    a sealing ring formed on the device wafer between the perimeter of the one or more integrated circuit devices and the one or more bonding pads coupled to the one or more integrated circuit devices;

    a plurality of uniform thickness control spacers formed as part of and distributed around the sealing ring; and

    a vacuum package lid sealed to the sealing ring, the vacuum package lid uniformly spaced from the device wafer by the control spacers thereby providing a vacuum cell for the one or more integrated circuit devices.

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