Method and apparatus for hermetically sealing photonic devices

• US 6,588,949 B1
• Filed: 12/30/1998
• Issued: 07/08/2003
• Est. Priority Date: 12/30/1998
• Status: Expired due to Term

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Zhou, Ping
• Primary Examiner(s): Font, Frank G.
• Assistant Examiner(s): Punnoose, Roy M.
• Application Number:
  US09/224,210
• Time in Patent Office: 1,651 Days
• Field of Search: 385/88, 385/92, 385/94, 372/107, 372/108
• US Class Current: 385/94
• CPC Class Codes: H01S 5/0222 Gas-filled housings
• CPC Class Codes: H01S 5/02253 using lenses
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Abstract

A hermetically sealed photonic device submount includes a photonic device mounted on a substrate material and sealed in a flexible hermetic seal. In one configuration, the photonic device is configured to emit or to receive light through the substrate material. In this configuration, the photonic device is covered with an adhesive layer and a metal layer deposited onto the adhesive layer. In another configuration, the photonic device is configured to emit or to receive light in a direction substantially vertically upward from the substrate material. In this configuration, a cover is placed over the photonic device, then the cover is hermetically sealed to the substrate material with an adhesive layer and a metal layer depositd onto the adhesive layer. In both configurations, the photonic device submounts are hermetically sealed according to various aspects of the present invention on the substrate material without using a separate package. Accordingly, any number of hermetically sealed photonic device submounts can be mass produced on wafers using the present invention.

Claims

1. A hermetically sealed photonic device submount comprising:

a substrate material having a top surface;

a photonic device mounted on said top surface of said substrate material; and

a hermetic seal sealing said photonic device on said top surface of said substrate material, wherein said hermetic seal comprises an adhesive layer encompassing said photonic device and a first metallic layer disposed on said adhesive layer.

2. A hermetically sealed photonic device submount in accordance with claim 1, wherein said substrate material is transmissive to light and said photonic device is configured to transmit or to receive light through said substrate material.

3. A hermetically sealed photonic device submount in accordance with claim 2, wherein said substrate material is formed from glass.

4. A hermetically sealed photonic device submount in accordance with claim 2, wherein said substrate material has a bottom surface and further comprises a photo resist layer formed on said bottom surface for passive alignment with optical fibers.

5. A hermetically sealed photonic device submount in accordance with claim 4, wherein said photo resist layer is configured with alignment holes for passive alignment of optical fibers.

6. A hermetically sealed photonic device submount in accordance with claim 4, wherein said photo resist layer is configured with an alignment slot for passive alignment optical fibers.

7. A hermetically sealed photonic device submount in accordance with claim 2, wherein said hermetic seal encloses said photonic device mounted on said top surface of said substrate material.

8. A hermetically sealed photonic device submount in accordance with claim 2 further comprising a ferrule, wherein the photonic device is mounted to said ferrule such that said photonic device transmits or receives light into or out of said ferrule.

9. A hermetically sealed photonic device submount in accordance with claim 1, wherein said photonic device is configured to transmit or to receive light substantially vertically upward from said substrate material.

10. A hermetically sealed photonic device submount in accordance with claim 9 further comprising a cover disposed over said photonic device, said cover being configured to permit said photonic device to transmit or to receive light through said cover.

11. A hermetically sealed photonic device submount in accordance with claim 10 wherein said cover is configured with at least one lens configured to facilitate the transmission of light to or from said photonic device.

12. A hermetically sealed photonic device submount in accordance with claim 10 further comprising a spacer disposed between said cover and said substrate material to support said cover over said photonic device and to provide a gap between said cover and said photonic device.

13. A hermetically sealed photonic device submount in accordance with claim 12, wherein said cover and said spacer are sealed to said substrate by said hermetic seal.

14. A hermetically sealed photonic device submount in accordance with claim 1, wherein said first metal layer is chromium.

15. A hermetically sealed photonic device submount in accordance with claim 1, further comprising a second metal layer disposed on said first metal layer.

16. A hermetically sealed photonic device submount in accordance with claim 15, wherein said second metal layer is gold.

17. A hermetically sealed photonic device submount in accordance with claim 15, further comprising a solder layer disposed on said second metal layer.

18. A hermetically sealed photonic device submount in accordance with claim 1, further comprising a flexible protective layer disposed over said first metal layer.

19. A hermetically sealed photonic device submount in accordance with claim 18, wherein said flexible protective layer is a polyamide.

20. A hermetically sealed photonic device submount in accordance with claim 1 further comprising:

a plurality of signal lines disposed on said top surface of said substrate material; and

a dielectric layer disposed between said plurality of signal lines and said hermetic seal.

21. A hermetically sealed photonic device submount comprising:

a substrate material having a top surface, said substrate material being transmissive to light;

a photonic device mounted on said top surface of said substrate material, said photonic device configured to transmit or to receive light through said substrate material; and

a hermetic seal formed over said photonic device on said top surface of said substrate material, wherein said hermetic seal comprises an adhesive layer encompassing the photonic device and a first metallic layer disposed on said adhesive layer.

22. A hermetically sealed photonic device submount in accordance with claim 21, wherein said substrate material is formed from glass.

23. A hermetically sealed photonic device submount in accordance with claim 21, wherein said substrate material has a bottom surface and further comprises a photo resist layer formed on said bottom surface for passive alignment of optical fibers.

24. A hermetically sealed photonic device in accordance with claim 21, wherein said hermetic seal comprises a second metal layer disposed over said first metal layer.

25. A hermetically sealed photonic device submount in accordance with claim 24, wherein said hermetic seal further comprises a solder layer disposed over said second metal layer.

26. A hermetically sealed photonic device submount comprising:

a substrate material having a top surface;

a photonic device mounted on said top surface of said substrate material;

a cover disposed over said photonic device, wherein said photonic device is configured to transmit or to receive light through said cover; and

a hermetic seal sealing said cover to said substrate material, wherein said hermetic seal comprises an adhesive layer disposed around the edges of said cover and a first metallic layer disposed on said adhesive layer.

27. A hermetically sealed photonic device submount in accordance with claim 26 further comprising a spacer disposed under said cover to support said cover over said photonic device and to provide a gap between said cover and said photonic device.

28. A hermetically sealed photonic device submount in accordance with claim 26 wherein said cover is configured with lenses for facilitating transmission of light to or from said photonic device.

29. A hermetically sealed photonic device submount in accordance with claim 26 wherein said hermetic seal further comprises a second metal layer disposed over said first metal layer.