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Method for hermetic leadless device interconnect using a submount

  • US 6,590,283 B1
  • Filed: 02/28/2000
  • Issued: 07/08/2003
  • Est. Priority Date: 02/28/2000
  • Status: Expired due to Term
First Claim
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1. A method of hermetically sealing and providing with electrical connections a semiconductor device having an electrical input/output contact surface including at least one contact in a region to be sealed comprising the steps of:

  • providing the device with a sealable peripheral contact around the region to be sealed;

    providing a submount for receiving the device, the submount comprising an insulating body having a first level including mounting contact surface and a second level, the mounting contact surface including a sealable peripheral contact corresponding to the device peripheral contact and a feed-through electrical contact to the second level corresponding to the contact to be sealed; and

    soldering the device on the submount so that the device sealable peripheral contact seals with the submount peripheral contact and the device interior contact connects with the submount feed-through contact.

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