Semiconductor device image inspection with contrast enhancement

• US 6,587,582 B1
• Filed: 08/08/2001
• Issued: 07/01/2003
• Est. Priority Date: 03/21/1996
• Status: Expired due to Term

• Current Assignee: Cognex Corporation
• Original Assignee: Cognex Corporation
• Inventors: Nichani, Sanjay J., Scola, Joseph
• Primary Examiner(s): WERNER, BRIAN P
• Application Number:
  US09/924,902
• Time in Patent Office: 692 Days
• Field of Search: 382/144, 382/145, 382/173, 382/221, 382/146, 382/101, 382/147, 382/102, 382/148, 382/149, 348/87, 348/126, 438/15, 438/16, 250/559.46, 250/559.4, 250/559.41, 250/559.45, 702/40, 702/159, 700/110, 356/237.4, 356/237.5, 356/338, 356/339
• US Class Current: 382/149
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G01N 21/95684 Patterns showing highly reflecting parts, e.g. metallic elements

Abstract

Machine vision methods for inspection of semiconductor die lead frames include the steps of generating a first image of the lead frame, generating a second image of the lead frame and any defect thereon, and subtracting the second image from the first image. The methods are characterized in that the second image is generated such that subtraction of it from the first image emphasizes the defect with respect to the lead frame.

Claims

1. A machine vision method for inspecting a substantially flat surface, the method comprising:

generating with a digital camera a first image of the substantially flat surface and a defect thereon;

generating with the digital camera a second image of the substantially flat surface and the defect thereon, such that the defect in the second image is of a different contrast polarity with respect to the substantially flat surface than the defect in the first image with respect to the substantially flat surface;

comparing, for the purpose of contrast enhancement of reflectivity features of the defect with respect to the substantially flat surface, each pixel of the second image to each corresponding pixel of the first image;

generating a third image representing results of comparing each pixel; and

isolating the defect using the third image.

2. A method according to claim 1, where isolating comprises:

performing connectivity analysis on the third image to distinguish the defect from the substantially flat surface.

3. A method according to claim 1, wherein isolating comprises:

detecting and tracking edges in the third image to isolate the defect.

4. A method according to claim 1, wherein the isolating step includes:

thresholding the third image to distinguish at least one of a defect and its edges from the substantially flat surface.

5. A method according to claim 4, wherein thresholding comprises:

determining an intensity threshold value that distinguishes at least one of the defect and its edges from the the substantially flat surface.

6. A method according to claim 4, comprising:

generating a threshold image from at least one of the first and second images, the threshold image having pixels representing local threshold intensity values; and

using the threshold image to distinguish, in the third image, at least one of the defect and its edges from the substantially flat surface.

7. A method according to claim 6, wherein the step of generating the threshold image includes the step of mapping image intensity values in the second image to generate the threshold image.

8. A method according to claim 6, wherein the step of using the threshold image includes the step of subtracting the threshold image from the third image.

9. A method according to claim 1, further comprising:

normalizing at least one of the first and second images before comparing.

10. A method according to 9, wherein the normalizing step includes the steps of

determining distributions of intensity values of each of the first and second images;

generating a mapping function for matching extrema of those distributions; and

transforming the intensity values of at least one of the first and second images with that mapping function.

11. A method according to claim 1, including:

generating the first and second images by illuminating the substantially flat surface with different respective emission sources.

12. A method according to claim 1, including the step of generating the first and second images with light of different respective polarizations.

13. A method according to claim 1, including:

generating the first and second images by illuminating the substantially flat surface with emissions in different respective wavelengths.

14. A method according to claim 1, wherein

generating the first image includes the step of illuminating the substantially flat surface with a light source selected from the group of light sources including a direct light source and a grazing light source;

and

generating the second image includes illuminating the substantially flat surface with the other light source in that group.

15. A method according to claim 1, further comprising:

registering the first and second images with one another before comparing.