Thermoelectric spot coolers for RF and microwave communication integrated circuits

• US 6,588,217 B2
• Filed: 12/11/2000
• Issued: 07/08/2003
• Est. Priority Date: 12/11/2000
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Ghoshal, Uttam Shyamalindu
• Primary Examiner(s): Doerrler, William C.
• Assistant Examiner(s): Shulman, Mark S.
• Application Number:
  US09/734,519
• Publication Number:
  US 20020092307A1
• Time in Patent Office: 939 Days
• Field of Search: 62/32, 62/34, 62/36, 62/37, 622/592
• US Class Current: 62/3.7
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H10N 10/00 Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects integrated devices or assemblies of multiple devices H10N19/00

Abstract

An apparatus for cooling selected elements within an integrated circuit, such as active transistors or passive circuit elements used in a radio frequency integrated circuit is provided. In one embodiment, the cooling apparatus includes a cold plate thermally coupled to the region proximate the integrated circuit element, a thermoelectric cooler thermally coupled to the cold plate; and a hot plate thermally coupled to the thermoelectric cooler. Heat is removed from the integrated circuit element through the cold plate and transmitted to the hot plate through the thermoelectric cooler. In one form, the hot plate is located or coupled to an exterior surface of an integrated circuit, such that heat transmitted to the ambient from the integrated circuit element is dissipated into the atmosphere surrounding the integrated circuit. In another form, the hot plate is embedded in the integrated circuit substrate to locally cool elements of the integrated circuit while dumping the heat into the substrate.

Claims

1. An apparatus for cooling an element of an integrated circuit, comprising:

a cold plate thermally coupled to a selected element within the integrated circuit through a path defined by at least one patterned integrated circuit layer;

a thermoelectric cooler thermally coupled to the cold plate; and

a hot plate thermally coupled to the thermoelectric cooler;

wherein

heat is selectively removed from the selected element within the integrated circuit through the cold plate and transmitted to the hot plate through the thermoelectric cooler; and

the hot plate is exposed at a surface of the integrated circuit to dissipate heat into the surrounding atmosphere.

2. The apparatus as recited in claim 1, wherein current is provided to the thermoelectric cooler from a field effect transistor within the integrated circuit, said drain being electrically coupled to said thermoelectric cooler by a via structure.

3. The apparatus as recited in claim 1, wherein the cold plate is thermally coupled to the selected element within the integrated circuit by a thermal conductor, the thermal conductor providing at least partial electrical isolation of the cold plate from the selected element of the integrated circuit.

4. The apparatus as recited in claim 1, wherein the selected element within the integrated circuit is a transistor and the cold plate is thermally coupled to both a drain and a source of the transistor.

5. The apparatus as recited in claim 4, wherein the transistor is a low noise amplifier transistor.

6. The apparatus as recited in claim 4, wherein the transistor is a silicon-on-oxide transistor.

7. The apparatus as recited in claim 1, wherein the selected element within the integrated circuit is a capacitor.

8. The apparatus as recited in claim 1, wherein the selected element within the integrated circuit is an inductor.

9. The apparatus as recited in claim 1, wherein the selected element within the integrated circuit is utilized in a radio frequency circuit.

10. The apparatus as recited in claim 1, wherein the thermoelectric cooler is a quantum point cooler.

11. An apparatus for cooling an element of an integrated circuit, comprising:

a cold plate thermally coupled to a selected element within the integrated circuit;

a thermoelectric cooler thermally coupled to the cold plate; and

a hot plate thermally coupled to the thermoelectric cooler;

wherein

the hot plate is thermally coupled to sink heat into a bulk substrate within the integrated circuit; and

heat from the integrated circuit element is transported from the cold plate through the thermoelectric cooler and dissipated into the bulk substrate through the hot plate.

12. The apparatus as recited in claim 11, wherein the integrated circuit element is an inductor.

13. The apparatus as recited in claim 12, wherein the inductor is a spiral inductor.

14. The apparatus as recited in claim 11, wherein the cold plate is partially supported away from a surface of the integrated circuit element by a support.

15. The apparatus as recited in claim 14, wherein the support comprises photoresist.

16. The apparatus as recited in claim 11, wherein the integrated circuit element is utilized within a radio frequency circuit.

17. The apparatus as recited in claim 16, wherein the radio frequency circuit comprises an antenna.

18. The apparatus as recited in claim 16, wherein the radio frequency circuit comprises a passive antenna.

19. The apparatus as recited in claim 16, wherein the radio frequency circuit comprises a low noise amplifier.

20. The apparatus as recited in claim 16, wherein the radio frequency circuit comprises a mixer.

21. The apparatus as recited in claim 16, wherein the radio frequency circuit comprises a quadrature oscillator.

22. The apparatus as recited in claim 16, wherein the radio frequency circuit comprises a power amplifier.

23. The apparatus as recited in claim 11, wherein the thermoelectric cooler is a quantum point cooler.

24. An apparatus for cooling an element of an integrated circuit, comprising:

a cold plate thermally coupled to a selected element within the integrated circuit through a path defined by at least one patterned integrated circuit layer;

a thermoelectric cooler thermally coupled to the cold plate; and

a hot plate thermally coupled to the thermoelectric cooler;

wherein

heat is selectively removed from the selected element within the integrated circuit through the cold plate and transmitted to the hot plate through the thermoelectric cooler; and

the hot plate is coupled to a passive element for dissipating heat.

25. The apparatus as recited in claim 24, wherein current is provided to the thermoelectric cooler from a field effect transistor within the integrated circuit, said drain being electrically coupled to said thermoelectric cooler by a via structure.

26. The apparatus as recited in claim 24, wherein the thermoelectric cooler is a quantum point cooler.

27. An integrated circuit structure, comprising:

a thermoelectric cooler formed in a plurality of first layers of the integrated circuit structure;

a circuit component formed in at least one second layer of the integrated circuit structure;

a cold plate formed in a third layer of the integrated circuit structure thermally coupled to at least a portion of the circuit component through a path defined by at least one patterned integrated circuit layer and thermally coupled to the thermoelectric cooler; and

a hot plate formed in a fourth layer of the integrated circuit structure thermally coupled to the thermoelectric cooler and electrically isolated from the circuit component, wherein

heat is selectively removed from the circuit component and transferred to the hot plate.

29. The integrated circuit structure as recited in claim 27, wherein the circuit component comprises an inductor.

30. The integrated circuit structure as recited in claim 27, wherein the circuit component comprises a transistor.

31. The integrated circuit structure as recited in claim 30, wherein the cold plate is thermally coupled to two electrodes of the transistor.

32. The integrated circuit structure as recited in claim 31, wherein the hot plate is thermally coupled to the integrated circuit substrate and heat transferred from the circuit component to the hot plate is dissipated in the integrated circuit substrate.

33. The integrated circuit structure as recited in claim 27, wherein the hot plate dissipates heat into a surrounding atmosphere.

28. The integrated circuit structure as recited in 27, wherein at least one of the plurality of first layers comprise the at least one second layer.