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Assembly containing an electrolytically severable joint for endovascular embolic devices

  • US 6,589,236 B2
  • Filed: 02/28/2002
  • Issued: 07/08/2003
  • Est. Priority Date: 02/19/1998
  • Status: Expired due to Fees
First Claim
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1. A process for forming an occlusion in a body cavity, comprising:

  • advancing an implant to a body cavity, said implant being detachably connected to a composite core wire via an electrolytically erodable junction, said composite core wire comprising a first conductive member selectively movable with respect to the composite core wire, said implant comprising a second conductive member separated from said first conductive member, said junction being electrically insulated from said first conductive member and said second conductive member, said implant forming a return path for current provided to said first conductive member through ionic body fluids;

    advancing said first conductive member into a separable electrical contact with said second conductive member when said implant is at a desired location; and

    electrolytically eroding said junction to separate said second conductive member from said first conductive member and release said implant from said composite core wire.

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