Double-metal background driven displays

• US 6,590,346 B1
• Filed: 07/16/2001
• Issued: 07/08/2003
• Est. Priority Date: 07/16/2001
• Status: Expired due to Term

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Hadley, Mark Alfred, Eisenhardt, Randolph Wilfred
• Primary Examiner(s): Philogene, Haissa
• Application Number:
  US09/906,627
• Time in Patent Office: 722 Days
• Field of Search: 315/169.3, 315/169.1, 438/22-24, 438/27-30, 438/98, 438/106, 438/758, 438/761, 438/928, 438/971, 438/974, 349/45, 349/52, 349/69, 428/209, 313/506, 313/509, 313/511, 313/521, 257/693, 257/698, 257/701, 257/686
• US Class Current: 315/169.3
• CPC Class Codes: H01L 2224/2413 Connecting within a semiconductor or solid-state body
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95092 Atmospheric pressure, e.g. dry self-assembly
• CPC Class Codes: H01L 2224/95122 by applying vibration
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H10K 2102/311 : Flexible OLED
• CPC Class Codes: H10K 50/80 : Constructional details
• CPC Class Codes: H10K 50/88 : Terminals, e.g. bond pads
• CPC Class Codes: H10K 59/12 : Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/131 : Interconnections, e.g. wiring lines or terminals

Abstract

Method and apparatus for electrical devices. An electronic assembly comprises at least one object having a first electrical circuitry therein. The object is created and separated from a host substrate. The assembly further comprises a receiving substrate having at least one recess. A bottom conducting layer is deposited over the receiving substrate and the recess. The object is then coupled to the receiving substrate such that the object is deposited on the bottom conducting layer and recessed within the first recess and below a surface of the receiving substrate. An insulation layer having a plurality of vias is disposed over the receiving substrate to insulate the bottom conducting layer and the object. A top conducting is deposited over the insulation layer and is making electrical interconnections to the bottom conducting layer and the object through the vias.

Claims

1. An electronic assembly comprising:

at least one object created and separated from a host substrate, said at least one object having a first electrical circuitry therein;

a flexible receiving substrate having at least one recess, said flexible receiving substrate including said at least one recess being covered with a bottom conducting layer;

wherein said at least one object couples to said flexible receiving substrate such that said at least one object is deposited on said bottom conducting layer and is recessed within said at least one recess of said receiving substrate; and

a top conducting layer to facilitate electrical interconnections from said at least one object to said bottom conducting layer is coupled to said flexible receiving substrate.

2. An electronic assembly as in claim 1 further comprising an insulation layer disposing over said receiving substrate and said at least one object such that said insulation layer insulating said bottom conducting layer and said at least one object, said insulation layer including a plurality of vias through which said electrical interconnections occur.

3. An electronic assembly as in claim 2 wherein said at least one object is deposited below a surface of said flexible receiving substrate.

4. An electronic assembly as in claim 3 wherein said bottom conducting layer is patterned layer.

5. An electronic assembly as in claim 4 wherein said bottom conducting layer drives a backplane of a display.

6. An electronic assembly as in claim 5 wherein said at least one object is an integrated circuit.

7. An electronic assembly as in claim 6 wherein said bottom conducting layer is a reflective material.

8. An electronic assembly as in claim 7 wherein said bottom conducting layer makes said electrical interconnections through said vias to said at least one object such that said electrical interconnections are only made to a top side of said at least one object.

9. An electronic assembly as in claim 8 wherein said flexible receiving substrate is nonconductive.

10. An electronic assembly comprising:

at least one object created and separated from a host substrate, said at least one object having a first electrical circuitry therein;

a flexible receiving substrate having at least one recess, said flexible receiving substrate including said at least one recess being covered with a bottom conducting layer;

wherein said at least one object couples to said flexible receiving substrate such that said at least one object being deposited on said bottom conducting layer and is recessed within said at least one recess of said flexible receiving substrate; and

a top conducting layer to facilitate electrical interconnections from said at least one object is coupled to said flexible receiving substrate;

wherein said bottom conducting layer is an optical reflector.

11. An electronic assembly as in 10 wherein said bottom conducting layer is a solar cell reflector.

12. An electronic assembly as in 11 wherein said bottom conducting layer is made out of aluminum.

13. A display device comprising:

an array of display drivers to drive pixel electrodes, each of said display drivers includes an electrical circuitry therein and is created and separated from a host substrate;

a receiving substrate having an array of recesses, said receiving substrate including said recesses is covered with a bottom conducting layer;

wherein each of said display drivers is coupled to said receiving substrate such that said display drivers are deposited on said bottom conducting layer and recessed within said each of said recesses;

an insulation layer disposing over said receiving substrate such that said insulation layer insulates said bottom conducting layer and said display drivers; and

a top conducting layer to facilitate electrical interconnections between said display drivers and said pixel electrodes is coupled to said receiving substrate.

14. A display device as in claim 13 wherein said array of display drivers controls said display device.

15. A display device as in claim 14 wherein said receiving substrate is flexible.

16. A display device as in claim 15 wherein said receiving substrate is a backplane of said display device.

17. A display device as in claim 16 wherein said array of display drivers is further deposited below a surface of said receiving substrate.

18. A display device as in claim 17 wherein said insulation layer further comprises a plurality of vias wherethrough said electrical interconnections occur.

19. A display device as in claim 18 wherein said display drivers interconnect to said bottom conducting layer through said electrical interconnections.

20. An electronic assembly comprising:

at least one object created and separated from a host substrate, said at least one object having a first electrical circuitry therein;

a receiving substrate having at least one recess, said receiving substrate including said at least one recess being covered with a bottom conducting layer;

wherein said at least one object is coupling to said receiving substrate such that said at least one object is deposited on said bottom conducting layer and recessed within said at least one recess of said receiving substrate; and

a top conducting layer to facilitate electrical interconnections from said at least one object to said bottom conducting layer is coupled to said receiving substrate;

wherein said bottom conducting layer is a non-patterned layer such that said bottom conducting layer being a shield that blocks interference to said at least one object.

21. An electronic assembly as in claim 20 wherein said interference comprises at least one of light, contaminants, electrical field coupling, magnetic field coupling, and unwanted interactions.

22. An electronic assembly comprising:

at least one object created and separated from a host substrate, said at least one object having a first electrical circuitry therein;

a receiving substrate having at least one recess, said receiving substrate including said at least one recess being covered with a patterned bottom conducting layer is coupled to said at least one object such that said at least one object is deposited on said patterned bottom conducting layer and recessed within said at least one recess of said receiving substrate; and

a patterned top conducting layer disposed over said receiving substrate such that said patterned top conducting layer and said patterned bottom conducting layer sandwich said at least one object therebetween,

wherein said patterned top conducting layer facilitates a first level of electrical interconnections and wherein said patterned bottom conducting layer facilitates a second level of electrical interconnections.

23. An electronic assembly as in claim 22 wherein said first level of electrical interconnections comprises a first set of interconnections between said at least one object to other objects having electrical circuitries therein, said other objects are created and separated from said host substrate, and coupled to said receiving substrate.

24. An electronic assembly as in claim 22 wherein said second level of electrical interconnections comprises a second set of interconnections between said at least one object to said patterned bottom conducting layer.

25. A method of making an electronic assembly comprising:

creating and separating at least one object from a host substrate, said at least one object having a first electrical circuitry therein;

coupling a bottom conducting layer to a flexible receiving substrate having at least one recess such that said flexible receiving substrate including said at least one recess is coated with said bottom conducting layer;

coupling said at least one object to said receiving substrate such that said at least one object is deposited on said bottom conducting layer and is recessed within said at least one recess of said receiving substrate; and

coupling a top conducting layer to flexible substrate, said top conducting layer to facilitate electrical interconnections from said at least one object to said bottom conducting layer.

26. A method of making an electronic assembly as in claim 25 further comprising:

deposing an insulation layer over said receiving substrate and said at least one object such that said insulation layer insulating said bottom conducting layer and said at least one object, said insulation layer including a plurality of vias through which said electrical interconnections occur.

27. A method of making an electronic assembly as in claim 26 wherein said coupling of said at least one object to said receiving substrate is such that said at least one object is deposited below a surface of said flexible receiving substrate.

28. A method of making an electronic assembly as in claim 27 further comprising:

configuring said conducting layer such that said conducting layer is a patterned layer.

29. A method of making an electronic assembly as in claim 28 further comprising:

configuring said conducting layer drives to be a backplane of a display.

30. A method of making an electronic assembly as in claim 29 further comprising:

configuring said at least one object to be an integrated circuit.

31. A method of making an electronic assembly as in claim 30 further comprising:

configuring said bottom conducting layer to be a reflective material.

32. A method of making an electronic assembly as in claim 31 wherein said bottom conducting layer makes said electrical interconnections through said vias to said at least one object such that said electrical interconnections are only made to a top side of said at least one object.

33. A method of making an electronic assembly as in claim 32 further comprising:

configuring said flexible receiving substrate to be nonconductive.

34. A method of making an electronic assembly comprising:

creating and separating at least one object from a host substrate, said at least one object having a first electrical circuitry therein;

coupling a with a bottom conducting layer to a flexible receiving substrate having at least one recess such that said flexible receiving substrate including said at least one recess is coated with said bottom conducting layer;

coupling said at least one object to said flexible receiving substrate such that said at least one object is deposited on said bottom conducting layer and is recessed within said at least one recess of said flexible receiving substrate; and

coupling a top conducting layer to said flexible receiving substrate such that said top conducting facilitates electrical interconnections from said at least one object;

wherein said bottom conducting layer is an optical reflector.

35. A method of making an electronic assembly as in claim 34 further comprising:

configuring said bottom conducting layer to be a solar cell reflector.

36. A method of making an electronic assembly as in claim 35 further comprising:

choosing an aluminum material for said bottom conducting layer.

37. A method of making a display device comprising:

creating and separating an array of display drivers from a host substrate to drive pixel electrodes, each of said display drivers includes an electrical circuitry therein;

coupling a bottom conducting layer to a receiving substrate having an array of recesses;

coupling each of said display drivers to said receiving substrate such that said display drivers are deposited on said bottom conducting layer and recessed within said recesses;

coating an insulation layer over said receiving substrate such that said insulation layer insulates said bottom conducting layer and said display drivers;

coupling a top conducting layer to said receiving substrate, said top conducting layer facilitates electrical interconnections between said display drivers and said pixel electrodes.

38. A method of making a display device as in claim 37 further comprising:

configuring said array of display drivers to control said display device.

39. A method of making a display device as in claim 38 further comprising:

configuring said receiving substrate to be flexible.

40. A method of making a display device as in claim 39 further comprising:

configuring said receiving substrate to be a backplane of said display device.

41. A method of making a display device as in claim 40 further comprising:

depositing said array of display drivers below a surface of said receiving substrate.

42. A method of making a display device as in claim 41 further comprising:

configuring said insulation layer further to include a plurality of vias wherethrough said electrical interconnections occur.

43. A method of making a display device as in claim 42 further comprising:

interconnecting said display drivers to said bottom conducting layer through said electrical interconnections.

44. A method of making an electronic assembly comprising:

creating and separating at least one object from a host substrate, said at least one object having a first electrical circuitry therein;

coupling a bottom conducting layer to a receiving substrate having at least one recess such that said receiving substrate including said at least one recess is covered with said bottom conducting layer;

coupling said at least one object to said receiving substrate such that said at least one object is deposited on said bottom conducting layer and recessed within said at least one recess of said receiving substrate; and

coupling a top conducting layer to said at least one object such that said top conducting layer facilitate electrical interconnections from said at least one object to said bottom conducting layer;

wherein said bottom conducting layer is a non-patterned layer such that said bottom conducting layer acts as a shield that blocks interference to said at least one object.

45. A method of making an electronic assembly as in claim 44 wherein said interference comprises at least one of light, contaminants, electrical field coupling, magnetic field coupling, and unwanted interactions.

46. A method of making an electronic assembly comprising:

creating and separating at least one object from a host substrate, said at least one object having a first electrical circuitry therein;

coupling a with a patterned bottom conducting layer to a receiving substrate having at least one recess such that said receiving substrate including said at least one recess is coated with said patterned bottom conducting layer;

coupling said at least one object to said receiving substrate such that said at least one object is deposited on said patterned bottom conducting layer and is recessed within said at least one recess of said receiving substrate; and

coupling a patterned top conducting layer to said receiving substrate such that said patterned top conducting layer and said patterned bottom conducting layer sandwich said at least one object therebetween;

wherein said patterned top conducting layer facilitates a first level of electrical interconnections and said patterned bottom conducting layer facilitates a second level of electrical interconnections.

47. A method of making an electronic assembly as in claim 46 wherein said first level of electrical interconnections comprises a first set of interconnections between said at least one object to other objects having electrical circuitries therein, said other objects are created and separated from said host substrate, and coupled to said receiving substrate.

48. A method of making an electronic assembly as in claim 47 wherein said second level of electrical interconnections comprises a second set of interconnections between said at least one object to said patterned bottom conducting layer.

49. An electronic assembly comprising:

at least one object created and separated from a host substrate, said at least one object having a first electrical circuitry therein;

a receiving substrate having at least one recess, said receiving substrate including said at least one recess being covered with a bottom conducting layer;

wherein said at least one object couples to said receiving substrate such that said at least one object is deposited on said bottom conducting layer and is recessed within said at least one recess of said receiving substrate; and

a top conducting layer coupled to at least one of said one object and said bottom conducting layer.

50. An electronic assembly as in claim 49 further comprising an insulation layer disposing over said receiving substrate and said at least one object such that said insulation layer insulating said bottom conducting layer and said at least one object, said insulation layer including a plurality of vias through which electrical interconnections occur.