Method for hermetic leadless device interconnect using a submount

• US 6,590,283 B1
• Filed: 02/28/2000
• Issued: 07/08/2003
• Est. Priority Date: 02/28/2000
• Status: Expired due to Term

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agere Systems Incorporated (Broadcom, Inc.)
• Inventors: Zolnowski, Dennis Ronald
• Primary Examiner(s): Williams, Alexander O.
• Application Number:
  US09/513,634
• Time in Patent Office: 1,226 Days
• Field of Search: 438/123, 438/612-614, 438/106, 438/124, 257/778, 257/738, 257/737, 257/777, 257/686, 257/692, 257/693, 257/690, 759/774, 759/691, 759/668, 174/265, 228/124.5
• US Class Current: 257/698
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

In accordance with the invention, a semiconductor device having an electrical input/output contact surface is hermetically sealed and provided with connections via a submount such as a two-level ceramic substrate. The device is provided with a contact surface having a sealable peripheral contact and one or more interior contacts. The submount is provided with a peripheral sealable contact corresponding to the device peripheral contact and one or more feed-through contacts corresponding to the device interior contacts. The sealable peripheral contacts surround the interior contacts providing heremetic sealing.

Claims

1. A method of hermetically sealing and providing with electrical connections a semiconductor device having an electrical input/output contact surface including at least one contact in a region to be sealed comprising the steps of:

providing the device with a sealable peripheral contact around the region to be sealed;

providing a submount for receiving the device, the submount comprising an insulating body having a first level including mounting contact surface and a second level, the mounting contact surface including a sealable peripheral contact corresponding to the device peripheral contact and a feed-through electrical contact to the second level corresponding to the contact to be sealed; and

soldering the device on the submount so that the device sealable peripheral contact seals with the submount peripheral contact and the device interior contact connects with the submount feed-through contact.

2. The method of claim 1 wherein the submount first level includes a lead to the sealable peripheral contact on the mounting surface and the submount second level includes a lead to the feed-through contact.

3. The method of claim 1 wherein the soldering is carried out in a dry inert gaseous ambient.