Temperature sensor with flexible circuit substrate

• US 6,588,931 B2
• Filed: 12/07/2000
• Issued: 07/08/2003
• Est. Priority Date: 12/07/2000
• Status: Expired due to Fees

• Current Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Boehm, Michael J., Straub, Peter J., OʼConnell, David P., Betzner, Timothy M.
• Primary Examiner(s): Gutierrez, Diego
• Assistant Examiner(s): VERBITSKY, GAIL KAPLAN
• Application Number:
  US09/732,287
• Publication Number:
  US 20020071475A1
• Time in Patent Office: 943 Days
• Field of Search: 374/185, 374/208, 338/25, 338/28, 338/22.R, 439/877, 439/878
• US Class Current: 374/185
• CPC Class Codes: G01K 7/22 the element being a non-linear resistance, e.g. thermistor G01K7/26 takes precedence

Abstract

A temperature sensor incorporating flexible circuit technology. A flexible circuit sensor subassembly is composed of a flexible printed circuit substrate on which is printed a sensor circuit. In a preferred example the flexible circuit sensor subassembly, the sensor circuit has a sensor at a distal end, as for example a surface mount device (SMD) thermistor, a plurality of trace pads at a proximate end, and an interconnecting conductive trace between each trace pad and the sensor. A crimp terminal is respectively crimped onto each trace pad to provide a flexible circuit sensor assembly, wherein the crimp terminals are configured as needed for interfacing with an external circuit. The location of the sensor may be selectively located anywhere on the conductive traces to thereby easily size the probe length of the flexible circuit sensor subassembly to suit a any particular application and fit into any housing. A housing id molded over the flexible circuit sensor assembly. The housing either alone or located in an external shell provides a temperature sensor for a particular purpose. In a variation of the flexible circuit sensor assembly, electronic components can be integrated with the sensor circuit to provide a smart sensor circuit, which may include multiple sensing devices.

Claims

1. A sensor assembly, comprising:

a flexible circuit substrate having a base portion and an integral probe portion;

a sensor circuit printed onto said flexible circuit substrate, said sensor circuit comprising a plurality of trace pads located at said base portion, at least one sensor located at said probe portion, and a plurality of traces interconnecting said at least one sensor with said plurality of trace pads;

a terminal respectively connected to each trace pad for connecting said sensor circuit to an external electrical circuit; and

a plastic housing molded over said sensor circuit and said flexible circuit substrate;

wherein each said terminal comprises a crimp pad for providing a crimped connection to each trace pad, respectively; and

wherein said housing provides an anchorage for each said terminal.

2. The sensor assembly of claim 1, wherein said probe portion is elongated and narrower in relation to said base portion.

3. The sensor assembly of claim 1, wherein said at least one sensor is a surface mount device thermistor.

4. The sensor assembly of claim 1, further comprising a shell covering a selected portion of said housing.

5. The sensor assembly of claim 4, wherein said at least one sensor is a surface mount device thermistor.

6. A smart sensor assembly, comprising:

a flexible circuit substrate having a base portion and an integral probe portion;

a smart sensor circuit printed onto said flexible circuit substrate, said smart sensor circuit comprising a plurality of trace pads located at said base portion, at least one sensor located at said probe portion, an electronic device, and conductive traces for connecting said at least one sensor to said plurality of trace pads through said electronic device;

a terminal respectively connected to each trace pad for connecting said smart sensor circuit to an external electrical circuit; and

a plastic housing molded over said sensor circuit and said flexible circuit substrate;

wherein each said terminal comprises a crimp pad for providing a crimped connection to each trace pad, respectively; and

wherein said housing provides an anchorage for each said terminal.

7. The sensor assembly of claim 6, wherein said electronic device is a signal conditioning circuit for said at least one sensor.

8. The sensor assembly of claim 6, wherein said at least one sensor is at least one surface mount device thermistor.

9. The sensor assembly of claim 6, further comprising a shell covering a selected portion of said housing.

10. The sensor assembly of claim 9, wherein said at least one sensor is at least one surface mount device thermistor.