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Intelligent binning for electrically repairable semiconductor chips

  • US 6,587,980 B2
  • Filed: 08/28/2002
  • Issued: 07/01/2003
  • Est. Priority Date: 08/02/1996
  • Status: Expired due to Fees
First Claim
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1. A system for semiconductor devices comprising:

  • testing apparatus for performing at least one test of a first type on at least one semiconductor device consisting of a semiconductor device for identifying one or more types of failures in the at least one semiconductor device, the testing apparatus including a support for supporting a semiconductor device under test;

    processing circuitry for communicating with the testing apparatus and for determining at least one type of failure of a number of the identified types of failures, the processing circuitry providing at least one signal indicative of the at least one type of failure; and

    decision circuitry for receiving the at least one signal indicative of the at least one type of failure of the number of the identified types of failures and for considering the at least one type of failure of the number of the identified types of failures in one of designating the at least one semiconductor device for an additional procedure, for designating the at least one semiconductor device for repair, and for designating the at least one semiconductor device for additional tests of the first type, the decision circuitry for designating the at least one semiconductor device for the additional procedure if the at least one type of failure of the number of the identified types of failures is within a first number set, designating the at least one semiconductor device for repair if the number of the identified types of failures is within a second number set, and determining when the at least one semiconductor device is repairable.

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