Hybrid MEMS fabrication method and new optical MEMS device

• US 6,587,613 B2
• Filed: 07/24/2001
• Issued: 07/01/2003
• Est. Priority Date: 07/24/2001
• Status: Active Grant

• Current Assignee: Teledyne Scientific & Imaging, LLC (Teledyne Technologies Incorporated)
• Original Assignee: Innovative Technology Licensing LLC
• Inventors: De Natale, Jeffrey F.
• Primary Examiner(s): Schwartz, Jordan M.
• Assistant Examiner(s): THOMPSON, TIMOTHY J
• Application Number:
  US09/911,818
• Publication Number:
  US 20030021523A1
• Time in Patent Office: 707 Days
• Field of Search: 438/31, 385/16, 385/17, 385/18
• US Class Current: 385/18
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 3/0083 Optical properties
• CPC Class Codes: B81C 1/00214 Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices
• CPC Class Codes: B81C 2201/053 Depositing a protective layers
• CPC Class Codes: G02B 6/3518 the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device MEMS devices in general B81B; manufacture of MEM devices in general B81C; micromechanical devices controlling the direction of light G02B26/0833
• CPC Class Codes: G02B 6/3584 constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C

Abstract

A new hybrid method of fabricating optical micro electro mechanical system (MEMS) devices is disclosed that uses both bulk and surface micromachining techniques, and a new optical MEMS device is also disclosed that is fabricated using the new method. The method includes the step of mounting a handle layer to one or more layers of MEMS structural material. Layers of structural and sacrificial material are then built up on the MEMS structural material using surface micromachining techniques. Drive electronics are mounted to the layers of structural and sacrificial material. The handle layer is removed to reveal the MEMS structural layer and the sacrificial material within the various layers is dissolved. The new method is particularly applicable to fabricating optical MEMS devices, with the handle layer being adjacent to a Si mirror layer. The surface micomachining layers form electrode and spring structures. Drive electronics are then mounted on the layers of structural material, so that a bias can be applied to the MEMS structures. The handle layer is removed from the mirror layer to reveal the mirror'"'"'s reflective surface, and the sacrificial material is dissolved away, freeing the MEMS structures to operate. For optical or other MEMS arrays, a linking framework can be included to attach the MEMS devices.

Claims

1. A hybrid method for fabricating micro electro mechanical system (MEMS) devices, comprising:

mounting a handle layer adjacent to a layer of MEMS structural material to protect the surface of said MEMS structural material;

building up layers of device structural and sacrificial material on said layer of MEMS structural material by surface micromachining, said layers of device structural material nd said layer of MEMS structural material forming a MEMS device;

mounting drive electronics to said layers of structural material;

removing said handle layer from said MEMS structural material; and

dissolving a away said layers of device sacrificial material to allow aid MEMS device to move under bias from said drive electronics.

2. The method of claim 1, wherein said handle layer is mounted to said layer of MEMS structural material by a sacrificial mounting layer/material.

4. The method of claim 2, wherein said handle layer is removed from said MEMS structural material by dissolving said mounting layer/material with a chemical etch, freeing said handle layer.

6. The method of claim 1, wherein said sacrificial material is dissolved by chemical etching.

7. The method of claim 1, wherein said MEMS device is in an array of MEMS devices, said method comprising the addition step of building up a linking framework on said structural and sacrificial material of said MEMS devices before the mounting of said drive electronics.

3. A hybrid method for fabricating micro electro mechanical system (MEMS) devices, comprising:

mounting a handle layer adjacent to a layer of MEMS structural material;

building up layers of structural and sacrificial material on said layer of MEMS structural material by surface micromachining;

mounting drive electronics to said layers of structural and sacrificial material;

removing said handle layer from said MEMS structural material by grinding; and

dissolving away said sacrificial material.

5. A hybrid method for fabricating micro electro mechanical system (MEMS) devices, comprising:

mounting a handle layer adjacent to a layer of MEMS structural material;

building up layers of structural and sacrificial material on said layer of MEMS structural material by surface micromachining;

mounting drive electronics to said layers of structural and sacrificial material by flip-chip mounting;

removing sad handle layer from said MEMS structural material; and

dissolving away said sacrificial material.

8. A hybrid method of fabricating optical micro electro mechanical system (MEMS) devices, comprising:

mounting a handle layer adjacent to a mirror layer, to hold and protect said mirror layer;

building up layers of structural and sacrificial materials on said mirror layer using surface micromachining, said structural material forming MEMS structures;

mounting drive electronics to said layers of sacrificial and structural material, said drive electronics mounted so that a bias can be applied to said MEMS structures;

removing said handle layer from said mirror layer; and

dissolving away said sacrificial material, freeing said MEMS structures to operate under said bias.

9. The method of claim 8, wherein said mirror layer and handle layer are silicon (Si) that together form a silicon on insulator (SOI) substrate.

10. The method of claim 8, wherein said surface micromachining structural material forms spring structures and an electrode.

11. The method of claim 10, wherein said bias is applied across said mirror and said electrode, said spring structure allowing said mirror layer to move when said bias is applied and return when said bias is removed.

12. The method of claim 10, wherein said spring structure runs between said drive electronics and said mirror to hold said mirror above said drive electronics after said sacrificial material is dissolved.

13. The method of claims 10, wherein said electrode is in electrical connection with said drive electronics and is arranged between said drive electronics and said mirror.

14. The method of claim 11, wherein an electrostatic tension is created between said electrode and said mirror when a bias is applied across the two, said electrostatic tension drawing said mirror toward said drive electronics.

15. The method of claim 8, wherein said handle layer is mounted to said mirror by a sacrificial mounting layer/material.

16. The method of claim 8, wherein said handle layer is removed from said mirror layer by grinding.

17. The method of claim 15, wherein said handle layer is removed from said mirror layer by dissolving said mounting layer/material with a chemical etch, freeing said handle layer.

18. The method of claim 8, wherein said drive electronics are mounted to said layers of structural and sacrificial material by flip-chip mounting.

19. The method of claim 8, wherein said sacrificial material in said layers of structural and sacrificial material is dissolved by chemical etching.

20. The method of claim 8, wherein said optical MEMS device is one of a plurality of MEMS devices in an array, said method comprising the addition step of building up a linking framework on said layers of structural and sacrificial material before said step of mounting said drive electronics, said linking framework arranged between said layers of structural and sacrificial material and said drive electronics.

21. The method of claim 20, wherein said linking framework is formed by building up additional layers of structural and sacrificial materials.

22. An optical micro electro mechanical system (MEMS) device fabricated using a hybrid fabrication process, comprising:

a mirror fabricated using bulk micromachining;

a substrate with drive electronics to activate said mirror; and

a spring structure and an electrode fabricated using surface micromachining techniques, said spring structure connected between said substrate and mirror, and holding said mirror above said substrate, said electrode mounted on said substrate between said mirror and said substrate, a bias across said mirror and said electrode causing said mirror to be drawn toward said electrode.

23. The device of claim 22, further comprising a linking framework between substrate and said spring structure and electrode, said framework connecting said MEMS device to other MEMS devices in an array.

24. An array of optical micro electro mechanical system (MEMS) devices, comprising:

a plurality of optical MEMS devices, each comprising;

mirror fabricated using bulk micromachining;

a spring structure and an electrode fabricated using surface micromachining techniques, said spring structure connected to said mirror;

a linking framework attached to said optical MEMS devices to link them adjacent to one another, each said spring structure and electrode connected to said framework, said electrode between said framework and said mirror; and

a substrate with drive electronics mounted to said linking framework to apply a bias across spring structure and electrode causing said mirror to be drawn toward said electrode.

25. A hybrid method for fabricating micro electro mechanical system (MEMS) devices, comprising:

building up layers of structural and sacrificial material on a layer of bulk micromachining material by surface micromachining, said layers of structural material and said layer of bulk micromachining material forming a MEMS device;

mounting drive electronics to said layers of structural material;

etch micromachining said layer of bulk micromachining material; and

dissolving away said sacrificial material to allow said MEMS device to move freely.

26. The method of claim 25, wherein said bulk micromaching material comprises a handle layer mounted to layer of MEMS structural material by a sacrificial mounting layer/material.

27. The method of claim 26, wherein said handle layer is removed from said MEMS structural material by dissolving said mounting layer/material with a chemical etch, freeing said handle layer.

28. The method of claim 25, wherein said sacrificial material is dissolved by chemical etching.

29. The method of claim 25, wherein said MEMS device is in an array of MEMS devices, said method comprising the addition step of building up a linking framework on said structural and sacrificial material of said MEMS devices before the mounting of said drive electronics, said linking framework attaching said MEMS devices.