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Methods and structures for electronic probing arrays

  • US 6,586,955 B2
  • Filed: 02/27/2001
  • Issued: 07/01/2003
  • Est. Priority Date: 03/13/2000
  • Status: Expired due to Fees
First Claim
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1. A probe card for testing electronic elements, said probe card comprising a substrate, a layer of dielectric material having a plurality of cavities therein supported on said substrate, a mass of fusible conductive material having a melting temperature below about 150°

  • C. disposed in each of said cavities, said dielectric material electrically insulating the masses of fusible conductive material from one another, and a probe tip of conductive material having a melting temperature greater than about 150°

    C. at one common end of each of the masses of fusible conductive material, said layer of dielectric material having a plurality of channels formed therein, whereby each of said mass of fusible conductive material is surrounded by said dielectric material forming a probe contact, each said probe contact being separated from an adjacent probe contact by at least one of said channels.

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