Method of separating a plate-like workpiece held by adhesion on an elastic adsorption pad

• US 6,594,890 B2
• Filed: 08/15/2001
• Issued: 07/22/2003
• Est. Priority Date: 08/29/2000
• Status: Active Grant

• Current Assignee: Disco Corporation
• Original Assignee: Disco Corporation
• Inventors: Takahashi, Toshiaki, Arai, Kazuhisa, Yajima, Kouichi
• Primary Examiner(s): Arbes, Carl J.
• Assistant Examiner(s): Phan, Thiem D
• Application Number:
  US09/928,985
• Publication Number:
  US 20020023340A1
• Time in Patent Office: 706 Days
• Field of Search: 298/30, 298/25, 294/261, 438/463, 438/464, 438/460, 428/343
• US Class Current: 29/830
• CPC Class Codes: B24B 41/061 axially supporting turning workpieces, e.g. magnetically, pneumatically
• CPC Class Codes: B24B 7/228 for grinding thin, brittle parts, e.g. semiconductors, wafers grinding edges of thin, brittle parts B24B9/065
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49815 Disassembling

Abstract

A method of separating a plate-like workpiece held by adhesion on an elastic adhesive pad from the pad. The elastic adhesive pad has innumerable pores in its surface and generates adhesive force when negative pressure is produced by the pores, after being crushed, by restoration force generated by elasticity and adhesion. The method includes the step of heating the elastic adhesive pad at a predetermined temperature to separate the plate-like workpiece from the elastic adhesive pad by air expanding in the pores.

Claims

1. A method of separating a plate-like workpiece held by adhesion on an elastic adhesive pad from the elastic adhesive pad, the elastic adhesive pad having numerous pores in the surface and generating adhesive force when negative pressure is produced by the pores when crushed by restoration force generated by elasticity and adhesion, which method comprises the step of separating the plate-like workpiece from the elastic adhesive pad by air in the pores being expanded by heating the elastic adhesive pad to a predetermined temperature.

2. The method as set forth in claim 1, wherein the elastic adhesive pad is mounted on a substrate and the substrate is placed on a heating table to heat the elastic adhesive pad via the substrate.

3. The method as set forth in claim 1, wherein the elastic adhesive pad is mounted on a substrate and the substrate is provided with a heating element to heat the elastic adsorption pad by heat generated by the heating element.

4. The method as set forth in claim 1, wherein one of a hot gas, hot liquid and infrared radiation is supplied to the elastic adhesive pad to heat the elastic adhesive pad.

5. The method as set forth in claim 1, wherein the heating temperature of the elastic adhesive pad is 40°

C. to 60°

C.

6. The method as set forth in claim 1, wherein the plate-like workpiece is a semiconductor wafer.

7. The method as set forth in claim 1, wherein the plate-like workpiece is a semiconductor chip.