Low cost MMW transceiver packaging

• US 6,594,479 B2
• Filed: 12/28/2000
• Issued: 07/15/2003
• Est. Priority Date: 12/28/2000
• Status: Active Grant

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Clark, Gavin James, Hubert, John F., Ammar, Danny F., Fischer, Eugene
• Primary Examiner(s): Chin, Vivian
• Assistant Examiner(s): RAMOS FELICIANO, ELISEO
• Application Number:
  US09/749,425
• Publication Number:
  US 20020086655A1
• Time in Patent Office: 929 Days
• Field of Search: 361/715, 361/704, 361/707, 361/710, 361/800, 361/816, 361/818, 361/826, 361/736, 361/752, 361/753, 361/757, 361/759, 361/796, 361/799, 174/50, 174/35.R, 174/50.5, 174/50.52, 174/50.6, 333/246, 333/247, 333/260, 455/90, 455/128, 455/347-351, 455/73, 455/78, 455/82, 455/83, 455/344, 455/556, 455/550, 455/575, 340/697--69, 340/572.8, 340/7.63, 342/175
• US Class Current: 455/347
• CPC Class Codes: H04B 1/03 Constructional details, e.g. casings, housings

Abstract

A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.

Claims

1. A millimeter wave transceiver package comprising:

a housing for RF components, the housing comprising, a plurality of recessed channels and wells disposed on the first planar surface, and a second planar surface having surface feedthroughs;

an electrical housing, the electrical housing comprising a first planar surface adjacent to the second planar surface of the housing for RF components, and having a regulator/controller and through holes corresponding to the feedthroughs of the housing for RF components; and

a surface mount board.

2. The package of claim 1, comprising:

an RF cover, the RF cover disposed at a first edge of a vertical stack of multilayers;

a cover for the electrical housing and the surface mount board positioned at a second edge of the vertical stack; and

an interface unit mounted on the housing for RF components.

3. The package of claim 2, wherein the housing for RF components is positioned as a second layer, with the first planar surface adjacent to the RF cover, the electrical housing is positioned as a third layer, and the surface mount board is positioned as a fourth layer adjacent to the third layer.

4. The package of claim 1, wherein the plurality of channels and wells are interconnected.

5. The package of claim 1, wherein only MMIC chips and connective substrates are disposed in the plurality of channels and wells.

6. The package of claim 1, wherein the housing for RF components is formed of a material selected from the group consisting of Copper Tungsten, Aluminum Silicon Carbide, Aluminum graphite, and Copper Molybdenum.

7. The package of claim 1, wherein the electrical housing is aluminum.

8. The package of claim 1, wherein the RF cover is made from Kovar.

9. The package of claim 1, wherein the RF cover is disposed over and seals the MMIC chips and connective substrates in the interconnected channels and wells.

10. The package of claim 1, wherein the interface unit is a coaxial interface.

11. The package of claim 1, wherein the interface unit is a waveguide interface.

12. The package of claim 1, wherein the regulator/controller is disposed in the electrical housing underneath the housing for RF components.

13. The package of claim 1, wherein glass feedthroughs provide electrical contact between the components disposed on the electrical housing and components disposed on the housing for RF components.

14. A method of making a millimeter wave transceiver assembly comprising the steps of:

forming a monolithic RF housing having a plurality of channels and wells on a first planar surface and DC feedthroughs on a second planar surface;

disposing a plurality of MMIC and connective substrates with epoxy on a gold plated second planar surface of the RF housing;

connecting a plurality of channels and wells to the gold plated second planar surface of the RF housing;

surface mounting a plurality of electronic components on a first planar surface of a electronic housing;

disposing a thermal sheet between the electrical housing and the RF housing;

joining the second planar surface of the RF housing with the first planar surface of the electrical housing such that the DC feedthroughs of the RF housing mate with the corresponding holes in the electrical housing;

disposing a RF cover in the recessed edge on the first planar surface of the RF housing;

disposing a surface mount board in the recessed edge on the second planar surface of the electrical housing;

disposing an electrical housing cover over the surface mount board;

fastening the assembly together; and

connecting an interface to the RF housing.

15. The method of claim 14, wherein the plurality of channels and wells disposed on the first planar surface of the housing for RF components are interconnected.

16. A method of making a millimeter wave transceiver assembly comprising the steps of:

forming a plurality of interconnected channels and wells disposed on the first planar surface of a RF section of a housing for RF components;

forming a plurality of DC feedthroughs on a second planar surface of a flat plate layer of a housing for RF components;

forming a housing for RF components by joining a plurality of individual dies to the plurality of flat plate layer;

disposing a plurality of MMIC and connective substrates and securing the plurality of MMIC and connective substrates with epoxy;

surface mounting a plurality of electronic components on a first planar surface of a electronic housing;

gold plating a first planar surface of the electrical housing;

disposing a thermal sheet between the electrical housing and the RF housing;

joining the second planar surface of the flat plate of the RF housing with the first planar surface of the electrical housing such that the DC feedthroughs of the RF housing mate with the corresponding holes in the electrical housing;

disposing a RF cover in the recessed edge on the first planar surface of the RF housing;

disposing a surface mount board in the recessed edge on the second planar surface of the electrical housing;

disposing an electrical housing cover over the surface mount board;

fastening the assembly together; and

connecting an interface means to the RF housing.

17. The method of claim 16, wherein the individual dies are formed by casting.

18. The method of claim 16, wherein the joining of a plurality of individual dies to a substrate layer is joining by silver-based epoxy.

19. The method of claim 16, wherein the joining of a plurality of individual dies to a flat plate is joining by a method selected from the group consisting of spiral patterns, dot patterns, and screening.