Methods and apparatus for depositing magnetic films

• US 6,593,150 B2
• Filed: 09/30/2002
• Issued: 07/15/2003
• Est. Priority Date: 08/20/2001
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Ramberg, Randy J., Hurst, Allan T., Jenson, Mark J.
• Primary Examiner(s): GHYKA, ALEXANDER G
• Application Number:
  US10/261,232
• Publication Number:
  US 20030038023A1
• Time in Patent Office: 288 Days
• Field of Search: 118/723.R, 118/723.MP, 438/3, 204/192.11, 204/192.2, 204/298.04
• US Class Current: 438/3
• CPC Class Codes: C23C 14/3442 using an ion beam
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: H01F 41/18 by cathode sputtering

Abstract

Methods and systems are provided for depositing a magnetic film using one or more long throw magnetrons, and in some embodiments, an ion assist source and/or ion beam source. The long throw magnetrons are used to deposit particles at low energy and low pressure, which can be useful when, for example, depositing interfacial layers or the like. An ion assist source can be added to increase the energy of the particles provided by the long throw magnetrons, and/or modify or clean the layers on the surface of the substrate. An ion beam source can also be added to deposit layers at a higher energies and lower pressures to, for example, provide layers with increased crystallinity. By using a long throw magnetron, an ion assist source and/or an ion beam source, magnetic films can be advantageously provided.

Claims

1. An apparatus for depositing one or more layers onto a substrate, the apparatus comprising:

a vacuum chamber, the vacuum chamber having a substrate carrier for carrying the substrate;

a first long throw magnetron having a first magnetron target, the first long throw magnetron spaced from the substrate carrier and adapted to provide ions to the first magnetron target to sputter particles from the first magnetron target to the substrate carrier;

an ion beam source having an ion beam target, the ion beam source adapted to provide ions to the ion beam target to sputter particles from the ion beam target to the substrate carrier; and

a controller for separately activating the long throw magnetron and the ion beam source.

2. An apparatus according to claim 1, further comprising an ion assist source, the ion assist source adapted to provide assist ions to the to the substrate carrier.

3. An apparatus according to claim 2, wherein the controller is adapted to separately activate the ion assist source.

4. An apparatus according to claim 3, further comprising a magnetic field source for applying a setting magnetic field to the substrate carrier.

5. An apparatus according to claim 1, further comprising:

at least one other long throw magnetron, each of the at least one other long throw magnetron has a corresponding magnetron target.

6. An apparatus according to claim 5, wherein the magnetron target of the at least one other long throw magnetron is different from the first magnetron target.

7. An apparatus for forming a magnetic film having one or more layers on a substrate, the apparatus comprising:

a vacuum chamber, the vacuum chamber having the substrate positioned therein; and

a long throw magnetron having a magnetron target, the long throw magnetron positioned in the vacuum chamber and spaced from the substrate, the long throw magnetron adapted to cause particles to be sputtered from the target to the substrate to form at least one layer of the magnetic film.

8. An apparatus according to claim 7, wherein the long throw magnetron produces a high energy plasma, and wherein the substrate is positioned at a sufficient distance from the long throw magnetron to be outside of the high energy plasma.

9. An apparatus according to claim 8, wherein the substrate is positioned at least 7 inches from the long throw magnetron.

10. An apparatus according to claim 8, wherein the substrate is positioned at least 10 inches from the long throw magnetron.

11. An apparatus according to claim 7, further comprising:

means for providing a working gas in the vacuum chamber in the vicinity of the long throw magnetron; and

means for differentially pumping out the working gas from the vacuum chamber such that there is a lower pressure of the working gas at the substrate than in the vicinity of the long throw magnetron.

12. An apparatus according to claim 11 wherein the pressure of the working gas in the vacuum chamber at the substrate is less than 5×

10<sup>−

4</sup> Torr.

13. An apparatus according to claim 12, wherein the pressure of the working gas in the vacuum chamber in the vicinity of the long throw magnetron is greater than 5×

10<sup>−

4</sup> Torr.

14. An apparatus according claim 7 further comprising means for applying a setting magnetic field at the substrate to set the magnetic direction of at least one of the layers of the magnetic film.

15. An apparatus according to claim 7 further comprising an ion assist source positioned in the vacuum chamber, wherein the ion assist source is adapted to provide assist ions to the substrate.

16. An apparatus according to claim 15, wherein the assist ions add energy to the particles that are sputtered from the target of the long throw magnetron.

17. An apparatus according to claim 15 further comprising a controller for activating the ion assist source and the long throw magnetron at the same time.

18. An apparatus according to claim 15, further comprising a controller for activating the ion assist source after the long throw magnetron is activated.

19. An apparatus according to claim 18, wherein controller activates the ion assist source to modify one or more layers deposited by the long throw magnetron.

20. An apparatus according to claim 18 wherein the controller activates the ion assist source to clean one or more layers deposited by the long throw magnetron.

21. An apparatus according to claim 7 further comprising:

an ion beam source and ion beam target, both of which are positioned in the vacuum chamber; and

the ion beam source being adapted to provide ions to the ion beam target to cause particles to be sputtered from the ion beam target to the substrate to form at least one layer of the magnetic film.

22. An apparatus according to claim 21 further comprising a controller for activating the ion beam source after the long throw magnetron is deactivated.

23. An apparatus according to claim 21 further comprising a controller for activating the ion beam source before the long throw magnetron is deactivated.

24. An apparatus according to claim 21 further comprising a controller for activating the ion beam source at the same time as the long throw magnetron is activated.

25. An apparatus according to claim 21 further comprising a controller wherein the ion beam source is activated after the ion assist source is activated.

26. An apparatus according to claim 21 wherein the at least one layer deposited by the long throw magnetron is a metallic layer, and the at least one layer deposited by the ion beam source is a dielectric layer.

27. An apparatus according to claim 26 wherein the metallic layer is a permalloy layer.

28. An apparatus according to claim 21 wherein the at least one layer deposited by the long throw magnetron is a metallic layer, and the at least one layer deposited by the ion beam source is also a metallic layer.

29. An apparatus according to claim 21 wherein the at least one layer deposited by the long throw magnetron is a dielectric layer, and the at least one layer deposited by the ion beam source is also a dielectric layer.

30. An apparatus according to claim 21 wherein the ion beam source is activated after the ion assist source is activated.

31. An apparatus according to claim 21 wherein the ion beam source, the ion assist source, and long throw magnetron are in activation at the same time.

32. An apparatus according to claim 21 wherein the ion beam source is activated after the ion assist source and long throw magnetron are deactivated.

33. An apparatus for forming a film having at least two strata or layers on a substrate, the apparatus comprising:

a vacuum chamber, the vacuum chamber having a substrate positioned therein;

a long throw magnetron positioned in the vacuum chamber having a magnetron target, the long throw magnetron spaced from the substrate carrier and adapted to cause particles to be sputtered from the magnetron target to the substrate to form at least one layer of the film;

an ion beam source positioned in the vacuum chamber having an ion beam source target, the ion beam source spaced from the substrate carrier and adapted to cause particles to be sputtered from the ion beam source target to the substrate to form at least one layer of the film; and

a controller for activating the long throw magnetron to cause particles to be sputtered from a magnetron target to the substrate to form a first layer of the film, deactivating the long throw magnetron, activating the ion beam source to cause particles to be sputtered from a ion beam source target to the substrate to form a second layer of the film, and deactivating the ion beam source.

34. An apparatus according to claim 33, wherein the controller deactivates the long throw magnetron before the ion beam source is activated.

35. An apparatus according to claim 33 wherein the controller deactivates the long throw magnetron after the ion beam source is activated.

36. An apparatus according to claim 33 wherein the particles sputtered from the magnetron target are metallic particles.

37. An apparatus according to claim 36 wherein the particles sputtered from the ion beam source target are dielectric particles.

38. An apparatus according to claim 33 further comprises an ion assist source, and said controller activates the ion assist source while the long throw magnetron is activated to add energy to the particles that are sputtered from the magnetron target by the long throw magnetron.

39. An apparatus according to claim 38 wherein the controller deactivates the long throw magnetron and the ion assist source before the ion beam source is activated.

40. An apparatus for forming a magnetic film having two or more layers on a substrate, comprising:

a vacuum chamber, the vacuum chamber having a substrate positioned therein;

at least two long throw magnetrons positioned in the vacuum chamber each having a different target type; and

a controller for activating a first one of the long throw magnetrons to cause a first type of particles to be sputtered from a first target to the substrate to form at least one layer of the magnetic film, and activating a second one of the long throw magnetrons to cause a second type of particles to be sputtered from a second target to the substrate to form at least one other layer of the magnetic film.

41. An apparatus according to claim 40, further comprising:

an ion beam source having an ion beam target, the ion beam source adapted to cause a third type of particles to be sputtered from the ion beam target to the substrate to form yet another one of the layers of the magnetic film.

42. An apparatus for forming a film having one or more layers on a substrate, comprising:

a vacuum chamber;

a long throw magnetron having a magnetron target positioned in the vacuum chamber;

a substrate carrier positioned in the vacuum chamber for carrying the substrate, wherein the substrate carrier is spaced from the long throw magnetron such that the rate is positioned at least 7 inches from the long throw magnetron.