Methods and structures for electronic probing arrays
First Claim
1. A probe card for testing electronic elements, said probe card comprising a substrate, a layer of dielectric material having a plurality of cavities therein supported on said substrate, a mass of fusible conductive material having a melting temperature below about 150°
- C. disposed in each of said cavities, said dielectric material electrically insulating the masses of fusible conductive material from one another, and a probe tip of conductive material having a melting temperature greater than about 150°
C. at one common end of each of the masses of fusible conductive material, said layer of dielectric material having a plurality of channels formed therein, whereby each of said mass of fusible conductive material is surrounded by said dielectric material forming a probe contact, each said probe contact being separated from an adjacent probe contact by at least one of said channels.
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Accused Products
Abstract
A probe card for testing electronic elements includes a layer of dielectric material provided with a plurality of cavities supported on a substrate. A mass of fusible conductive material having a melting temperature below about 150° C. is disposed in each of said cavities, the dielectric material electrically insulating the masses of fusible conductive material from one another. A probe tip of conductive material having a melting temperature greater than about 150° C. is provided at one common end of each of the masses of fusible conductive material. The probe contacts are separated from an adjacent probe contact by at least one channel formed with the layer of dielectric material.
156 Citations
65 Claims
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1. A probe card for testing electronic elements, said probe card comprising a substrate, a layer of dielectric material having a plurality of cavities therein supported on said substrate, a mass of fusible conductive material having a melting temperature below about 150°
- C. disposed in each of said cavities, said dielectric material electrically insulating the masses of fusible conductive material from one another, and a probe tip of conductive material having a melting temperature greater than about 150°
C. at one common end of each of the masses of fusible conductive material, said layer of dielectric material having a plurality of channels formed therein, whereby each of said mass of fusible conductive material is surrounded by said dielectric material forming a probe contact, each said probe contact being separated from an adjacent probe contact by at least one of said channels. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
- C. disposed in each of said cavities, said dielectric material electrically insulating the masses of fusible conductive material from one another, and a probe tip of conductive material having a melting temperature greater than about 150°
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18. A probe card for testing electronic elements, said probe card comprising a substrate including electrical circuitry thereon having contacts, a layer of dielectric material having a plurality of cavities therein supported on said substrate, a mass of fusible conductive material having a melting temperature below about 125°
- C. disposed in each of said cavities, each said mass of fusible conductive material being bonded to one of said contacts, said dielectric material electrically insulating the masses of fusible conductive material from one another, and a probe tip of conductive material having a melting temperature greater than about 125°
C. at one common end of each of the masses of fusible conductive material, said layer of dielectric material having a plurality of channels formed therein, whereby each of said mass of fusible conductive material is surrounded by said dielectric material forming a probe contact, each said probe contact being separated from an adjacent probe contact by at least one of said channels. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
- C. disposed in each of said cavities, each said mass of fusible conductive material being bonded to one of said contacts, said dielectric material electrically insulating the masses of fusible conductive material from one another, and a probe tip of conductive material having a melting temperature greater than about 125°
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30. A probe card test assembly comprising an electronic element having a plurality of contacts thereon;
- and a probe card comprising a substrate, a layer of dielectric material having a plurality of cavities therein supported on said substrate, a mass of fusible conductive material having a melting temperature below about 150°
C. disposed in each of said cavities, said dielectric material electrically insulating the masses of fusible conductive material from one another, and a probe tip of conductive material having a melting temperature greater than about 150°
C. at one common end of each of the masses of fusible conductive material, at least one of said probe tips in contact with one of said contacts on said electronic element, said layer of dielectric material having a plurality of channels formed therein, whereby each of said mass of fusible conductive material is surrounded by said dielectric material forming a probe contact, each said probe contact being separated from an adjacent probe contact by at least one of said channels. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38)
- and a probe card comprising a substrate, a layer of dielectric material having a plurality of cavities therein supported on said substrate, a mass of fusible conductive material having a melting temperature below about 150°
- 39. A method of making a probe card comprising forming a plurality of cavities in a sacrificial first substrate, depositing a first metal over said substrate and into said cavities to form a plurality of probe tips, depositing a mass of fusible conductive material over each of said probe tips, providing a substrate having a plurality of contacts on one surface thereof facing said sacrificial substrate, bonding each said mass of fusible conductive material to a corresponding one of said contacts on said second substrate, providing a dielectric material between said first and second substrates surrounding each said mass of fusible conductive material to form a dielectric encapsulant layer encapsulating each said mass of conductive fusible material, removing said sacrificial first substrate, and at least partially separating each said mass of conductive fusible material within said encapsulant layer to form a plurality of individual contact probes each surrounded by said encapsulant layer.
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59. A method for testing an electronic element using a probe card, said method comprising providing a probe card having a substrate, a layer of dielectric material having a plurality of cavities therein supported on said substrate, a mass of fusible conductive material having a melting temperature disposed in each of said cavities, said dielectric material electrically insulating the masses of fusible conductive material from one another, and a probe tip of conductive material having a melting temperature greater than the melting temperature of said mass of fusible conductive material at one common end of each of the masses of fusible conductive material, said layer of dielectric material having a plurality of channels formed therein, whereby each of said mass of fusible conductive material is surrounded by said dielectric material forming a probe contact, each said probe contact being separated from an adjacent probe contact by at least one of said channels;
- positioning said probe card opposing an electronic element having a plurality of contacts thereon, at least one of said contacts engaged by one of said probe tips;
heating said mass of fusible conductive material to at least the melting temperature of said fusible conductive material; and
sending signals to said probe card and said electronic element. - View Dependent Claims (60, 61, 62, 63, 64, 65)
- positioning said probe card opposing an electronic element having a plurality of contacts thereon, at least one of said contacts engaged by one of said probe tips;
Specification