Hermetic seal and method to create the same

• US 6,589,625 B1
• Filed: 08/01/2001
• Issued: 07/08/2003
• Est. Priority Date: 08/01/2001
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Iridigm Display Corporation (Qualcomm, Inc.)
• Inventors: Kothari, Manish, Chui, Clarence
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US09/921,196
• Time in Patent Office: 706 Days
• Field of Search: 428/47, 428/49, 428/428, 428/432, 428/46, 428/76, 428/351, 428/355.R, 428/192, 961/54
• US Class Current: 428/46
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: Y10T 428/162 Transparent or translucent layer or section
• CPC Class Codes: Y10T 428/166 Glass, ceramic, or metal sections [e.g., floor or wall tile, etc.]
• CPC Class Codes: Y10T 428/239 Complete cover or casing
• CPC Class Codes: Y10T 428/24777 Edge feature
• CPC Class Codes: Y10T 428/2852 Adhesive compositions

Abstract

An electronic display screen is created by processing a mirror on a substrate glass. A back plate glass is then placed on top of the substrate glass and sealed to the back plate glass. A hermetic seal that includes an adhesive mixed with zeolites is disclosed. The hermetic seal can seal the back plate glass with the substrate glass. The application of the hermetic seal is not limited to the electronic display screen. Rather, the hermetic seal can be used to seal a variety of surfaces including metals, polymers, plastics, alloys, ceramics and the like.

Claims

1. A micro-electromechanical systems based device package comprising:

a back plate glass;

a substrate glass;

a bead of an adhesive mixed with a zeolite applied between the back plate glass and the substrate glass; and

a mirror processed on the substrate glass.

2. The micro-electromechanical systems based device package of claim 1, including the bead being applied around the perimeter of the mirror.

3. The micro-electromechanical systems based device package of claim 1, wherein the bead acts as a hermetic seal.

4. The micro-electromechanical systems based device package of claim 1, wherein the bead traps moisture and other contaminant gases that can be harmful to the mirror.

5. The micro-electromechanical systems based device package of claim 1, wherein the micro-electromechanical systems device includes an electronic display screen.

6. A micro-electromechanical systems based device package comprising:

a back plate glass;

a substrate glass; and

a bead of an adhesive mixed with zeolites of different pore sizes applied between the back plate glass and the substrate glass, wherein the zeolites of different pore sizes are selected to absorb molecules of different diameters.

7. The micro-electromechanical systems based device package of claim 6, wherein some of the zeolites have a pore size to allow absorption of molecules having a diameter of up to ten angstroms.

8. The micro-electromechanical systems based device package of claim 6, wherein some of the zeolites have a pore size to allow absorption of molecules having a diameter of less than two angstroms.

9. The micro-electromechanical systems based device package of claim 6, wherein the pore sizes of some of the zeolites allow absorption of nitrogen and carbon dioxide molecules.

10. A micro-electromechanical systems based device package comprising:

a back plate glass;

a substrate glass; and

a bead of an adhesive mixed with a zeolite applied between the back plate glass and the substrate glass, wherein the zeolite is selected to have a pore size which allows the zeolite to absorb a contaminant gas that is outgassed by components of the package, and wherein said pore size is up to fifty Angstroms.

11. The micro-electromechanical systems based device package of claim 10, wherein the zeolite has a pore size that allows it to absorb aromatic branched-chain hydrocarbons.

12. The micro-electromechanical systems based device package of claim 10, wherein the zeolite has a pore size that allows it to absorb hydrogen molecules.

13. The micro-electromechanical systems based device package of claim 10, wherein the zeolite has a pore size that allows it to absorb nitrogen and carbon dioxide molecules.