Application method of sealing agent

• US 6,589,601 B1
• Filed: 01/02/2002
• Issued: 07/08/2003
• Est. Priority Date: 04/23/1999
• Status: Expired due to Fees

• Current Assignee: Nordson Corporation
• Original Assignee: Nordson Corporation
• Inventors: Shimada, Takaji
• Primary Examiner(s): BARR, MICHAEL E
• Application Number:
  US09/959,225
• Time in Patent Office: 552 Days
• Field of Search: 427/419.2, 427/58, 427/230, 427/348
• US Class Current: 427/348
• CPC Class Codes: B05C 11/06 with a blast of gas or vapour
• CPC Class Codes: B05C 5/0216 by relative movement of article and outlet according to a predetermined path
• CPC Class Codes: F16J 15/14 by means of granular or plastic material, or fluid
• CPC Class Codes: H01J 2217/49264 Vessels
• CPC Class Codes: H01J 29/90 Leading-in arrangements; Seals therefor
• CPC Class Codes: H01J 9/261 the vessel being for a flat panel display for flat discharge lamps H01J9/268
• CPC Class Codes: H01J 9/32 Sealing leading-in conductors
• CPC Class Codes: H01J 9/323 Sealing leading-in conductors into a discharge lamp or a gas-filled discharge device

Abstract

In the process for producing a laminated substrate (1) such as electronic substrates (2; 3), when applying a sealing agent (7) to the end face of substrates (2; 3) combined together to seal it, first the sealing agent (7) is applied to a target area in the form of successive beads (7), and then a stream of compressed gas (10) is blown against the successive beads (7) from a gas ejecting nozzle (9) so as to scan the successive beads (7). The method can effectively fill the indentation or the stepped area formed along the end face with the sealing agent (7).

Claims

1. A method of sealing a gap between first and second objects with a fluid material, the method comprising:

applying a bead of the fluid material adjacent to an end face of the first object; and

discharging a stream of compressed gas from a gas ejecting nozzle to impinge upon the bead of the fluid material such that the fluid material is forced into the gap between the first and second objects.

2. The method of claim 1 wherein the gap is formed at a side edge of the first object and the gap is filled with the fluid material.

3. The method of claim 1 wherein the fluid material is a viscous epoxy material.

4. The method of claim 1 wherein the fluid material is a viscous silicon type material.

5. The method of claim 1, wherein the first and second objects are components of an electronic device.