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Film thickness control using spectral interferometry

  • US 6,589,869 B2
  • Filed: 04/23/2002
  • Issued: 07/08/2003
  • Est. Priority Date: 12/23/1999
  • Status: Expired due to Fees
First Claim
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1. A method for controlling a substrate processing chamber, said method comprising:

  • transferring a substrate into said substrate processing chamber;

    performing a first substrate operation on the substrate disposed within the substrate processing chamber;

    measuring a plurality of wavelengths of radiation reflected from an upper surface of said substrate during the first substrate processing operation;

    converting each of the plurality of measured wavelengths into digital data; and

    comparing the digital data in real time with the digital data collected from a previous substrate processing operation using a principal component analysis pattern recognition technique.

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